1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationMechanical structures for electronic equipment Thermalmanagement for cabinets inaccordance with IEC 60297 andIEC 60917 series Part 3: Design guide: Evaluation method for thermoel
2、ectrical cooling systems (Peltier effect)DD IEC/TS 62610-3:2009National forewordThis Draft for Development is the UK implementation of IEC/TS 62610-3:2009.This publication is not to be regarded as a British Standard.It is being issued in the Draft for Development series of publications and is ofa pr
3、ovisional nature. It should be applied on this provisional basis, so thatinformation and experience of its practical application can be obtained.Comments arising from the use of this Draft for Development are requestedso that UK experience can be reported to the international organizationresponsible
4、 for its conversion to an international standard. A review of thispublication will be initiated not later than three years after its publication bythe international organization so that a decision can be taken on its status.Notification of the start of the review period will be made in an announce-m
5、ent in the appropriate issue of Update Standards.According to the replies received by the end of the review period, the responsible BSI Committee will decide whether to support the conversion intoan international Standard, to extend the life of the Technical Specification orto withdraw it. Comments
6、should be sent to the Secretary of the responsibleBSI Technical Committee at British Standards House, 389 Chiswick High Road,London W4 4AL.The UK participation in its preparation was entrusted to Technical CommitteeEPL/48, Electromechanical components and mechanical structures for electronic equipme
7、nt.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions of acontract. Users are responsible for its correct application. BSI 2010ISBN 978 0 580 67584 3ICS 31.240Compliance with a Bri
8、tish Standard cannot confer immunity fromlegal obligations.This Draft for Development was published under the authority of theStandards Policy and Strategy Committee on 28 February 2010Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDDD IEC/TS 62610-3:2009IEC/TS 62610-3E
9、dition 1.0 2009-12TECHNICAL SPECIFICATIONMechanical structures for electronic equipment Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Part 3: Design guide: Evaluation method for thermoelectrical cooling systems (Peltier effect) INTERNATIONAL ELECTROTECHNICAL COMMI
10、SSION UICS 31.240 PRICE CODEISBN 2-8318-1071-6 Registered trademark of the International Electrotechnical Commission colourinsideDD IEC/TS 62610-3:2009 2 TS 62610-3 IEC:2009(E) CONTENTS FOREWORD.0H3 INTRODUCTION.1H5 1 Scope and object2H6 2 Normative references .3H6 3 Abbreviations, symbols and indic
11、es 4H6 3.1 Abbreviations 5H6 3.2 Symbols 6H7 3.3 Indices 7H7 4 Theory of the thermoelectrical cooling system 8H7 4.1 The Peltier element .9H7 4.2 Thermoelectrical cooling systems10H8 5 Measurement setup 11H12 6 Interpretation and evaluation 12H13 Annex A (informative) Sample calculation 13H17 Biblio
12、graphy 14H30 Figure 1 Principles of the thermoelectrical cooling system .15H9 Figure 2 Thermal resistances. 16H10 Figure 3 Thermodynamic system boundaries of a thermoelectrical cooling system attached to a closed cabinet . 17H11 Figure 4 Measurement setup 18H12 Figure 5 Results of the measurement. 1
13、9H14 Figure 6 Example for a specification sheet of a thermoelectrical cooling system (Peltier) 20H16 Figure A.1 Mollier h-x-diagram for humid air 21H20 Figure A.2 Principles of the Peltier effect . 22H21 Figure A.3 Illustration for Z dependent on the number of charge carrier . 23H22 Figure A.4 Influ
14、ence of the Figure of Merit ZT on the efficiency of the Peltier device 24H22 Figure A.5 Thermodynamic system boundaries of a Peltier device . 25H23 Figure A.6 Thermal resistance of a thermoelectrical cooling system 26H24 Figure A.7 Typical temperature curve of a thermoelectrical cooling system 27H25
15、 Figure A.8 Example for the thermal resistance between air and a heat sink as a function of the air velocity . 28H26 Figure A.9 Temperature distribution of a common heat sink for given boundary conditions . 29H26 Figure A.10 Illustration of the importance of the Thermal Interface Material (TIM) 30H2
16、7 Figure A.11 Dependency of the effective cooling power QCon the difference T between inside temperature and ambient temperature 31H28 Table A.1 Measurement dataset. 32H17 DD IEC/TS 62610-3:2009TS 62610-3 IEC:2009(E) 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STRUCTURES FOR ELECTRONIC
17、EQUIPMENT THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE WITH IEC 60297 AND IEC 60917 SERIES Part 3: Design guide: Evaluation method for thermoelectrical cooling systems (Peltier effect) FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization co
18、mprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International St
19、andards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this pr
20、eparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two orga
21、nizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form
22、 of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretat
23、ion by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or reg
24、ional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out
25、 by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees
26、 for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the
27、Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held r
28、esponsible for identifying any or all such patent rights. The main task of IEC technical committees is to prepare International Standards. In exceptional circumstances, a technical committee may propose the publication of a technical specification when the required support cannot be obtained for the
29、 publication of an International Standard, despite repeated efforts, or The subject is still under technical development or where, for any other reason, there is the future but no immediate possibility of an agreement on an International Standard. Technical specifications are subject to review withi
30、n three years of publication to decide whether they can be transformed into International Standards. DD IEC/TS 62610-3:2009 4 TS 62610-3 IEC:2009(E) IEC 62610-3, which is a technical specification, has been prepared by subcommittee 48D: Mechanical structures for electronic equipment, of IEC technica
31、l committee 48: Electromechanical components and mechanical structures for electronic equipment. The text of this technical specification is based on the following documents: Enquiry draft Report on voting 48D/401/DTS 48D/414/RVC Full information on the voting for the approval of this technical spec
32、ification can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of the IEC 62610 series can be found, under the general title Mechanical structures for electronic equipment Thermal m
33、anagement for cabinets in accordance with IEC 60297 and IEC 60917 series, on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the
34、 specific publication. At this date, the publication will be transformed into an International standard, reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. IMPORTANT The colour inside logo on the cover page of thi
35、s publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. DD IEC/TS 62610-3:2009TS 62610-3 IEC:2009(E) 5 INTRODUCTION Besides the conventional compressor cooling
36、 there are several alternatives for cooling, for example: absorption cooling, thermoelectric cooling (Peltier), magneto caloric cooling, CO2cooling and others. For the design of thermoelectrical cooling systems, values of the dissipation loss depending on the ambient temperature and internal tempera
37、ture are necessary. Thermoelectrical cooling systems performance is a function of ambient temperature, hot and cold side heat exchanger (heat sink) performance, thermal load, of the design of the Peltier device and of Peltier electrical parameters. Therefore an evaluation method has to be developed.
38、 This design guide allows a comparison of thermoelectrical cooling systems. DD IEC/TS 62610-3:2009 6 TS 62610-3 IEC:2009(E) MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE WITH IEC 60297 AND IEC 60917 SERIES Part 3: Design guide: Evaluation method for the
39、rmoelectrical cooling systems (Peltier effect) 1 Scope and object This part of IEC 62610 provides an evaluation method for thermoelectrical cooling systems (Peltier effect).With this design guide it is possible to calculate the efficiency of the thermoelectrical cooling system (Peltier effect) and i
40、ts cooling power depending on the ambient temperature and internal temperature. This design guide can also be used to appraise thermoelectrical cooling systems by its efficiency. 2 Normative references The following referenced documents are indispensable for the application of this document. For dat
41、ed references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 62194:2005, Method of evaluating the thermal performance of enclosures 3 Abbreviations, symbols and indices For the purposes of this document,
42、the following abbreviations, symbols and indices apply. 3.1 Abbreviations COP coefficient of performance - cPheat capacity W/kgK D pipe diameter m I current A k overall heat transfer coefficient k W/ m2K n total number of Peltier devices - p pressures difference Pa Q energy flow (thermal, electrical
43、, conductivity) W QCeffective cooling power of the thermoelectrical cooling system (Peltier) W QcPecooling power of a Peltier device at operating conditions W QDtotal dissipated heat flow on the hot side W QHheating power inside the cabinet W RPeelectrical resistance of the Peltier device V/A Rither
44、mal resistance K/W S surface m2 T temperature K V voltage V DD IEC/TS 62610-3:2009TS 62610-3 IEC:2009(E) 7 V the cooling power QCat TA,1= TA,3= 45 C with the three corresponding COPs; current that is applied to the Peltier devices; current that is applied to the fans; additionally useful parameters
45、are airflow and pressure drop. The following 42HFigure 6 shows an example for a specification sheet of a thermoelectrical cooling system (Peltier). DD IEC/TS 62610-3:2009 16 TS 62610-3 IEC:2009(E) nPe6 Ipe1,2 A 35/35 100 W (QC) 0,96 (COPPe) 0,78 (COPs) 0,6 (COPtotal) 45/45 120 W (Qc) 1,2 (COPPe) 1,1
46、 (COPs) 0,95 (COPtotal) Figure 6 Example for a specification sheet of a thermoelectrical cooling system (Peltier) total number of devices in the thermoelectrical cooling system TA,1/TA,3COP according to the specifications sheet of the Peltier device at the given applied current (IPe) and given tempe
47、ratures COP of the advanced cooling system (Peltier) to indicate the thermal resistances of heat sinks, TIMs COP for the total performance of the advanced cooling system current applied to one Peltier device IEC 2356/09 DD IEC/TS 62610-3:2009TS 62610-3 IEC:2009(E) 17 Annex A (informative) Sample cal
48、culation A.1 Sample calculation The data used in 43HFigure 5 are listed in the following 44HTable A.1: Table A.1 Measurement dataset TA,3TA,1Qc60,0 39,4 43,9 60,0 44,1 76,8 60,0 48,7 110,0 60,0 53,6 142,6 50,0 34,0 37,1 50,0 38,7 70,0 50,0 43,4 102,9 50,0 48,2 135,8 40,0 28,5 30,3 40,0 33,3 63,1 40,
49、0 38,0 96,0 40,0 42,7 129,0 30,0 23,1 23,4 30,0 27,8 56,3 30,0 32,5 89,2 30,0 37,3 122,1 20,0 17,6 16,6 20,0 22,3 49,5 20,0 27,1 82,4 20,0 31,8 115,3 For the following sample calculation the measurement point at the ambient temperature of TA,3= 50 C, an internal temperature TA,1= 43,4 C and a resulting effective cooling power QC= 102,9 W will be considered. Pre-experiments determined the overall
