1、BSI Standards PublicationBS EN 16602-70-11:2015Space product assurance Procurement of printed circuitboardsBS EN 16602-70-11:2015 BRITISH STANDARDNational forewordThis British Standard is the UK implementation of EN16602-70-11:2015.The UK participation in its preparation was entrusted to TechnicalCo
2、mmittee ACE/68, Space systems and operations.A list of organizations represented on this committee can beobtained on request to its secretary.This publication does not purport to include all the necessaryprovisions of a contract. Users are responsible for its correctapplication. The British Standard
3、s Institution 2015. Published by BSI StandardsLimited 2015ISBN 978 0 580 86498 8ICS 31.180; 49.140Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 28 February 2015.
4、Amendments issued since publicationDate Text affectedBS EN 16602-70-11:2015EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 16602-70-11 January 2015 ICS 31.180; 49.140 English version Space product assurance - Procurement of printed circuit boards Assurance produit des projets spatiaux - Approvi
5、sionnement des circuits imprims Raumfahrtproduktsicherung - Beschaffung von LeiterplattenThis European Standard was approved by CEN on 11 October 2014. CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standa
6、rd the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC member. This European Standard exists in three official versio
7、ns (English, French, German). A version in any other language made by translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CEN and CENELEC members are the national standa
8、rds bodies and national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway,
9、Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom. CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2015 CEN/CENELEC All rights of exploitation in any form and by any means reserved worldwide for CEN national Members and for CENELEC
10、Members. Ref. No. EN 16602-70-11:2015 EBS EN 16602-70-11:2015EN 16602-70-11:2015 (E) 2 Table of contents Foreword 4 1 Scope . 5 2 Normative references . 6 3 Terms, definitions and abbreviated terms 7 3.1 Terms from other standards 7 3.2 Terms specific to the present standard . 7 3.3 Abbreviated term
11、s. 10 4 Principles 11 5 Requirements 12 5.1 Procurement of PCBs . 12 5.1.1 General . 12 5.1.2 Design and layout . 12 5.2 Base materials 13 5.2.1 Base laminate materials 13 5.2.2 Basic metallic layer . 14 5.2.3 Plated metallic layers and finishes 14 5.2.4 Special materials . 15 5.3 PCB delivery . 16
12、5.3.1 Marking . 16 5.3.2 Associated test coupons . 16 5.3.3 Outgoing inspection and PCB manufacturer data package . 17 5.4 Packaging . 17 5.4.1 Handling and storage 17 5.4.2 Packaging . 17 5.5 Supplier acceptance of PCBs . 18 5.5.1 Supplier acceptance inspection . 18 5.5.2 Electrical test . 18 6 Ins
13、pection of PCBs . 19 6.1 General . 19 BS EN 16602-70-11:2015EN 16602-70-11:2015 (E) 3 6.2 Visual inspection and non-destructive test 19 6.2.1 Verification of marking . 19 6.2.2 Visual aspects . 19 6.2.3 External dimensions 22 6.2.4 Warp . 23 6.2.5 Twist . 23 6.3 Microsection inspection criteria . 24
14、 6.3.1 General . 24 6.3.2 Thickness of metal-plating . 25 6.3.3 Aspect of plated-through holes 27 7 Requirements for PCBs . 30 7.1 Rigid single-sided and double-sided PCBs . 30 7.2 Rigid single-sided and double-sided PCBs for high frequency application 32 7.3 Flexible PCBs . 35 7.4 Rigid-flex PCBs 3
15、6 7.5 Rigid multilayer PCBs . 37 7.6 Sequential rigid multilayer PCBs . 39 Annex A (normative) PCB Certificate of conformance (CoC) DRD 43 Bibliography . 45 Figures Figure 6-1: Arbitrary defects on conductors 22 Figure 6-2: Arbitrary defects on spacing between conductors. 22 Figure 6-3: Misalignment
16、 of cover layer (for flexible PCBs) 22 Figure 6-4: Warp 23 Figure 6-5: Twist. 24 Figure 6-6: Dimensional parameters to be measured . 24 Figure 6-7: Microsection of a PTH 26 Figure 6-8: Undercut for PCBs with fused SnPb finish 27 Figure 6-9: Undercut for PCBs with Au/Ni or Au finish 27 Figure 6-10: O
17、verhang for PCBs with Au/Ni or Au finish . 27 Figure 6-11: Microsection in PTH: Possible defects 28 Figure 6-12: Microsection of PTH: Possible defects . 29 Figure 6-13: Voids in resin inside buried vias . 29 Figure A-1 : Example of a PCB CoC . 44 BS EN 16602-70-11:2015EN 16602-70-11:2015 (E) 4 Forew
18、ord This document (EN 16602-70-11:2015) has been prepared by Technical Committee CEN/CLC/TC 5 “Space”, the secretariat of which is held by DIN. This standard (EN 16602-70-11:2015) originates from ECSS-Q-ST-70-11C. This European Standard shall be given the status of a national standard, either by pub
19、lication of an identical text or by endorsement, at the latest by July 2015, and conflicting national standards shall be withdrawn at the latest by July 2015. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and/or CENELEC shal
20、l not be held responsible for identifying any or all such patent rights. This document has been prepared under a mandate given to CEN by the European Commission and the European Free Trade Association. This document has been developed to cover specifically space systems and has therefore precedence
21、over any EN covering the same scope but with a wider domain of applicability (e.g. : aerospace). According to the CEN-CENELEC Internal Regulations, the national standards organizations of the following countries are bound to implement this European Standard: Austria, Belgium, Bulgaria, Croatia, Cypr
22、us, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United
23、 Kingdom. BS EN 16602-70-11:2015EN 16602-70-11:2015 (E) 5 1 Scope This Standard defines the requirements imposed on the customer, the supplier and the qualified PCB manufacturer for PCB procurement. The requirements of clause 7 apply to both qualification and procurement of finished PCBs and do not
24、include the manufacturing tolerances. This Standard is applicable for the following type of boards: Rigid PCBs (single-sided, double-sided, multilayer, sequential multilayer and PCBs with metal core) Flexible PCBs (single-sided and double-sided) Rigid-flex PCBs (multilayer and sequential multilayer)
25、 High frequency PCBs Special PCBs. PCBs are used for the mounting of components in order to produce PCB assemblies performing complex electrical functions. The PCBs are subjected to thermo-mechanical stresses during their assembly such as mounting of components by soldering, rework and repair under
26、normal terrestrial conditions. In addition the assembled PCB is subjected to the environment imposed by launch and space flights. Therefore the qualification of a PCB supplier to ECSS-Q-ST-70-10 is of extreme importance before the procurement of PCB for space usage. This standard may be tailored for
27、 the specific characteristics and constraints of a space project in conformance with ECSS-S-ST-00. BS EN 16602-70-11:2015EN 16602-70-11:2015 (E) 6 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this ECSS Sta
28、ndard. For dated references, subsequent amendments to, or revision of any of these publications do not apply. However, parties to agreements based on this ECSS Standard are encouraged to investigate the possibility of applying the more recent editions of the normative documents indicated below. For
29、undated references, the latest edition of the publication referred to applies. EN reference Reference in text Title EN 16601-00-01 ECSS-S-ST-00-01 ECSS system Glossary of terms EN 16602-70 ECSS-Q-ST-70 Space product assurance Material, mechanical parts and processes EN 16602-70-02 ECSS-Q-ST-70-02 Sp
30、ace product assurance Thermal vacuum outgassing test for the screening of space materials EN 16602-70-07 ECSS-Q-ST-70-07 Space product assurance Verification and approval of automatic machine wave soldering EN 16602-70-08 ECSS-Q-ST-70-08 Space product assurance Manual soldering of high-reliability e
31、lectrical connections EN 16602-70-10 ECSS-Q-ST-70-10 Space product assurance Qualification of printed circuit boards EN 16602-70-28 ECSS-Q-ST-70-28 Space product assurance Repair and modification of printed circuit board assemblies for space use EN 16602-70-38 ECSS-Q-ST-70-38 Space product assurance
32、 High-reliability soldering for surface-mount and mixed technology printed-circuit boards IEC 60249 (1993-05) Base materials for printed circuits IEC 60326-2-am 1 (1992-06) Printed boards. Part 2: Test methods IPC-4101 Specification for base materials for rigid and mulitlayer printed boards IPC-MF-1
33、50F Metal foil for printed wiring applications IPC-CF-152B Composite metallic material specification for printed wiring board BS EN 16602-70-11:2015EN 16602-70-11:2015 (E) 7 3 Terms, definitions and abbreviated terms 3.1 Terms from other standards For the purpose of this Standard, the terms and defi
34、nitions from ECSS-S-ST-00-01 apply. 3.2 Terms specific to the present standard 3.2.1 associated test coupon small piece of PCB designated to have a limited specific set of tests performed NOTE The associated test coupon is manufactured as part of a PCB and at the final manufacturing stage it is sepa
35、rated from it. The associated test coupon is thus associated with the PCB, with which it was simultaneously manufactured. 3.2.2 blister delamination in the form of a localized swelling and separation between any of the layers of a lamination base material, or between base material and conductive foi
36、l or protective coating IEC 60194 (1999-04) 3.2.3 cover layer (flexible circuit) layer of insulating material that is applied covering totally or partially over a conductive pattern on the outer surfaces of a PCB IEC 60194 (1999-04) 3.2.4 crazing internal condition that occurs in reinforced base mat
37、erial whereby glass fibres are separated from the resin at the weave intersections NOTE 1 This condition manifests itself in the form of connected white spots or crosses that are below the surface of the base material. It is usually related to mechanically induced stress. NOTE 2 See also “measling”.
38、 IEC 60194 (1999-04) BS EN 16602-70-11:2015EN 16602-70-11:2015 (E) 8 3.2.5 delamination separation between plies within a base material, between base material and a conductive foil, or any other planar separation with a PCB NOTE See also “blister”. IEC 60194 (1999-04) 3.2.6 dewetting condition that
39、results when molten solder coats a surface and then recedes to leave irregularly-shaped mounds of solder that are separated by areas that are covered with a thin film of solder and with the basis metal not exposed IEC 60194 (1999-04) 3.2.7 flexible PCB PCB either single, double sided or multilayer c
40、onsisting of a printed circuit or printed wiring using flexible base materials only IEC 60194 (1999-04) 3.2.8 haloing mechanically-induced fracturing or delamination, on or below the surface of a base material, that is usually exhibited by a light area around holes or other machined features IEC 601
41、94 (1999-04) 3.2.9 high frequency PCB PCB used for high frequency applications, that has specific requirements to the dielectric properties of the base laminates as well as special dimensional requirements to the lay-out for electrical purposes 3.2.10 inclusions foreign particles, metallic or non-me
42、tallic, that may be entrapped in an insulating material, conductive layer, plating, base material or solder connection IEC 60194 (1999-04) 3.2.11 key personnel personnel with specialist knowledge responsible for defined production or product assurance areas 3.2.12 measling condition that occurs in l
43、aminated base material in which internal glass fibres are separated from the resin at the weave intersection NOTE 1 This condition manifests itself in the form of discrete white spots or “crosses” that are below the surface of the base material. It is usually related to thermally-induced stress. NOT
44、E 2 See also “crazing”. IEC 60194 (1999-04) BS EN 16602-70-11:2015EN 16602-70-11:2015 (E) 9 3.2.13 metal core PCB PCB using a metal core base material IEC 60194 (1999-04) 3.2.14 multilayer PCB PCB that consist of rigid or flexible insulation materials and three or more alternate printed wiring and/o
45、r printed circuit layers that have been bonded together and electrically interconnected IEC 60194 (1999-04) 3.2.15 prepreg sheet of material that has been impregnated with a resin and cured to an intermediate stage NOTE B-staged resin. IEC 60194 (1999-04) 3.2.16 printed circuit board (PCB) printed b
46、oard that provides both point-to-point connections and printed components in a predetermined arrangement on a common base NOTE This includes single-sided, double sided and multilayer PCBs with rigid, flexible, and rigid-flex base materials. IEC 60194 (1999-04) 3.2.17 rigid double-sided PCB double-si
47、ded PCB, either printed circuit or printed wiring, using rigid base materials only IEC 60194 (1999-04) 3.2.18 rigid-flex PCB PCB with both rigid and flexible base materials IEC 60194 (1999-04) 3.2.19 rigid-flex double-sided PCB double-sided PCB, either printed circuit or printed wiring, using combin
48、ations of rigid and flexible base materials IEC 60194 (1999-04) 3.2.20 rigid-flex multilayer PCB multilayer PCB, either printed circuit or printed wiring, using combinations of rigid multilayer and flexible single and double-sided base materials 3.2.21 rigid PCB PCB using rigid base materials only I
49、EC 60194 (1999-04) BS EN 16602-70-11:2015EN 16602-70-11:2015 (E) 10 3.2.22 rigid single-sided PCB single-sided PCB, either printed circuit or printed wiring, using rigid base materials only IEC 60194 (1999-04) 3.2.23 rigid multilayer PCB multilayer PCB, either printed circuit or printed wiring, using rigid base materials only IEC 60194 (1999-04) 3.2.24 scratch narrow furrow or grove in a surface NOTE It is usually shallow and caused by the marking or rasping of the surface with a pointed or sharp object. IEC 60194 (199
