1、BRITISH STANDARD BS CECC 265001:1998 Harmonized system of quality assessment for electronic components Technology Approval Schedule: Film and hybrid integrated circuits ICS 31.180BSCECC265001:1998 This BritishStandard, having been prepared under the directionof the Electrotechnical Sector Committee,
2、 was publishedunder the authority ofthe Standards Committee andcomes into effect on 15July1999 BSI 03-2000 ISBN 0 580 30852 9 National foreword This BritishStandard reproduces verbatim CECC265001:1998 and implements it as the UK national standard. This schedule is part of the BSEN165000 series of st
3、andards The UK participation in its preparation was entrusted by Technical Committee EPL/47, Semiconductor devices, to Subcommittee EPL/47/1, Film and hybrid integrated circuits, which has the responsibility to: aid enquirers to understand the text; present to the responsible international/European
4、committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. A list of organizations represented on this subcommittee can be obtained on request to its secretary. Cro
5、ss-references The BritishStandards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electroni
6、c Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This docume
7、nt comprises a front cover, an inside front cover, pagesi andii, theCECC title page, pages2 to30 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued
8、since publication Amd. No. Date CommentsBSCECC265001:1998 BSI 03-2000 i Contents Page National foreword Inside front cover Foreword 2 Text of CECC 265001 50 blankTECHNOLOGY APPROVAL SCHEDULE CECC 265001 September 1998 Technology Approval Schedule: Film and hybrid integrated circuits Up-to-date lists
9、 and bibliographical references of other Technology Approval Schedules may be obtained on application to the Central Secretariat or to any CENELEC member. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Icel
10、and, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de
11、Stassart 35, B-1050 Brussels 1998 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC members Ref.No.CECC265001:1998EBSCECC265001:1998 BSI 03-2000 2 Foreword This Technology Approval Schedule was preparedunder the auspices of CENELEC/TC CECC/SC47AX, Film an
12、d hybridintegrated circuits. The original text was formulated by members of the UK ONS and the current owner of the document is: The Secretary of BSI sub-committee EPL/47/1 who may be contacted at: BritishStandards Institution Electrical, Fire and Health Department 389 Chiswick High Road London W44A
13、L England Tel: 01819969000 It is based, wherever possible, on Publications of theInternational Electrotechnical Commission andInternational Standards Organization, and in particular, on ISO9000. The text of this TAS was circulated to the CECC for acceptance in accordance with clause2.10 of CECC00111
14、-VIII (RP11-8). Contents Page Foreword 2 Introduction 5 1 General 5 1.1 Scope 5 1.2 Related documents 5 1.3 Units, symbols and terminology 6 1.4 Standard and preferred values 6 1.5 Definitions 6 2 Definition of the circuit technology 7 2.1 Scope 7 2.2 Description of activities and flowcharts 8 2.3 T
15、echnical abstract 8 3 Circuit design 9 3.1 Scope 9 3.2 Description of activities and flowcharts 9 3.3 Interfaces 9 4 Film substrate manufacture 9 4.1 Scope 9 4.2 Description of activities and flowcharts 10 4.3 Materials, inspection and handling 10 4.4 Equipment 10 4.5 Rework 10 4.6 Validation and co
16、ntrol of the process(es) 11 4.7 Subcontractors 11 5 Assembly 11 5.1 Scope 11 5.2 Description of activities and flowcharts 11 5.3 Materials, inspection and handling 12 5.4 Equipment 12 5.5 Rework 12 5.6 Validation and control of the process(es) 13 5.7 Subcontractors 13 6 Testing 13 6.1 Scope 13 6.2 D
17、escription of activities and flowcharts 13 6.3 Equipment 13 6.4 Test procedures 14 6.5 Interfaces 14 7 Verification 14 7.1 Process boundary verification 14 7.2 Product verification 15 7.3 Initial demonstration programme 15BSCECC 265001:1998 BSI 03-2000 3 Page 8 Process characterization 16 8.1 Identi
18、fication of process characteristics 16 8.2 Description of activities 16 9 Packaging and shipping 17 9.1 Description of activities and flowcharts 17 9.2 Interfaces 17 9.3 Validity of release 17 10 Withdrawal of technology approval 18 Annex A Example Abstract Description of Technology Approval 26 Anne
19、x B Guidance on the preparation of a manufacturers Technology Approval DeclarationDocument (TADD) for Film andHybridIntegratedCircuits 26 B.1 General 26 B.1.1 Scope 26 B.1.2 Introduction and use 27 B.1.3 Related documents 27 B.2 Contents of the TADD 27 B.2.1 Introductory pages 27 B.2.2 Operational i
20、nfrastructure 27 B.2.3 Description of the Technology and Processes 28 B.2.4 Definitions of relevant sites and operations 28 B.2.5 Process Capability Plan 29 B.2.6 Test vehicles 29 B.2.7 Internal audit programme 29 B.2.8 Demonstration plan 29 B.2.9 Management of non-conforming products or activities
21、29 B.2.10 New product introduction programme 29 B.2.11 Interrelationships with subcontractors 30 B.2.12 Company definitions and symbols 30 B.2.13 List of components covered by Technology Approval 30 Figure 1 Example flowchart Administration 19 Figure 2 Example flowchart Design 20 Figure 3 Example fl
22、owchart Film substratemanufacture 21 Figure 4 Example flowchart Screen manufacture 22 Figure 5 Example flowchart Component/package assembly 23 Figure 6 Example flowchart Hybrid test 24 Figure 7 Example flowchart Packing and shipping 254 blankBSCECC265001:1998 BSI 03-2000 5 Introduction The requireme
23、nts for Technology Approval of manufacturers of electronic and electromechanical components are given in RP14-VI. The procedures for approval defined in that RP require the manufacturer to have available an appropriate Technology Approval Schedule (TAS). This schedule defines how the principles and
24、requirements of RP14-VI are applied to Film and Hybrid Integrated Circuits It is intended for film and hybrid integrated circuit manufacturers who can demonstrate continuous process control, usually by statistical means, and continuous quality improvement. It is therefore best suited to the high vol
25、ume, low complexity manufacturer. For low volume, high complexity custom hybrid manufacturers the Capability Approval procedures as defined in EN165000-1 are more suited. It is recognized that the technologies covered by this TAS are broad and diverse. Each manufacturer may have his own methods of s
26、atisfying the contents of this specification. The sections identified shall be considered when forming the Description of Technology in the Technology Approval Declaration Document (TADD refer to Annex B). Other documentation may be referred to and made available to cover the requirements of this TA
27、S. 1 General 1.1 Scope This TAS specifies the terms, definitions, symbols, quality system, test, assessment and verification methods and other requirements relevant to the design, manufacture and supply of Film potting; dip-coating; transfer moulding. 1) available from CENELEC/CS in Brussels a) dime
28、nsions : IEC191-2 b) temperatures: 65, 55, 40, 25, 10, 0, +5, +25, +40, +55, +70, +85, +100, +125, +150 C.BSCECC265001:1998 BSI 03-2000 7 film integrated circuit an integrated circuit whose circuit and elements, including the interconnections, are film elements formed on the surface of an insulating
29、 substrate hybrid film integrated circuit a film integrated circuit in which the main part of the circuit elements are produced in-situ as film circuit elements on a substrate, and which is completed by added components mounted on the substrate or elsewhere in the package measurement uncertainty a s
30、tatement of the limits of the range within which the true value of the measurement is expected to lie in relation to the recorded result, with a defined confidence level multilayer film circuit a circuit of more than one layer of film interconnection, separated by at least one insulating film or gap
31、 part-finished a qualifying term for a film integrated circuit or hybrid film integrated circuit taken uncompleted from a production line. It cannot be completely assessed to the specification applicable in its normal finished state package total or partial envelope of an integrated circuit which pr
32、ovides: mechanical protection; environmental protection; outline dimensions. the package may also contain or provide terminals and contribute to the thermal characteristics of the integrated circuit process test vehicle (PTV) a device or test structure used to verify, analyze or monitor processes or
33、 electrical/physical attributes product assessment level schedules (PALS) define the minimum circuit process and test requirements for the different market sectors/operating environments qualification circuit (QC) a circuit which is representative of circuits manufactured to declared and identical p
34、rocesses and used for approval tests to one of the Product Assessment Level Schedules (PALS) screening examination or testing applied to all products in a lot for the purpose of detecting and removing potential failures 2 Definition of the circuit technology 2.1 Scope Film and hybrid integrated circ
35、uits may be considered to belong to two principal technology types/build standards: i) devices containing solder-attached and/or chip-and-wire components which are unencapsulated or non-hermetically encapsulated; ii) devices which are hermetically sealed or contain components that are individually h
36、ermetically sealed. There are eleven Product Assessment Level Schedules (PALS) applicable to film film screen manufacture; substrate fabrication, circuit types; assembly areas; test areas; packaging and shipment. An example of a flowchart for administration from placing an order to dispatch of the e
37、nd product is given in Figure 1. 2.3 Technical abstract The manufacturer shall produce an Abstract Description of Technology, on a single A4 sheet, for publication in CECC00200. The manufacturer shall provide the ONS with a draft Abstract Description of Technology. This may be supplied as a separate
38、 controlled document or included in the TADD (seeB.2.3). The description shall be based on the following: a) company name; b) type of technology; c) approved processes; d) subcontracted processes; e) packaging/encapsulation methods; f) PALS number; g) maximum physical size; h) Control Site address (
39、including telephone numbers); i) commercial contact (telephone number). An example is given in Annex A. * Design of circuit layout and packaging; Artwork and Screen fabrication; Substrate scribe/substrate profiling or drilling; * Production of the circuit pattern on the base substrate; Trimming of resistors; * Assembly of added-components; * Packaging/encapsulation of circuit; * Electrical Test; Mechanical/Environmental Test; Packing and shipping.
