1、BSI Standards PublicationBS EN 16602-70-10:2015Space product assurance Qualification of printed circuitboardsBS EN 16602-70-10:2015 BRITISH STANDARDNational forewordThis British Standard is the UK implementation of EN16602-70-10:2015.The UK participation in its preparation was entrusted to Technical
2、Committee ACE/68, Space systems and operations.A list of organizations represented on this committee can beobtained on request to its secretary.This publication does not purport to include all the necessaryprovisions of a contract. Users are responsible for its correctapplication. The British Standa
3、rds Institution 2015. Published by BSI StandardsLimited 2015ISBN 978 0 580 86496 4ICS 31.180; 49.140Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 28 February 201
4、5.Amendments issued since publicationDate Text affectedBS EN 16602-70-10:2015EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 16602-70-10 January 2015 ICS 31.180; 49.140 English version Space product assurance - Qualification of printed circuit boards Assurance produit des projets spatiaux - Qua
5、lification des circuits imprims Raumfahrtproduktsicherung - Qualifizierung von Leiterplatten This European Standard was approved by CEN on 11 October 2014. CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European St
6、andard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC member. This European Standard exists in three official ve
7、rsions (English, French, German). A version in any other language made by translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CEN and CENELEC members are the national st
8、andards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norw
9、ay, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom. CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2015 CEN/CENELEC All rights of exploitation in any form and by any means reserved worldwide for CEN national Members and for CENE
10、LEC Members. Ref. No. EN 16602-70-10:2015 EBS EN 16602-70-10:2015EN 16602-70-10:2015 (E) 2 Table of contents Foreword 7 1 Scope . 8 2 Normative references . 9 3 Terms, definitions and abbreviated terms 11 3.1 Terms from other standards 11 3.2 Terms specific to the present standard . 11 3.3 Abbreviat
11、ed terms. 14 4 Principles 16 4.1 General . 16 4.2 Roles 16 4.3 Specification of test requirements . 17 5 Evaluation . 18 5.1 General . 18 5.2 Request for evaluation 18 5.3 Evaluation PCBs . 18 5.4 Line audit 19 6 Qualification 20 6.1 General . 20 6.2 Qualification programme definition and approval 2
12、0 6.3 Nonconformance criteria . 21 6.4 Qualification programme implementation 21 6.5 Qualification PCBs 25 6.5.1 General . 25 6.5.2 Test pattern A: Electrical test 27 6.5.3 Test pattern B: Mechanical test . 27 6.5.4 Test pattern C: Electrical test 28 6.5.5 Test pattern D: Electrical test and visual
13、aspect 28 6.5.6 Test pattern E: Electrical test 29 6.5.7 Test pattern F: Metal-plating test . 30 BS EN 16602-70-10:2015EN 16602-70-10:2015 (E) 3 6.5.8 Test pattern G: Metal-plating/coating test 30 6.5.9 Test pattern H: Electrical test 31 6.5.10 Test pattern J: Solderability test 31 6.5.11 Test patte
14、rn K: Physical test 32 6.5.12 Test pattern L: Demonstration of technological capability 32 6.5.13 Test pattern M: CAD/CAM criteria (on request by the qualification authority) . 33 6.5.14 Test pattern X: Resistance to bending cycles (for flexible parts only) 34 6.5.15 Test pattern Y: Electrical test
15、(on request by the supplier). 34 6.5.16 Test pattern W: Electrical test for high frequency circuits (on request by the supplier) . 35 6.6 Qualification approval . 35 6.7 Maintenance of qualification . 35 7 Tests 37 7.1 General . 37 7.2 Group 1 Visual inspection and non-destructive test 37 7.2.1 Gene
16、ral . 37 7.2.2 Verification of marking . 37 7.2.3 Visual aspects . 38 7.2.4 External dimensions 41 7.2.5 Warp . 41 7.2.6 Twist . 42 7.2.7 Subgroup 1.1 Specific dimensional check. 42 7.2.8 Subgroup 1.2 Electrical measurements 44 7.3 Group 2 Miscellaneous tests 46 7.3.1 General . 46 7.3.2 Subgroup 2.1
17、 Solderability test Wettability on test pattern J . 46 7.3.3 Subgroup 2.2 Mechanical tests . 47 7.3.4 Subgroup 2.3 Coatings tests. 49 7.3.5 Subgroup 2.4 Electrical tests 56 7.3.6 Subgroup 2.5 Physical tests on test pattern K 58 7.4 Group 3 Thermal stress and thermal shock (on PCB) 59 7.4.1 General .
18、 59 7.4.2 Solder bath float and vapour phase reflow simulation (on board without test pattern F) . 59 7.4.3 Rework simulation (thermal shock, hand soldering) on test pattern F 60 7.5 Group 4 Thermal cycling (on PCB) . 61 7.6 Group 5 Damp heat Steam ageing (on PCB) . 62 BS EN 16602-70-10:2015EN 16602
19、-70-10:2015 (E) 4 7.6.1 General . 62 7.6.2 Damp heat (on entire PCB excluding test pattern F) . 62 7.6.3 Steam ageing on test pattern F . 62 8 Quality assurance for manufacturing . 64 8.1 General . 64 8.2 Data 64 8.3 Incoming inspection of raw materials 64 8.4 Traceability . 64 8.5 Calibration 65 8.
20、6 Workmanship standards . 65 8.7 Inspection . 65 8.8 Operator and inspector training. 65 8.9 Quality test specimen . 65 8.10 Microsection . 66 8.11 Final inspection and tests . 66 8.12 Delivery 66 9 Requirements for PCBs . 67 9.1 Rigid single-sided and double-sided PCBs . 67 9.2 Rigid single-sided a
21、nd double-sided PCBs for high frequency application 69 9.3 Flexible PCBs . 72 9.4 Rigid-flex PCBs 74 9.5 Rigid multilayer PCBs . 74 9.6 Sequential rigid multilayer PCBs . 77 Annex A (normative) Evaluation test report DRD . 80 Annex B (normative) Qualification test report DRD 82 Annex C (normative) P
22、CB manufacturing/assembly process identification document (PID) DRD 83 Annex D (normative) Qualification status report DRD 84 Annex E (informative) Example of check-list 85 Annex F (informative) Example of plated-through hole microsection 88 Bibliography . 89 Figures Figure 6-1: Test sequence 22 BS
23、EN 16602-70-10:2015EN 16602-70-10:2015 (E) 5 Figure 6-2: Example of a qualification PCB layout with patterns for testing and a pattern for demonstration of the technological capability 26 Figure 6-3: Example of test pattern for intralayer insulation resistance and dielectric withstanding voltage tes
24、ting . 27 Figure 6-4: Example of test pattern for testing peel strength of conductors and pull-off strength of pads . 28 Figure 6-5: Example of test pattern for internal short circuit testing. 28 Figure 6-6: Example of test pattern for etching definition evaluation and continuity testing 29 Figure 6
25、-7: Example of test pattern for interconnection resistance and current overload testing 29 Figure 6-8: Example of test pattern for microsectioning and metal plating evaluation . 30 Figure 6-9: Example of test pattern for plating adhesion testing and analysis of SnPb coating composition after reflow
26、. 30 Figure 6-10: Example of test pattern for interlayer insulation resistance and dielectric withstanding voltage testing . 31 Figure 6-11: Example of test pattern for solder wettability and rework simulation testing 31 Figure 6-12: Example of test pattern for water absorption and outgassing testin
27、g 32 Figure 6-13: Example of test pattern for evaluation of the technological capability . 33 Figure 6-14: Example of test pattern for evaluation of CAD/CAM capability 34 Figure 6-15: Example of test pattern for testing resistance to bending cycles . 34 Figure 6-16: Example of test pattern for contr
28、olled impedance testing 34 Figure 7-1: Arbitrary defects on conductors 40 Figure 7-2: Arbitrary defects on spacing between conductors. 40 Figure 7-3 Misalignment of cover layer (for flexible PCBs) . 41 Figure 7-4: Warp 42 Figure 7-5: Twist. 42 Figure 7-6 Example of a presentation of measurements in
29、tabular form . 43 Figure 7-7: Wettability of terminal pads and plated-through holes 47 Figure 7-8: Dimensional parameters to be measured . 51 Figure 7-9: Microsection of a PTH 53 Figure 7-10: Undercut for PCBs with fused SnPb finish 53 Figure 7-11: Undercut for PCBs with Au/Ni or Au finish 54 Figure
30、 7-12: Overhang for PCBs with Au/Ni or Au finish . 54 Figure 7-13: Microsection in PTH: Possible defects 55 Figure 7-14: Microsection of PTH: Possible defects . 55 Figure 7-15: Voids in resin inside buried vias . 56 Figure 7-16: Test for internal short circuit . 57 Figure A-1 : Example of a test rep
31、ort 81 BS EN 16602-70-10:2015EN 16602-70-10:2015 (E) 6 Figure E-1 : Example of Check-list for double sided and multilayer PCBs 85 Figure F-1 : Example of plated-through hole microsection 88 Tables Table 6-1: Test specification . 23 BS EN 16602-70-10:2015EN 16602-70-10:2015 (E) 7 Foreword This docume
32、nt (EN 16602-70-10:2015) has been prepared by Technical Committee CEN/CLC/TC 5 “Space”, the secretariat of which is held by DIN. This standard (EN 16602-70-10:2015) originates from ECSS-Q-ST-70-10C. This European Standard shall be given the status of a national standard, either by publication of an
33、identical text or by endorsement, at the latest by July 2015, and conflicting national standards shall be withdrawn at the latest by July 2015. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and/or CENELEC shall not be held r
34、esponsible for identifying any or all such patent rights. This document has been prepared under a mandate given to CEN by the European Commission and the European Free Trade Association. This document has been developed to cover specifically space systems and has therefore precedence over any EN cov
35、ering the same scope but with a wider domain of applicability (e.g. : aerospace). According to the CEN-CENELEC Internal Regulations, the national standards organizations of the following countries are bound to implement this European Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Repub
36、lic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. BS EN
37、 16602-70-10:2015EN 16602-70-10:2015 (E) 8 1 Scope This Standard defines the requirements for evaluation, qualification and maintenance of qualification of PCB manufacturers for different types of PCBs. This Standard is applicable to the following type of PCBs: Rigid PCBs (single-sided, double-sided
38、, multilayer, sequential-laminated multilayer, metal core) Flexible PCB (single-sided and double-sided) Rigid-flex PCBs (multilayer and sequential-laminated multilayer) High frequency PCBs Special PCBs. PCBs are used for the mounting of components in order to produce PCB assemblies performing comple
39、x electrical functions. The PCBs are subjected to thermal and mechanical shocks during their assembly such as mounting of components by soldering, rework and repair under normal terrestrial conditions, and in addition the complex PCB assembly are subjected to the environment imposed by launch and sp
40、ace flights. This standard may be tailored for the specific characteristics and constraints of a space project in conformance with ECSS-S-ST-00. BS EN 16602-70-10:2015EN 16602-70-10:2015 (E) 9 2 Normative references The following normative documents contain provisions which, through reference in thi
41、s text, constitute provisions of this ECSS Standard. For dated references, subsequent amendments to, or revision of any of these publications do not apply. However, parties to agreements based on this ECSS Standard are encouraged to investigate the possibility of applying the more recent editions of
42、 the normative documents indicated below. For undated references, the latest edition of the publication referred to applies. EN reference Reference in text Title EN 16601-00-01 ECSS-S-ST-00-01 ECSS system Glossary of terms EN 16602-10-09 ECSS-Q-ST-10-09 Space product assurance Nonconformance control
43、 system EN 16602-20 ECSS-Q-ST-20 Space product assurance Quality assurance EN 16602-70 ECSS-Q-ST-70 Space product assurance Material, mechanical parts and processes EN 16602-70-02 ECSS-Q-ST-70-02 Space product assurance Thermal vacuum outgassing test for the screening of space materials EN 16602-70-
44、08 ECSS-Q-ST-70-08 Space product assurance Manual soldering of high-reliability electrical connections EN 16602-70-11 ECSS-Q-ST-70-11 Space product assurance Procurement of printed circuit boards EN 16602-70-21 ECSS-Q-ST-70-21 Space product assurance Flammability testing for the screening of space m
45、aterials EN 16602-70-22 ECSS-Q-ST-70-22 Space product assurance Control of limited shelf-life materials EN 16602-70-29 ECSS-Q-ST-70-29 Space product assurance Determination of offgassing products from materials and assembled articles to be used in a manned space vehicle crew compartment IEC 60068-2-
46、3 (1969-01) Environmental testing. Part 2: Tests. Test Ca: Damp heat, steady state IEC 60068-2-14-am 1 (1986-01) Environmental testing. Part 2: Tests. Test N: Change of temperature BS EN 16602-70-10:2015EN 16602-70-10:2015 (E) 10 IEC 60068-2-20-am 2 (1987-01) Environmental testing. Part 2: Tests. Te
47、st T: Soldering IEC 60249-1-am 4 (1993-05) Base materials for printed circuits. Part 1: Test methods IEC 60326-2-am 1 (1992-06) Printed boards. Part 2: Test methods IEC 60326-5-am 1 (1989-10) Printed boards. Part 5: Specification for single and double sided printed boards with plated-through holes I
48、EC 60326-8 (1981-01) Printed boards. Part 8: Specification for single and double sided flexible printed boards with through connections IEC 60326-11 (1991-03) Printed boards. Part 11: Specification for flex-rigid multilayer printed boards with through connections IEC 62326-4 (1996-12) Printed boards
49、. Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification IPC-4101 Specification for base materials for rigid and multilayer printed boards MIL-P-50884C Printed wiring, flexible and rigid-flex BS EN 16602-70-10:2015EN 16602-70-10:2015 (E) 11 3 Terms, definitions and abbreviated terms 3.1 Terms from other standards For the purpose of this Standard, the terms and definitions from ECSS-S-ST-00-01 apply. 3.2 Terms specific to the present standard 3.2.1 associated test coupon small piece
