1、DRAFT FOR DEVELOPMENT DD IEC TS 61334-5-4:2001 Distribution automation using distribution line carrier systems Part 5-4: Lower layer profiles Multi-carrier modulation (MCM) profile ICS 33.200 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWDD IEC TS 61334-5-4:2001 This Draft fo
2、r Development, having been prepared under the direction of the Electrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 25 April 2002 BSI 25 April 2002 ISBN 0 580 39598 7 National foreword This Draft for Development re
3、produces verbatim IEC TS 61334-5-4:2001. This publication is not to be regarded as a British Standard. It is being issued in the Draft for Development series of publications and is of a provisional nature because the source document is an IEC Technical Specification which is not an international sta
4、ndard. It should be applied on this provisional basis, so that information and experience of its practical application may be obtained. Comments arising from the use of this Draft for Development are requested so that UK experience can be reported to the international organization responsible for it
5、s conversion into an international standard. A review of this publication will be initiated 2 years after its publication by the international organization so that a decision can be taken on its status at the end of its three-year life. The commencement of the review period will be notified by an an
6、nouncement in Update Standards. According to the replies received by the end of the review period, the responsible BSI Committee will decide whether to support the conversion into an international standard. Comments should be sent in writing to the Secretary of BSI Technical Committee PEL/57, Power
7、system control and associated communications, at 389 Chiswick High Road, London W4 4AL, giving the document reference and clause number and proposing, where possible, an appropriate revision of the text. A list of organizations represented on this committee can be obtained on request to its secretar
8、y. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards El
9、ectronic Catalogue. Summary of pages This document comprises a front cover, an inside front cover, the IEC TS title page, pages 2 to 37 and a back cover. The BSI copyright date displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. Date C
10、ommentsTECHNICAL SPECIFICATION IECTS 61334-5-4 First edition 2001-06 Distribution automation using distribution line carrier systems Part 5-4: Lower layer profiles Multi-carrier modulation (MCM) profile Reference number IEC/TS 61334-5-4:2001(E) 1002:4543316STCEIDDDDIECTS6133454:2001CONTENTS FOREWORD
11、 4 1 Scope and object. 6 2 Normative references. 6 3 Definitions and abbreviations. 6 3.1 Definitions 6 3.2 Abbreviations 7 4 Lower layer profile structure. 8 4.1 Physical layer . 8 4.2 MAC sublayer . 9 5 Physical layer specification 9 5.1 Modulation 9 5.1.1 Purpose 9 5.1.2 The multicarrier modulati
12、on (MCM) principle. 9 5.2 Physical layer data format .10 5.2.1 Purpose.10 5.2.2 Transmission method, overview .10 5.2.3 Configuration parameters.11 5.2.4 PHY PDU format, CRC encoding and padding .12 5.2.5 Convolutional encoding13 5.2.6 Segmentation and interleaving.14 5.2.7 Preamble .14 5.2.8 Modula
13、tion.14 5.3 PHY services.15 5.3.1 PHY to MAC interface15 6 MAC sublayer protocol specification .17 6.1 Overview .17 6.1.1 MAC communication network architecture17 6.1.2 Features of the MAC sublayer17 6.2 Transmission procedures.17 6.3 MAC services 18 6.3.1 MAC to LLC interface.18 6.3.2 MAC layer man
14、agement interface 20 6.4 MAC PDU format .22 6.4.1 MAC control field .22 6.4.2 Address field23 6.4.3 LLC PDU .23 6.5 MAC addresses .24 6.6 Used MAC PDUs .25 6.6.1 Information PDU 25 6.6.2 Repetition control PDU 25 6.7 MAC invalid PDU.25 6.8 MAC procedures25 6.8.1 MACphy procedures 26 6.8.2 MACrore pr
15、ocedures26 DDIECTS6133454:2001 2002lirpA52ISB 2 DDIECTS6133454:2001 BSI25April2002 26.9 MAC timer values 30 6.10 MAC state transition diagrams/tables.30 6.10.1 Startup.30 6.10.2 MAC sublayer 31 6.10.3 Non-initiator MAC sublayer 34 Figure 1 Layered architecture of the DLC-M protocol stack . 8 Figure
16、2 Sample frequency representation of multicarrier modulation 9 Figure 3 Transmitter data flow diagram (one telegram).11 Figure 4 Block diagram of encoder.13 Figure 5 MAC transmission using MAC service class 0 (postponed confirmation).18 Figure 6 MAC transmission using MAC service class 1 or 2 (round
17、-trip delayed confirmation).18 Figure 7 Example for transmission of a MAC PDU with 1 repetition using MAC service class 1 or 2 .27 Figure 8 Time-sequence chart for (error-free) routing repeater procedure 28 Figure 9 MAC startup state diagram .30 Figure 10 Initiator MAC state diagram 31 Figure 11 Non
18、-initiator MAC state diagram.34 Table 1 MAC domain IDs24 Table 2 MAC node IDs .24 Table 3 MAC predefined addresses24 Table 4 Mapping to IEC 61334-4-1 predefined MAC addresses25 Table 5 MAC startup state table .31 Table 6 MAC startup state description31 Table 7 Initiator MAC state table 32 Table 8 In
19、itiator MAC state description.32 Table 9 Initiator MAC procedures .33 Table 10 Initiator MAC variables 33 Table 11 Initiator MAC conditions.33 Table 12 Non-initiator MAC state table.34 Table 13 Non-initiator MAC state description36 Table 14 Non-initiator MAC procedures36 Table 15 Non-initiator MAC v
20、ariables .37 Table 16 Non-initiator MAC conditions .37 1002:4543316STCEIDD 2002lirpA52ISB 3 DDIECTS6133454:2001 BSI25April2002 3INTERNATIONAL ELECTROTECHNICAL COMMISSION _ DISTRIBUTION AUTOMATION USING DISTRIBUTION LINE CARRIER SYSTEMS Part 5-4: Lower layer profiles Multi-carrier modulation (MCM) pr
21、ofile FOREWORD 1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-operation on all questions concerning standardizat
22、ion in the electrical and electronic fields. To this end and in addition to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. I
23、nternational, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2)
24、 The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested National Committees. 3) The documents produced have the form of rec
25、ommendations for international use and are published in the form of standards, technical specifications, technical reports or guides and they are accepted by the National Committees in that sense. 4) In order to promote international unification, IEC National Committees undertake to apply IEC Intern
26、ational Standards transparently to the maximum extent possible in their national and regional standards. Any divergence between the IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter. 5) The IEC provides no marking procedure to indicate its appr
27、oval and cannot be rendered responsible for any equipment declared to be in conformity with one of its standards. 6) Attention is drawn to the possibility that some of the elements of this technical specification may be the subject of patent rights. The IEC shall not be held responsible for identify
28、ing any or all such patent rights. The main task of IEC technical committees is to prepare International Standards. In exceptional circumstances, a technical committee may propose the publication of a technical specification when the required support cannot be obtained for the publication of an Inte
29、rnational Standard, despite repeated efforts, or The subject is still under technical development or where, for any other reason, there is the future but no immediate possibility of an agreement on an International Standard. IEC 61334-5-4, which is a technical specification, has been prepared by IEC
30、 technical committee 57: Power system control and associated communications. The text of this technical specification is based on the following documents: Enquiry draft Report on voting 57/479/CDV 57/517/RVC Full information on the voting for the approval of this technical specification can be found
31、 in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 3. A bilingual version of this publication may be issued at a later date. 1002:4543316STCEIDD 2002lirpA52ISB 4 DDIECTS6133454:2001 BSI25April2002 4The committee ha
32、s decided that the contents of this publication will remain unchanged until 2004. At this date, the publication will be transformed into an International Standard; reconfirmed; withdrawn; replaced by a revised edition, or amended. 1002:4543316STCEIDD 2002lirpA52ISB 5 DDIECTS6133454:2001 BSI25April20
33、02 5DISTRIBUTION AUTOMATION USING DISTRIBUTION LINE CARRIER SYSTEMS Part 5-4: Lower layer profiles Multi-carrier modulation (MCM) profile 1 Scope and object This technical specification describes the requirements of the multicarrier modulation (MCM) approach which incorporates the services provided
34、by the physical layer entity and the MAC sublayer with the purpose of building up a set of standards for effective communication on MV and LV network for distribution line carrier (DLC) systems, in the context of IEC 61334-1-1. Different technical approaches in developing communication systems for D
35、LC communication are in progress. As a consequence, at present, different lower layer profiles are feasible with acceptable results in terms of performance and cost-effectiveness. In many cases, the differences amongst solutions are minor and it is possible to find a common root. 2 Normative referen
36、ces The following normative documents contain provisions which, through reference in this text, constitute provisions of this part of IEC 61334. For dated references, subsequent amendments to, or revisions of, any of these publications do not apply. However, parties to agreements based on this part
37、of IEC 61334 are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. For undated references, the latest edition of the normative document referred to applies. Members of IEC and ISO maintain registers of currently valid Internati
38、onal Standards. IEC 61334-1-1, Distribution automation using distribution line carrier systems Part 1: General considerations Section 1: Distribution automation system architecture IEC 61334-3-1, Distribution automation using distribution line carrier systems Part 3-1: Mains signalling requirements
39、Frequency bands and output levels IEC 61334-4-1, Distribution automation using distribution line carrier systems Part 4: Data communication protocols Section 1: Reference model of the communication system 3 Definitions and abbreviations 3.1 Definitions For the purpose of this part of IEC 61334, the
40、following definitions apply. 3.1.1 control direction communication direction from the central system to a field device 3.1.2 domain logical section of a DLC communication network 1002:4543316STCEIDD 2002lirpA52ISB 6 DDIECTS6133454:2001 BSI25April2002 63.1.3 hops number of routing repetitions require
41、d for communication between the master and a specific station 3.1.4 initiator a station that controls medium access for one domain. The master station may delegate its initiatorship for a limited time to one of the slave stations registered in its domain NOTE Being an initiator is a dynamic property
42、 of a station. 3.1.5 initiator PDU a PDU that is sent from an initiator to a non-initiator, possibly using routing repeaters for multi-hop communication 3.1.6 master station station that works as communication master for a domain NOTE Being a master station is a static property of a station. 3.1.7 m
43、onitoring direction communication direction from a field device to the central system 3.1.8 non-initiator a station that is not in the initiator role NOTE Being a non-initiator is a dynamic property of a station. 3.1.9 non-initiator PDU a PDU that is sent from a non-initiator to an initiator, possib
44、ly using routing repeaters for multi-hop transmission NOTE Non-initiator PDUs are only sent in reaction to initiator PDUs. 3.1.10 routing repetition re-sending a PDU with a modified address field because the destination station cannot communicate directly with the source station. The routing repetit
45、ion procedure does not involve a network layer but is located in the MAC sublayer instead. A synonymous for routing repetitions is forwarding in the mobile communications context 3.1.11 slave station station that works as a communication slave within a domain. It normally operates as non- initiator,
46、 but may be switched to operate as initiator NOTE Being a slave station is a static property of a station. 3.2 Abbreviations DLC Distribution line carrier DMT Discret multitone HV High voltage LLC Logical link control 1002:4543316STCEIDD 2002lirpA52ISB 7 DDIECTS6133454:2001 BSI25April2002 7LMI Layer
47、 management interface LV Low voltage M_SDU MAC layer service data unit MCM Multicarrier modulation MIB Management information base MV Medium voltage OFDM Orthogonal frequency division multiplex P_SDU Physical layer service data unit PDU Protocol data unit SDU Service data unit SMAP System management
48、 application process 4 Lower layer profile structure The MCM lower layer profile exhibits the structure shown in the following figure. This technical specification describes the function of the physical layer and the MAC sublayer. LLC SMAP MIB MACrore LMI MACphy PHY Analog signal processing and coup
49、ling device LLC MAC Physical layer Data link layer Figure 1 Layered architecture of the DLC-M protocol stack 4.1 Physical layer The physical layer provides services to the MAC sublayer to transfer a MAC protocol data unit to a remote MAC sublayer entity. It is independent of the physical characteristics and the implementation of the mains attachment unit.
