1、BRITISH STANDARD BS EN 123500-800: 1992 Incorporating Amendment No. 1 Harmonized system of quality assessment for electronic components: Capability detail specification: Flexible printed boards with through-connections The European Standard EN 123500-800:1992 has the status of a British StandardBSEN
2、123500-800:1992 This British Standard, having been prepared under the directionof the Electronic Components Standards PolicyCommittee, was publishedunder the authorityofthe Standards Boardand comes into effect on 20 December 1991 BSI 08-1999 The following BSI references relate to the work on this st
3、andard: Committee reference ECL/19 Draft announced in BSI News August 1991 ISBN 0 580 20305 0 Committees responsible for this British Standard The preparation of this British Standard was entrusted by the Electronic Components Standards Policy Committee (ECL/-) to Technical Committee ECL/19, upon wh
4、ich the following bodies were represented: British Telecommunications plc EEA (The Association of the Electronics, Telecommunications and Business Equipment Industries) Electrical and Electronic Insulation Association (BEAMA Ltd.) Electronic Components Industry Federation Electronic Engineering Asso
5、ciation ERA Technology Ltd. GAMBICA (BEAMA Ltd.) Ministry of Defence National Supervising Inspectorate Printed Circuit Interconnection Federation Amendments issued since publication Amd. No. Date Comments 7370 November 1992 Indicated by a sideline in the marginBSEN123500-800:1992 BSI 08-1999 i Conte
6、nts Page Committees responsible Inside front cover National foreword ii Foreword 2 Text of EN 123500-800 1 Publication(s) referred to Inside back coverBSEN123500-800:1992 ii BSI 08-1999 National foreword This British Standard has been prepared under the direction of the Electronics Components Standa
7、rds Policy Committee. It is identical with CENELEC Electronic Components Committee (CECC)23500-800:1990 “Harmonized system of quality assessment for electronic components: Capability detail specification: Flexible printed boards with through-connections”. This standard is a harmonized specification
8、within the CECC system and should be read in conjunction with BSCECC 23000and BSCECC23500. In 1992 the CENELEC Electronic Components Committee (CECC) accepted CECC 23500-800:1990 as European Standard EN123500-800:1992. Cross-references The British Standard which implements CECC00100 is BS9000, “Gene
9、ral requirements for a system for electronic components of assessed quality”, Part2:1991 “Specification for the national implementation of the CECC system”. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their
10、 correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. International Standard Corresponding British Standard CECC 23000:1985 BS CECC 23000:1989 Harmonized system of quality assessment for electronic components: Generic specification: Print
11、ed boards (Identical) CECC 23500:1985 BS CECC 23500:1990 Specification for harmonized system of quality assessment for electronic components: Sectional specification: Flexible printed boards with through-connections (Identical) IEC 68 BS 2011 Environmental testing (Most Parts are identical) IEC 249
12、BS 4584 Metal-clad base materials for printed wiring boards (Most Parts are identical) BS 6221 Printed wiring boards IEC 326-2:1990 Part 2:1991 Methods of test (Identical) IEC 326-3:1991 Part 3:1991 Guide for the design and use of printed wiring boards (Identical) Summary of pages This document comp
13、rises a front cover, an inside front cover, pages i and ii, the EN title page, page 2, the CECC title page, page ii, pages1 to 6, aninsideback cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment
14、 table on the inside front cover.EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 123500-800 May 1992 UDC: Descriptors: Quality, electronic components, printed boards English version Capability detail specification: Flexible printed boards with through connections Spcification Particulire dAgrme
15、nt: Cartesimprimes souples avec connexions transversales Bauartspezifikation zur Anerkennung der Befhigung: Flexible Leiterplatten mit Durchverbindungen This European Standard was approved by the CENELEC Electronic Components Committee (CECC) on 12 December 1991. The text of this standard consists o
16、f the text of CECC23500-80Issue 11990of the corresponding CECC Specification. CENELEC members are bound to comply with CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibl
17、iographical references concerning such national standards may be obtained on application to the General Secretariat of the CECC or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the
18、responsibility of a CENELEC member into its own language and notified to the CECC General Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Lu
19、xembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. The membership of the CECC is identical, with the exception of the national electrotechnical committees of Greece, Iceland and Luxembourg. CECC European Committee for Electrotechnical Standardization Comit Europe
20、n de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1992 Copyright reserved to CENELEC members Ref. No. EN 123500-800:1992 EEN123500-800:1992 BSI 08-1999 2 Foreword The CENELEC Electronic Components Committee (
21、CECC) is composed of those member countries of the European Committee for Electrotechnical Standardization (CENELEC) who wish to take part in a harmonized System for electronic components of assessed quality. The object of the System is to facilitate international trade by the harmonization of the s
22、pecifications and quality assessment procedures for electronic components, and by the grant of an internationally recognized Mark, or Certificate, of Conformity. The components produced under the System are thereby acceptable in all member countries without further testing. This specification has be
23、en formally approved by the CECC, and has been prepared for those countries taking part in the System who wish to issue national harmonized CAPABILITY DETAIL SPECIFICATIONS (Cap DS) for FLEXIBLE PRINTED BOARDS WITH THROUGH-CONNECTIONS. It should be read in conjunction with the current regulations fo
24、r the CECC System. At the date of printing of this specification, the member countries of the CECC are Austria, Belgium, Denmark, Finland, France, Germany, Ireland, Italy, the Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and the UnitedKingdom, and copies of it can be obtained from the a
25、ddresses shown on the blue fly sheet. Preface This specification was prepared by CECC Working Group 23: Printed Circuits. It is based, wherever possible, on the Publications of the International Commission (IEC). The text of this specification was circulated to the CECC for voting in the document in
26、dicated below and was ratified by the President of the CECC for printing as a CECC Specification. Contents Page Foreword 2 1 General 1 2 Capability qualifying component CQC 1 3 Capability approval 2 4 Capability testing 2 Characteristics test tables 6 Document Date of Voting Report on the Voting CEC
27、C (Secretariat) 2428 January 1990 CECC (Secretariat) 2528ii blankEN123500-800:1992 BSI 08-1999 1 1 General 1.1 Scope This Cap DS is based on CECC23500. It relates to flexible printed boards with through connections made with materials and surface finishes as specified in 2. 1.2 Object To specify the
28、 capability qualifying component “CQC”, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic capability. 2 Capability qualifying component CQC Test boards to be used as CQC shall be made of one of the copper clad base
29、materials specified in 2.1 of this Cap DS, nominal base material thickness of1004m and184m copper foil on both sides bear the composite test pattern specified in 8.2 of CECC 23500 have one of the surface finishes specified in 2.2 of this Cap DS. 2.1 Materials 2.2 Surface finishes 2.3 Combination of
30、material and surface finishes and variant designation The combination of any material of one material group specified in 2.1 and any surface finish of one finish group as specified in 2.2 constitutes a variant. The variant is designated by the combination of the material group designation and the fi
31、nish group designation, e.g.A11, A12 etc. Material group designation Publication Base material Base material thickness range Cu-foil thickness IEC Type grade 4m 4m A 249-2-8 Polyester film General purpose B 249-2-13 Polyimide film General purpose 12,5.125 18,35,70 249-2-15 Polyimide film Defined fla
32、mmability Finish group designation Surface finish Abbreviation for QPL 11 Bare copper (with or without temporarily protective coating) Cu 12 Tin, tin-lead (irrespective of process used) Sn, Sn Pb 13 Specimen K 5 4m min.gold plated on copper, remainder finish group 11 5 Au/Cu, Cu 14 Specimen K 5 4m m
33、in.gold plated on copper, remainder finish group 12 5 Au/Cu Sn, Sn Pb 15 Specimen K 0,7 4m min.gold plated on nickel, remainder finish group 11 0,7 Au/Ni, Cu 16 Specimen K 0,7 4m min.gold plated on nickel, remainder finish group 12 0,7 Au/Ni, Sn, Sn PbEN123500-800:1992 2 BSI 08-1999 3 Capability app
34、roval 3.1 Range of capability approval Capability approval granted on testing one variant is valid within the limits specified in 3.7 of CECC23000 for all metal-clad base materials within the specific material group as given in 2.1 as follows: approval for material group A covers material group A on
35、ly approval for material group B covers material groups A and B, all base material thicknesses and all foil thicknesses of the metal-clad base materials in accordance with the IEC Standards quoted in 2.1, and the surface finishes within one surface finish group as quoted in 2.2, i.e. 3.2 QPL informa
36、tion The QPL information shall be given in accordance with 3.4 of CECC 23000 and shall contain the following details related to this Cap DS: 4 Capability testing 4.1 Capability test programme The capability test programme, the number of specimens to be tested and the number of failures permitted sha
37、ll be applied as specified in 6 of CECC 23500. 4.2 Characteristics The characteristics given in the following table shall be tested, the test methods and conditions given there shall be applied and the requirements given there shall be fulfilled in accordance with 4.1 of this Cap DS. finish group 11
38、 coversfinish group 11 only “ “ 12 “ “ “ 12 “ “ “ 13 “ “ “ 11 also “ “ 14 “ “ “ 12 “ “ “ 15 “ “ “ 11 “ “ “ 16 “ “ “ 12 “ Reference to the Generic Specification : CECC 23000 Reference to the Sectional Specification : CECC 23500 Reference to this Cap DS : CECC 23500-800 Variant for which capability ap
39、proval is granted Abbreviations of the surface finishes as given in 2.2 which are covered by the capability approval.EN 123500-800:1992 BSI 08-1999 3 Characteristics Test No. of IEC 326-2 Specimen of composite test pattern CECC 23500 Test conditions Requirements with material according to IEC 249-2-
40、8 249-2-13 249-2-15 Remarks General examination Visual inspection Conformity, identification 1 a Pattern, marking, identification and material finishes shall comply with this cap DS. Appearance and workmanship 1a a The boards shall appear to have been processed in a careful and workmanlike manner, i
41、n accordance with good current practice. Plated through holes a Plated-through holes shall be clean and free from inclusions of any sort that could affect component insertion and solderability. There shall be no voids and no apparent defects of the plating as evident by cracks or separation from the
42、 wall. Board edges a The edges of the board and the internal cut-outs be clean cut without tears or nicks. Eyelets A Eyelets shall be firmly secured. flanges of eyelets may be soldered to the pattern. There shall be no damage to conductor or substrate around the eyelet. Bonding conductor to substrat
43、e a There shall be no separation of the conductors from the substrate by apparent blisters or wrinkles other than those permitted in the material specification. Bonding coverlayer to substrate and pattern la a The bonding shall appear to be complete and uniform. Minor delaminations are permitted in
44、the following positions: a) At random locations away from the conductors. Such delaminations shall have an area not exceeding 5mm 2each, and shall be more than0,5mm from the edges. Examples of delaminations are shown in Figure 5, of CECC23500 b) Along the conductor edges. Such delaminations shall no
45、t infringe upon the design spacing between the conductors by more than 20% of the design width by visual estimation. There shall be a minimum continuous bonding width of0,5mm between adjacent conductors. There shall be no delamination with conductor spacings less than0,5mm. a Complete composite test
46、 patternEN 123500-800:1992 4 BSI 08-1999 Characteristics Test No. of IEC 326-2 Specimen of composite test pattern CECC 23500 Test conditions Requirements with material according to IEC 249-2-8 249-2-13 249-2-15 Remarks Conductor defects 1b a There shall be no cracks or breaks. Imperfections such as
47、voids or edge defects are permissible provided the conductor width or the leakage path between conductors is not reduced by more than 35%. The length L of defect (Figure 1 of CECC 23500) shall not be greater than the nominal conductor width. Particles between conductors 1b or 1c F Residual metallic
48、particles are permissible provided the leakage path is not reduced by more than 20%. Dimensional examination Board dimensions 2 a Dimensions and nominal board thickness shall comply with CECC 23500 and with 2 of this Cap DS. Holes 2 a Dimensions shall comply with 8.2 of CECC23500. The limits of the
49、hole diameter recommended in IEC 326-3 (i.e.deviation for plain holes, minimum diameter for plated-through holes) shall not be exceeded. Access holes 2 a , Coverlayer Registration of an access hole including influence of adhesive flow in the cover layer with relation to the relevant land on the base material shall be such that any overlapping will not reduce the effective land dimensions to less than0,15mm. See Figure 4 of CECC23500 Conductor width 2a F The conductor width shall not deviate from nominal values by more than +0,08/ 0,0
