1、BRITISH STANDARD BS CECC 90300:1988 Incorporating Amendment No. 1 Harmonized system of quality assessment for electronic components Sectional specification: Interface monolithic integrated circuits UDC 621.3.049.774BSCECC 90300:1988 This British Standard, having been prepared under the directionof t
2、he Electronic Components Standards Committee, was published underthe authority of the BoardofBSI and comes intoeffecton 30June1988 BSI11-1999 First published August1985 First revision June1988 The following BSI references relate to the work on this standard: Committee reference ECL/17 Draft announce
3、d in BSI News October1987 ISBN 0 580 16472 1 Committees responsible for this British Standard The preparation of this British Standard was entrusted by the Electronic Components Standards Committee (ECL/-) to Technical Committee ECL/17upon which the following bodies were represented: British Broadca
4、sting Corporation British Telecommunications plc British Equipment Trade Association Electronic Components Industry Federation Electronic Engineering Association National Supervising Inspectorate Society of British Aerospace Companies Limited Telecommunication Engineering and Manufacturing Associati
5、on (TEMA) Amendments issued since publication Amd. No. Date of issue Comments 8294 August 1994 Indicated by a sideline in the marginBSCECC 90300:1988 BSI 11-1999 i Contents Page Committees responsible Inside front cover National foreword ii Foreword iii Text of CECC 90300 1 Publications referred to
6、Inside back coverBSCECC 90300:1988 ii BSI 11-1999 National foreword This British Standard has been prepared under the direction of the Electronic Components Standards Committee. It is identical with CENELEC Electronic Components Committee (CECC) 90300:1987 “Harmonized system of quality assessment fo
7、r electronic components. Sectional specification: Interface monolithic integrated circuits” as amended by Amendment No. 1published in1994. It supersedes BS CECC90300:1985, which is withdrawn. It should be noted that the withdrawal of BS CECC90300:1985 does not affect the validity of approvals which
8、make reference to that standard. This standard gives the terminology, quality assessment procedures, test and measurement procedures applicable to the sub-family of interface monolithic integrated circuits. It also includes the common blank detail specification for interface monolithic integrated ci
9、rcuits. This standard is a harmonized specification within the CECC system and should be read in conjunction with BS CECC90000. This standard specifies the use of substances and/or test procedures that may be injurious to health if adequate precautions are not taken. It refers only to technical suit
10、ability and in no way absolves either the supplier or the user from statutory obligations relating to health and safety at any stage of manufacture or use. The British Standards Institutions prescribed layout for a harmonized detail specification will in due course be incorporated in the revised BS9
11、000-1:1981, by amendment. This second issue of BS CECC90300results from amendments and additions which have been agreed since the first issue was published in1985. Terminology and conventions. The text of the CECC specification has been approved as suitable for publication as a British Standard with
12、out deviation. Some terminology and certain conventions are not identical with those used in British Standards; attention is drawn especially to the following. The comma has been used as a decimal marker. In British Standards it is current practice to use a full point on the baseline as the decimal
13、marker. Cross-references International Standard Corresponding British Standard IEC68-2-30:1980 BS2011 Basic environmental testing procedures Part2.1Db:1981 Test Db and guidance. Damp heat cyclic (12 + 12hour cycle) (Identical) IEC148:1969 BS3363:1980 Specification for letter symbols for semiconducto
14、r devices and integrated microcircuits (Identical) IEC617-12:1983 BS3939 Guide for graphical symbols for electrical power, telecommunications and electronics diagrams Part12:1985 Binary logic elements (Identical) IEC747-1:1983 BS6493 Semiconductor devices: discrete devices and integrated circuits Pa
15、rt1 Discrete devices Section1.1:1984 General (Identical)BSCECC 90300:1988 BSI 11-1999 iii A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not o
16、f itself confer immunity from legal obligations. International Standard Corresponding British Standard IEC747-10:1984 BS9970 Harmonized system of quality assessment for electronic components. Semiconductor devices Part0:1985 Generic specification (Identical) BS6493 Semiconductor devices: discrete de
17、vices and integrated circuits Part2 Integrated circuits IEC748-1:1984 Section2.1:1985 General (Identical) IEC748-2:1985 Section2.2:1986 Recommendations for digital integrated circuits (Identical) IEC748-3:1986 Section2.3:1987 Recommendations for analogue integrated circuits (Identical) CECC90000:198
18、5 BS CECC90000:1985 Harmonized system of quality assessment for electronic components. Generic specification: Monolithic integrated circuits (Identical) CECC90100:1986 BS CECC90100:1986 Harmonized system of quality assessment for electronic components. Sectional specification: Digital monolithic int
19、egrated circuits (Identical) CECC90200:1983 BS CECC90200:1983 Harmonized system of quality assessment for electronic components. Sectional specification: Analogue integrated circuits (Identical) IEC748-4 “Interface integrated circuits”, to which reference is made in the text, has not yet been publis
20、hed. Summary of pages This document comprises a front cover, an inside front cover, pages i to iv, theCECCtitle page, pages ii to iv, pages1to14, an inside back cover and abackcover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated
21、in the amendment table on the inside front cover.iv blankBS CECC 90300:1988 ii BSI 11-1999 Contents Page Foreword iii 1 Scope 1 2 General 1 2.1 Related documents 1 2.2 Preferred voltages for interface monolithic integrated circuits 1 2.3 Symbols and terminology 1 3 Quality assessment procedures 2 3.
22、1 Structurally similar circuits 2 3.2 Certified test records 2 4 Test and measurement procedures 2 4.1 Electrical measurement procedures 2 4.1.1 Measuring methods common to digital circuits 3 4.1.2 Measuring methods common to analogue circuits 4 4.1.3 Specific methods for interface circuits 5 4.2 En
23、durance tests 5 5 Common blank detail specification for interface monolithic integratedcircuits 5 5.1 Introduction 5 5.2 Front page 6 5.3 Identification of the component and supplementary information 8 5.4 Ratings (limiting values) (not for inspection purposes) 8 5.5 Recommended conditions for use a
24、nd associated characteristics (not for inspection purposes) 8 5.6 Supplementary information 9 Annex A Additional measuring methods 10 Figure 1 2BS CECC 90300:1988 BSI 11-1999 iii Foreword The CENELEC Electronic Components Committee (CECC) is composed of those member countries of the European Committ
25、ee for Electrotechnical Standardization (CENELEC) who wish to take part in a harmonized System for electronic components of assessed quality. The object of the System is to facilitate international trade by the harmonization of the specifications and quality assessment procedures for electronic comp
26、onents, and by the grant of an internationally recognized Mark, or Certificate, of Conformity. The components produced under the System are thereby accepted by all member countries without further testing. This specification has been formally approved by the CECC, and has been prepared for those cou
27、ntries taking part in the System who wish to issue national harmonized specifications for INTERFACE MONOLITHIC INTEGRATED CIRCUITS. It should be read in conjunction with the current regulations for the CECC System. At the date of printing of this specification the member countries of the CECC are Au
28、stria, Belgium, Denmark, Finland, France, Germany, Ireland, Italy, theNetherlands, Norway, Portugal, Spain, Sweden, Switzerland, and the UnitedKingdom. Preface This sectional specification (SS) was prepared by CECC WG9 “Integrated circuits”. It is based, wherever possible, on the Publications of the
29、 International Electrotechnical Commission and in particular on IEC747: Semiconductor devices: Discrete devices and integrated circuits, IEC748: Semiconductor devices: Integrated circuits, IEC749: Semiconductor devices: Mechanical and climatic test methods. The text of this second Issue consists of
30、the text of CECC90300Issue1(1985) amended in accordance with the ratified new material introduced by the following document. In accordance with the decision of the CECC Management Committee this specification is published initially in French and English. The German text will follow as soon as it has
31、 been prepared. Effective Date This second Issue shall become effective for all new qualification approvals from15June1987. Issue1will remain valid for existing qualification approvals until further notice, but it is recommended that current qualifications should be modified in accordance with Issue
32、2during a transition period of2years. Document Date of Voting Report on the voting CECC (Secretariat) 1948 September1986 CECC (Secretariat) 2009iv blankBSCECC 90300:1988 BSI 11-1999 1 1 Scope This specification applies to interface monolithic integrated circuits examples of which are listed in 4.1 a
33、nd shall be read in conjunction with CECC90000. It defines: electrical measurement methods electrical endurance tests. The common blank detail specification (BDS), contained in this SS, comprises those requirements which are common for all interface circuits. 2 General 2.1 Related documents In each
34、case the latest issue of the documents prior to the date of issue of this document is valid. IEC148, Letter symbols for semiconductor devices and integrated microcircuits. (Chapter XI). IEC617, Graphical symbols for diagrams. IEC617-12, Part 12: Binary logic elements. IEC617-13, Part 13: Analogue el
35、ements. IEC747, Semiconductor devices Discrete devices and integrated circuits. IEC747-1, Part 1: General. IEC747-10, Part 10: Generic specification for discrete devices and integrated circuits. IEC748, Semiconductor devices Integrated circuits. IEC748-1, Part 1: General. IEC748-2, Part 2: Digital i
36、ntegrated circuits. IEC748-3, Part 3: Analogue integrated circuits. IEC748-4, Part 4: Interface integrated circuits. CECC90000, GS: Monolithic integrated circuits. CECC90100, SS: Digital monolithic integrated circuits. CECC90200, SS: Analogue monolithic integrated circuits. 2.2 Preferred voltages fo
37、r interface monolithic integrated circuits Preferred values are given in IEC748-1:Chapter VI, sub-clause 6.1 b) for analogue part of the device. Preferred values are given in sub-clause 2.2 of 90100for digital part of the device. 2.3 Symbols and terminology 2.3.1 Letter symbols The letter symbols sh
38、all be used in accordance with IEC148, Chapter X and XI. To indicate a defined value of an electrical quantity denoted by a basic letter, the following system shall be used: A for the most positive (least negative) value of the range. B for the least positive (most negative) value of the range.BSCEC
39、C 90300:1988 2 BSI 11-1999 Examples (see Figure 1). 2.3.2 Graphical symbols Graphical symbols shall be used in accordance with IEC617-12and IEC617-13. 2.3.3 Terminology For terminology, IEC748-1 shall be used, and in particular Chapter IV. 3 Quality assessment procedures 3.1 Structurally similar cir
40、cuits (see 3.2 of CECC 90000) 3.2 Certified test records Certified test records shall give the following information, unless otherwise specified: attributes information for tests in Sub-Groups: B2, B3, B4, B5, C3, C4, C5, C6, C7, C8, C9, C10; measurement information before and after endurance test:
41、C8and D1. 4 Test and measurement procedures 4.1 Electrical measurement procedures (see 4.1 and 4.5 of CECC 90000) The procedures apply to line transmitters, line receivers, sense amplifiers, peripheral drivers and level shifters, voltage comparators. Figure 1 BSCECC 90300:1988 BSI 11-1999 3 4.1.1 Me
42、asuring methods common to digital circuits (1) IEC methods: The hereafter listed electrical measuring methods, with reference to the relevant IEC documents, shall be used when required by the relevant DS and as prescribed in this document: (2) CECC Methods: The hereafter listed electrical measuring
43、methods, with reference to the relevant CECC documents, shall be used when required by the relevant DS and as prescribed in this document: Method Reference number Parameters IEC748-2 Chapter IV Section3 Designation Symbol Clause n Method n D-01 Total current drawn from the power suppliesunder dynami
44、c conditions 1 1 D-02 Power supplied through the clock line 2 2 D-03 Input and output impedances: Current measurements: input and output capacitances for large signal operation 3.1 6 D-04 Input and output impedances: Voltage measurement: equivalent input and output capacitances, equivalent input and
45、 output resistances: 3.2 11 Large signal method 3.2.1 Bridge method (small signal) 3.2.2 D-05 Propagation times: Bipolar circuits (active load networks) t P 4.1.1 3 D-06 Propagation times: MOS circuits (passive load networks) t P 4.1.2 7 D-07 Delay and transition times: Bipolar circuits t D , t T 4.
46、2.1 4, 5 D-08 Transition times: MOS circuits t T 4.2.2 5 D-09 Set up and hold times t su , t h 4.3 8, 9 D-10 Resolution time t res 4.4 36 D-11 Switching frequency of a sequential circuit 5 10 Chapter IV Section2 D-12 Static characteristics: Output voltages 1 37 D-13 Static characteristics: Input cur
47、rents 2 38 Method Reference number Parameters CECC90100 Designation Symbol Sub-clause Method D-14 Propagation time: Bipolar circuits (passive load network) t P 4.1.3 2) 1 D-15 Output short circuit current I OS 4.1.4 D-16 Breakdown voltage V (BR) 4.1.5 A, B D-17 Transient energy rating 4.1.9BSCECC 90
48、300:1988 4 BSI 11-1999 4.1.2 Measuring methods common to analogue circuits (1) IEC methods: The hereafter listed electrical measuring methods, with reference to the relevant IEC documents, shall be used when required by the relevant DS and as prescribed in this document: (2) CECC methods The hereaft
49、er listed electrical measuring methods, with reference to the relevant CECC document, shall be used when required by the relevant DS and as prescribed in this document: Method Reference number Parameters IEC748-3 Chapter IV Section2 Designation Symbol Clause n Method n A-01 Power supply currents I S 2 22 A-02 Small signal input impedance Z i 3 23 A-03 Output impedance Z o 4 24 A-04 Input offset voltage of a differential input integrated linear amplifier and Bias voltage of a single-ended input integrated linear amplifier V IO 5 25, 26 V IB A-05 Input
