1、BRITISH STANDARD BS CECC 23700-801:1998 Harmonized system of quality assessment for electronic components Capability detail specification: Flex-rigid double-sided printed boards with through connections ICS 31.180BSCECC 23700-801:1998 This British Standard, having been prepared under the directionof
2、 the Electrotechnical Sector Board, was published underthe authority of the Standards Board and comes intoeffect on 15 June 1998 BSI 06-1999 ISBN 0 580 29894 9 National foreword This British Standard is the English language version of CECC 23700-801:1998 published by the European Electronic Componen
3、ts Committee (CECC) of the European Committee for Electrotechnical Standardization (CENELEC). This standard should be read in conjunction with the most recent editions of BS EN 123000 and BS EN 123700. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic a
4、ssembly technology, which has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developm
5、ents and promulgate them in the UK. A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogu
6、e under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their corr
7、ect application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, theCECC title page, pages 2 to 16, an inside back cover and a back cover. This standard has be
8、en updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No. Date CommentsBSCECC23700-801:1998 BSI 06-1999 i Contents Page National foreword Inside front cover Foreword
9、2 Text of CECC 23700-801 3ii blankDETAIL SPECIFICATION SPCIFICATION PARTICULIRE BAUARTSPEZIFIKATION CECC 23 700-801 February 1998 English version Capability Detail Specification: Flex-rigid double-sided printed boards with through connections Spcification particulire dAgrment: Cartes imprimes double
10、 face flexorigides avec connexions transversales Bauartspezifikation zur Anerkennung der Befhigung: Starr-flexible doppelseitige Leiterplatten mit Durchverbindungen This Capability Detail Specification was approved on 1997-08-06. Up-to-date lists and bibliographical references of other detail specif
11、ications relating to EN 123000:1991 and EN 123700:1996 may be obtained on application to the Central Secretariat or to any CENELEC member. This CECC Detail Specification exists in three official versions (English, French, German). A version in any other language made by translation under the respons
12、ibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy
13、, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050
14、 Brussels 1998 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. CECC 23 700-801:1998 ECECC 23700-801:1998 BSI 06-1999 2 Foreword This Capability Detail Specification has been prepared by CENELEC/TC CECC/SC52, Printed Boards (formerly de
15、signated CECC Working Group23). It was approved as CECC23 700-801 on 1997-08-06. It should be read in conjunction with EN123000:1991 and EN123700:1996 and with the current regulations for the CECC System. Contents Page Foreword 2 1 General 3 1.1 Scope 3 1.2 Object 3 2 Capability qualifying component
16、 3 2.1 Materials 3 2.2 Surface finishes 4 2.2.1 Metallic finishes 4 2.2.1.1 Accelerated ageing 4 2.2.2 Organic finishes 4 2.3 Variant designation 5 3 Capability approval 5 3.1 Range of capability approval 5 3.2 QPL information 5 4 Capability test programme 5 4.1 Capability demonstration 5 4.1.1 Othe
17、r metallic surface finishes 5 4.1.2 Organic surface finishes 6 5 Additional capability 6 6 Traceability 6 Annex A Edge connector imperfections 16 Annex B Circumferential defects in plated-through holes Inside back cover Table I Capability approval test schedule 6 Table IIa Additional metallic conduc
18、tor finishes 11 Table IIb Additional contact finishes 13 Table III Permanent organic finishes 14CECC23700-801:1998 BSI 06-1999 3 1 General 1.1 Scope This Capability Detail Specification (CapDS) is based upon EN 123700. It relates to flex-rigid double-sided printed boards with through connections, ma
19、de with materials and surface finishes as specified in clause 2 . 1.2 Object To specify the Capability Qualifying Component (CQC), its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and extended capability. 2 Capabil
20、ity Qualifying Component (CQC) Test boards to be used as CQCs for basic capability shall be made from a combination of the materials specified in 2.1 of this CapDS. The construction shall be as given in 8.3 of EN123700. bear the composite test pattern (CTP) specified in 8.3 of EN123700 (or equivalen
21、t CTP), for basic and other metallic finishes. CTPs as specified in 8.2 of EN123200 (or equivalent CTP) shall be used to demonstrate organic surface finishes and externally bonded heat sinks. have one of the surface finishes specified by groups 11, 12, 13, 14, 15, 16, or 17 in 2.2 of this CapDS. be
22、fabricated using a copper thickness determined by the needs of the process and parameters to be demonstrated (e.g.conductor width and separation). The CQC copper thickness shall be detailed in the capability manual. Requirements for test boards to be used as modified CQCs for the demonstration of ad
23、ditional capability are detailed in clause5 of this CapDS. 2.1 Materials Material group designation Specification Base Material Base material Thickness range Type Grade A EN 60249-2-11 EN 60249-2-12 Epoxide woven glass Epoxide woven glass General purpose Defined flammability 0,05.0,8 mm $ 0,05 mm EN
24、 60249-3-1G EN 60249-3-1GF Prepreg Prepreg General purpose Defined flammability $ 0,05 mm B EN 60249-2-13 EN 60249-3-15 Polyimide film Polyimide film General purpose Defined flammability 12,5 125 4m 12,5 125 4m C EN 60249-2-8 Polyester Film General purpose 12,5 125 4mCECC 23 700-801:1998 4 BSI 06-19
25、99 2.2 Surface finishes 2.2.1 Metallic finishes The demonstration of metallic group finishes 21, 22, 23 or 24 shall be combined with a finish from groups11, 12, 13, 14, 15, 16 or 17. Each claimed combination of metallic finishes shall be tested separately. Selective and non-selective finishes of the
26、 same material, where claimed, shall be demonstrated separately. 2.2.1.1 Accelerated ageing The ability of finish groups 11, 12, 13, 14, 15, 16 or 17 to solder after extended or adverse storage conditions is demonstrated using accelerated ageing. This test shall be carried out on those finishes wher
27、e accelerated ageing is claimed. Each finish that has complied with the requirements of the ageing test is highlighted by the inclusion of an asterisk (*) adjacent to that finish in the manufacturers abstract of capability as published in the QPL. 2.2.2 Organic finishes (where claimed) . Finish grou
28、p Designation Surface finish Abbreviation for QPL Remarks 11 Bare copper Cu 12 Copper with solderable organic protective coating Cu(opc) 13 Copper with oxide Cu(CuO) 14 Tin, Tin-Lead Sn, SnPb 15 Tin-Lead (fused) SnPb(f) 16 Tin-Lead (dipped and levelled) SnPb(dl) selective and non-selective applicati
29、ons to be demonstrated separately where claimed 17 Immersion Gold over Electroless Nickel AuNi(smt) 18 not assigned 19 not assigned 20 not assigned 21 Specimen K 5 4m, gold plated on copper, remainder using finish group 1117 (see below) 5AuCu 22 Specimen K 0,7 4m, gold plated on nickel, remainder us
30、ing finish group 1117 (see below) 0,7AuNi 23 Specimen K 2,5 4m, gold plated on copper, remainder using finish group 1117 (see below) 2,5AuCu 24 Specimen K 2,5 4m, gold plated on nickel, remainder using finish group 1117 (see below) 2,5AuNi Finish group designation Organic finish Abbreviation for QPL
31、 a Adhesive Coated Coverlayer AFC b Dry film solder mask DSM c Wet resist solder mask WSM d Liquid photopolymer solder mask LSM e Marking inks MI f Conductive Ink CICECC23700-801:1998 BSI 06-1999 5 The demonstration of organic finish groups a, b, c, d, e or f shall be over a finish from groups 11, 1
32、2, 13, 14, 15, 16 or 17. All claimed types of solder resist shall be tested separately. 2.3 Variant designation The combination of any material group designated in 2.1 and any of the surface finishes designated in 2.2 constitutes a variant. The variant is designated by the combination of both materi
33、al and finish group designations, e.g. A12(b) or A12/21(c). 3 Capability approval 3.1 Range of capability approval Capability approval granted on the testing of one variant is valid within the limits specified in 3.7 of EN123000 for metal clad base material within one group designation, all base mat
34、erial thicknesses and all foil thicknesses of the material in accordance with 2.1 of this CapDS; and all metallic surface finishes within one surface finish group as given in 2.2.1 of this CapDS, that is 3.2 QPL information Information for the QPL (published as CECC00 200) shall be given in accordan
35、ce with 3.4 of EN123000, and shall contain the following details relative to the CapDS: 4 Capability test programme NOTEIn all cases the number of failures permitted is zero. 4.1 Capability demonstration Capability shall be demonstrated using 9 CTPs of one variant from each material group claimed. T
36、esting shall be in accordance with Table I. 4.1.1 Other metallic surface finishes If claimed, other metallic surface finishes, as designated in 2.2.1 shall be demonstrated by the manufacture and testing of 3 CTPs plus sufficient extra A and H specimens to meet the requirements of Table II. Themaximu
37、m active board size for the finish shall be demonstrated. See also clause 5. finish group 11 covers finish group 11 only finish group 12 covers finish group 11 and 12 finish group 13 covers finish group 11 and 13 finish group 14 covers finish group 11 and 14 finish group 15 covers finish group 11 an
38、d 15 finish group 16 covers finish group 11 and 16 finish group 17 covers finish group 17 only finish group 21 covers finish group 21 only finish group 22 covers finish group 22 and 24 finish group 23 covers finish group 21 and 23 finish group 24 covers finish group 24 only reference to the CECC Gen
39、eric Specification EN 123000 reference to the CECC Sectional Specification EN 123700 reference to the CECC CapDS CECC 23 700-801 base material for which approval is granted as given in 2.1 of this CapDS the surface finishes for which approval is granted as given in 2.2 of this CapDS any additional c
40、apability 3.5.3 of EN123000 refersCECC 23 700-801:1998 6 BSI 06-1999 4.1.2 Organic surface finishes Each claimed organic surface finish, as designated in 2.2.2, shall be demonstrated by the manufacture and testing of 3 CTPs using the pattern specified in Annex A (marking inks) or Annex B (solder mas
41、ks) of CECC23 200-801. Testing shall be in accordance with Table III of this CapDS. 5 Additional capability 6 Traceability Traceability of all specimens to the original product shall be maintained. The method used to identify individual test specimens shall not prejudice the test result. Table I Cap
42、ability approval test schedule Maximum active board size see 8.3 of EN123000 Minimum conductor width andspacing Specimen F of the CTP to be modified to provide additionally 5 conductors and 4 spacings, each of the claimed minimum. Initial foil thickness of less than 35 4m may be used for this demons
43、tration, but the thickness used shall be declared. Metallic conductor finishes Manufacturers are permitted to demonstrate conductor finishes other than those detailed in 2.2.1. The finish shall be demonstrated in accordance with Table IIa and detailed in the manufacturers Capability Manual. Characte
44、ristics Test No. IEC60326-2 Specimen of Composite Test Pattern Requirements Remarks General examination Visual examination Conformity and identification 1 All CQCs Pattern, marking, identification, material and finishes shall comply with this CapDS. There shall be no apparent defects. Any identifica
45、tion for traceability purposes shall be verified. Appearance and workmanship 1a All CQCs The boards shall appear to have been processed in a careful and workmanlike manner, in accordance with good current practice. The base materials, conductors, surface finishes shall be of uniform appearance and f
46、ree from cracks, burns, pits, nodules and blisters. Metallic surface finishes shall be free from scratches which penetrate to an underlying surface. Plated-through holes All CQCs Plated-through holes shall be clean and free from inclusions of any sort that could affect component insertion and solder
47、ability, Total area of the voids shall not exceed 10 % of the total wall area. The largest dimension shall not exceed 25 % of the hole circumference in the horizontal plane and25% of the thickness of the board in the vertical plane. Plated-through holes shall have no plating voids at the interface o
48、f the hole wall and the conductive pattern. The interface shall be considered to extend into the hole below the surface of the board a distance of1,5times the total copper thickness on the surface. 1a There shall be no circumferential cracks of the copper, or circumferential separation of the copper
49、 from the wall of the plated-through hole See Annex B Holes with plating voids shall not exceed 5% of the total number of plated-through holes Board edges All CQCs The edges of the board and internal cut-outs shall be clean cut without tears and nicksCECC23700-801:1998 BSI 06-1999 7 Table I Capability approval test schedule Characteristics Test No. IEC60326-2 Specimen of Composite Test Pattern Requirements Remarks Eyelets All CQCs Eyelets shall be firmly secured. Plated eyelets shall not have exposed bare metal. Eyelets
