1、BRITISH STANDARD BS EN 123800:1997 Harmonized system of quality assessment for electronic components Sectional specification: Flexible multilayer printed boards with through connections The European Standard EN 123800:1996 has the status of a British Standard ICS 31.180BSEN 123800:1997 This British
2、Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authority of the Standards Boardand comes into effecton 15May 1997 BSI 03-1999 The following BSI references relate to the work on this standard: Committee reference EPL/52 Draft for comme
3、nt 91/03619 DC ISBN 0 580 27429 2 Committees responsible for this British Standard The preparation of this British Standard was entrusted by Technical Committee EPL/52, Printed circuits, upon which the following bodies were represented: British Telecommunications plc Federation of the Electronics In
4、dustry GAMBICA (BEAMA Ltd.) National Supervising Inspectorate (BSI-PC) Printed Circuit Interconnection Federation Surface Mount and Related Technologies (SMART Group) Ltd. Amendments issued since publication Amd. No. Date CommentsBSEN123800:1997 BSI 03-1999 i Contents Page Committees responsible Ins
5、ide front cover National foreword ii Foreword 2 Text of EN 123800 3 List of references Inside back coverBSEN 123800:1997 ii BSI 03-1999 National foreword This British Standard has been prepared by Technical Committee EPL/52, and is the English language version of EN123800:1996 Sectional specificatio
6、n: Flexible multilayer printed boards with through connections, published by the European Committee for Electrotechnical Standardization (CENELEC). A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct
7、application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Cross-references Publication referred to Corresponding British Standard EN 123000:1991 BSEN123000:1992 Harmonized system of quality assessment for electronic components. Generic specification:
8、Printed boards BS2011 Environmental testing IEC68-2-3:1969 Part 2.1Ca:1977 Test Ca. Damp heat, steady state IEC 68-2-20:1979 Part 2.1T:1981 Test T. Soldering IEC 68-2-38:1974 Part 2.1Z/AD:1977 Tests Z/AD. Composite temperature/humidity cyclic test IEC 194:1988 BS4727 Glossary of electrotechnical, po
9、wer, telecommunication, electronics, lighting and colour terms Part 1 Terms common to power, telecommunications and electronics Group 11:1991 Printed circuits BS6221 Printed wiring boards IEC 326-2:1990 Part 2:1991 Methods of test IEC 326-3:1991 Part3:1991 Guide for the design and use of printed wir
10、ing boards Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, theEN title page, pages 2 to 44, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in th
11、e amendment table on theinside front cover.EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 123800 December 1996 Descriptors: Multilayer printed boards, with through connections, capability test, quality conformance inspection, test patterns English version Sectional specification: Flexible mult
12、ilayer printed boards with through connections Spcification intermdiaire: Cartes imprimes multicouches souples avec connexions transversales Rahmenspezifikation: Flexible Mehrlagen-Leiterplatten mit Durchverbindungen This European Standard was approved by CENELEC on1992-05-22. CENELEC members are bo
13、und to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the
14、Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the sam
15、e status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committe
16、e for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1996 Copyright reserved to CENELEC members Ref. No. EN 123800:1996 EEN123800:1996 BSI 03-1999 2 Foreword Th
17、is European Standard was prepared by CLC/TC CECC/SC52, Printed boards (formerWG23). It is based, wherever possible, on the Publications of the International Electrotechnical Commission, and in particular on IEC326-9, Printed boards, Part9:Specification for flexible multilayer printed boards with thr
18、ough connections. The text of the draft based on document CECC(Secretariat)2865 was submitted to the formal vote; together with the voting report, circulated as document CECC(Secretariat)3092, it was approved as EN123800 on1992-05-22. The following dates were fixed: Contents Page Foreword 2 1 Introd
19、uction 3 1.1 Scope and object 3 1.2 Related documents 3 2 General 3 3 Test specimen 3 3.1 Capability Approval 3 3.2 Quality conformance inspection 3 4 Relevant specification 4 5 Characteristics of the printed board 4 6 Capability test programme 17 7 Quality conformance inspection 18 8 Test pattern T
20、est boards 18 8.1 General 18 8.2 Application of test patterns and test boards 22 8.3 Structure of test boards 22 8.4 Multiple arrangements of the composite test pattern 22 8.4.1 Examples of multiple arrangements 23 Page Figure 1 Length of defect 21 Figure 2 23 Figure 3a Layer 1 25 Figure 3b Layer 2
21、26 Figure 3c Layer 3 27 Figure 3d Layer 4 28 Figure 3e Layer 5 29 Figure 3f Layer 6 30 Figure 3g 31 Figure 3h 32 Figure 4 L specimen 40 Figure 5 Examples of delamination 41 Figure 6a Methods of reinforcing lands 42 Figure 6b Examples relating to access holes 43 Figure 7 Examples of soldered holes 44
22、 Table I Basic characteristics 5 Table II Additional characteristics 14 Table III 17 Table IV 19 Table V 22 Table VI Test board structure 24 latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop)1997-07-01 latest d
23、ate by which the national standards conflicting with the EN have to be withdrawn (dow)2003-08-12EN123800:1996 BSI 03-1999 3 1 Introduction IEC 326-9 is the IEC Standard for flexible multilayer printed boards with through connections. The following document comprises this IEC Standard and in accordan
24、ce with the Generic Specification EN 123000, the information additionally necessary for printed boards intended to be handled within the CENELEC system for electronic components of assessed quality. 1.1 Scope and object This document is a Sectional Specification (SS) relating to flexible multilayer
25、printed boards with through connections irrespective of their method of manufacture, when they are ready for the mounting of the components. It defines the characteristics to be assessed and the test methods to be used for capability approval testing and for quality conformance inspection (lot-by-lo
26、t and periodic inspection). 1.2 Related documents IEC 68, Basic environmental testing procedures. IEC 97, Grid system for printed circuits. IEC 194, Terms and definitions for printed circuits. IEC 249, Metal-clad base materials for printed circuits. IEC 326-1, Printed boards, instructions for the sp
27、ecification writer. IEC 326-2, Test methods for printed boards. IEC 326-3, Recommendations for the design and the use of printed boards. IEC 326-9, Specification for flexible multilayer printed boards with through-connections. 2 General This Sectional Specification (SS) applies to flexible printed b
28、oards with through-connections and is intended as a basis for the preparation of a Capability Detail Specification (CapDS) applying to specific materials e.g. according to IEC249-2, and to be used for Capability Approval Procedures. It may be necessary to have a CapDS for each type of material. A Ca
29、pDS may be prepared by an international or national body or by a manufacturer (seealsoCECC00111/IV). Customer Detail Specification (CDS) for the custom built printed boards, according to clause5 of EN123000. The CDS will normally be written by the customer and allocated a number within his own syste
30、m. Further details are also given in EN123000 and CECC00114/III. Table I contains the basic characteristics that will normally be important for flexible multilayer printed boards with through connections and makes reference to the appropriate tests to verify these characteristics. Table II contains
31、the additional characteristics that may be important for certain flexible multilayer printed boards with through connections and/or certain applications and makes reference to the appropriate tests to verify these characteristics. Where necessary, the relevant specification may quote characteristics
32、 and tests from thisTable II. Where additional details for a test have to be specified in the relevant specification, this shall be indicated by “*” in the relevant column. These details shall then be specified in accordance with CECC00010 (IEC326-2). Table III contains the capability test programme
33、. A specified composite test pattern (CTP) is used as a capability qualifying component. Table IV contains the information for the quality conformance inspection. The tables are not intended to prescribe a test sequence. The tests may be carried out in any sequence, unless otherwise specified. 3 Tes
34、t specimen A test specimen, which may be specifically designed for this purpose (composite test pattern), or taken from production (production board), which is used for verifying capability in accordance with the relevant Generic Specification. A suitable composite test pattern is shown inFigure 3a,
35、 Figure 3b, Figure 3c, Figure 3d, Figure 3e, Figure 3f, Figure 3g, Figure 3h, Figure 4a, andFigure 4b to this document. 3.1 Capability Approval 3.1.1 Basic capability The test shall be carried out on the composite test pattern given inclause8. 3.1.2 Additional capability Clause 3.5.3 of EN123000 sha
36、ll apply. For multiple arrangements; see also clause8. 3.1.3 Maintenance of capability approval Clause 3.8 of EN123000 shall apply. 3.2 Quality conformance inspection Unless otherwise specified, production boards and/or specially designed test patterns may be used for carrying out tests for the lot-
37、by-lot and the periodic inspection.EN123800:1996 4 BSI 03-1999 Where specifically designed test patterns shall be used they may be included in the panel. They may be based on the appropriate pattern of the composite test pattern; seeclause8. Consultation between manufacturer and customer will usuall
38、y be necessary. 4 Relevant specification The term “relevant specification” means a product specification for an actual printed board., i.e.a CDS as well as a CapDS applied to a specific material and technique, as applicable. The relevant specification shall contain all information necessary to defin
39、e the printed board clearly and completely. The recommendations given in IEC326-3 shall preferably be followed. Care should be taken to avoid unnecessary prescription. Permissible deviations should be stated where necessary, nominal values without tolerances or simple maxima or minima shall be given
40、 where sufficient. Where tolerances are necessary for certain areas or parts of the printed board only, they shall be applied and restricted to those areas or parts. If there are several possibilities of presentation of tolerance classes etc., the selections given in IEC326-3 shall preferably be app
41、lied. In cases of discrepancy between the CDS and other pertinent specifications (e.g.BS, GS, or SS), the CDS shall prevail. 5 Characteristics of the printed board Basic characteristics, seeTable I Additional Characteristics, seeTable IIEN123800:1996 BSI 03-1999 5 Table I Basic characteristics (mand
42、atory assessments) Characteristics Test No. IEC326-2 Additional Tests Specimen of Composite Test Pattern Requirements Remarks General Examination Visual Examination Conformity and Identification 1 a Complete printed board or composite test pattern Pattern, marking, identification, material and finis
43、hes shall comply with the relevant specification. There shall be no apparent defects. Appearance and Workmanship 1a Complete printed board or composite test pattern The boards shall appear to have been processed in a careful and workmanlike manner, in accordance with good current practice. Plated-th
44、rough holes Complete printed board or composite test pattern Plated-through holes shall be clean and free from inclusions of any sort that could affect component insertion and solderability, Total area of the voids shall not exceed10% of the total wall area. The largest dimension shall not exceed25%
45、 of the hole circumference in the horizontal plane and25% of the thickness of the board in the vertical plane. Plated-through holes shall have no plating voids at the interface of the hole wall and the conductive pattern or internal layer ring. The interface shall be considered to extend into the ho
46、le below the surface of the board a distance of1,5times the total copper thickness on the surface or to be two times the inner layer thickness at the level of contact ring. a see clause 2EN123800:1996 6 BSI 03-1999 Table I Basic characteristics (mandatory assessments) Characteristics Test No. IEC 32
47、6-2 Additional Tests Specimen of Composite Test Pattern Requirements Remarks 1c Resin smear at the edge of the clad copper and the continuous plated copper is permitted provided the smear does not interrupt electrical continuity. 1a There shall be no circumferential cracks of the copper, or circumfe
48、rential separation of the copper from the wall of the plated-through hole Holes with plating voids shall not exceed5% of the total number of plated-through holes Board Edges Complete printed board or composite test pattern The edges of the board and internal cut outs shall be clean cut without tears
49、 or nicks Eyelets Complete printed board or composite test pattern Eyelets shall be firmly secured. Plated eyelets shall not have exposed bare metal. Eyelets shall not have cracked flanges. There shall be no damage to conductors or substrate around the eyelet. Bonding Conductor to Substrate Complete printed board or composite test pattern There shall be no separation of the conductors from the substrate by apparent blisters or wrinkles other than those permitted in the material specification.EN123800:1996 BSI 03-1999 7 Table
