1、BSI Standards PublicationBS EN 16603-20-06:2014Space engineering Spacecraft chargingBS EN 16603-20-06:2014 BRITISH STANDARDNational forewordThis British Standard is the UK implementation of EN 16603-20-06:2014.The UK participation in its preparation was entrusted to Technical Committee ACE/68, Space
2、 systems and operations.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2014
3、.Published by BSI Standards Limited 2014ISBN 978 0 580 83976 4ICS 49.140Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 July 2014.Amendments/corrigenda issued
4、 since publicationDate T e x t a f f e c t e dBS EN 16603-20-06:2014EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 16603-20-06 July 2014 ICS 49.140 English version Space engineering - Spacecraft charging Ingnirie spatiale - Charges lectrostatique des vehicules spatiales Raumfahrttechnik - Aufl
5、adung von Raumfahrzeugen This European Standard was approved by CEN on 10 February 2014. CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up
6、-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language m
7、ade by translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria,
8、 Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, S
9、witzerland, Turkey and United Kingdom. CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2014 CEN/CENELEC All rights of exploitation in any form and by any means reserved worldwide for CEN national Members and for CENELEC Members. Ref. No. EN 16603-20-06:2014 EBS EN 16603-20-06:2014EN
10、 16603-20-06:2014 (E) 2 Table of contents Foreword 9 Introduction 10 1 Scope . 12 2 Normative references . 13 3 Terms, definitions and abbreviated terms 14 3.1 Terms defined in other standards . 14 3.2 Terms specific to the present standard . 14 3.3 Abbreviated terms. 17 4 Overview 19 4.1 Plasma int
11、eraction effects . 19 4.1.1 Presentation 19 4.1.2 Most common engineering concerns . 19 4.1.3 Overview of physical mechanisms 20 4.2 Relationship with other standards . 22 5 Protection programme . 24 6 Surface material requirements 25 6.1 Overview 25 6.1.1 Description and applicability 25 6.1.2 Purp
12、ose common to all spacecraft 26 6.1.3 A special case: scientific spacecraft with plasma measurement instruments . 26 6.2 General requirements . 26 6.2.1 Maximum permitted voltage 26 6.2.2 Maximum resistivity . 27 6.3 Electrical continuity, including surfaces and structural and mechanical parts 27 6.
13、3.1 Grounding of surface metallic parts . 27 6.3.2 Exceptions 28 6.3.3 Electrical continuity for surface materials 29 BS EN 16603-20-06:2014EN 16603-20-06:2014 (E) 3 6.4 Surface charging analysis . 32 6.5 Deliberate potentials . 32 6.6 Testing of materials and assemblies . 32 6.6.1 General . 32 6.6.
14、2 Material characterization tests . 33 6.6.3 Material and assembly qualification . 34 6.7 Scientific spacecraft with plasma measurement instruments 34 6.8 Verification 35 6.8.1 Grounding . 35 6.8.2 Material selection 35 6.8.3 Environmental effects 35 6.8.4 Computer modelling 36 6.9 Triggering of ESD
15、 . 36 7 Secondary arc requirements . 37 7.1 Description and applicability . 37 7.2 Solar arrays 38 7.2.1 Overview . 38 7.2.2 General requirement . 38 7.2.3 Testing of solar arrays . 38 7.3 Other exposed parts of the power system including solar array drive mechanisms . 42 8 High voltage system requi
16、rements . 44 8.1 Description . 44 8.2 Requirements . 44 8.3 Validation 44 9 Internal parts and materials requirements . 45 9.1 Description . 45 9.2 General . 45 9.2.1 Internal charging and discharge effects . 45 9.2.2 Grounding and connectivity . 45 9.2.3 Dielectric electric fields and voltages . 46
17、 9.3 Validation 47 10 Tether requirements . 50 10.1 Description . 50 10.2 General . 50 BS EN 16603-20-06:2014EN 16603-20-06:2014 (E) 4 10.2.1 Hazards arising on tethered spacecraft due to voltages generated by conductive tethers . 50 10.2.2 Current collection and resulting problems . 50 10.2.3 Hazar
18、ds arising from high currents flowing through the tether and spacecraft structures . 51 10.2.4 Continuity of insulation. . 51 10.2.5 Hazards from undesired conductive paths 51 10.2.6 Hazards from electro-dynamic tether oscillations 51 10.2.7 Other effects . 51 10.3 Validation 52 11 Electric propulsi
19、on requirements . 53 11.1 Overview 53 11.1.1 Description 53 11.1.2 Coverage of the requirements . 53 11.2 General . 55 11.2.1 Spacecraft neutralization . 55 11.2.2 Beam neutralization 56 11.2.3 Contamination . 56 11.2.4 Sputtering . 57 11.2.5 Neutral gas effects 57 11.3 Validation 57 11.3.1 Ground t
20、esting 57 11.3.2 Computer modelling characteristics 58 11.3.3 In-flight monitoring. 58 11.3.4 Sputtering . 58 11.3.5 Neutral gas effects 58 Annex A (normative) Electrical hazard mitigation plan - DRD 60 A.1 DRD identification . 60 A.1.1 Requirement identification and source document 60 A.1.2 Purpose
21、 and objective . 60 A.2 Expected response . 60 A.2.1 Scope and content 60 A.2.2 Special remarks 61 Annex B (informative) Tailoring guidelines 62 B.1 Overview 62 B.2 LEO 62 B.2.1 General . 62 BS EN 16603-20-06:2014EN 16603-20-06:2014 (E) 5 B.2.2 LEO orbits with high inclination . 63 B.3 MEO and GEO o
22、rbits 63 B.4 Spacecraft with onboard plasma detectors . 63 B.5 Tethered spacecraft 64 B.6 Active spacecraft 64 B.7 Solar Wind 64 B.8 Other planetary magnetospheres 64 Annex C (informative) Physical background to the requirements 65 C.1 Introduction . 65 C.2 Definition of symbols . 65 C.3 Electrostat
23、ic sheaths . 65 C.3.1 Introduction . 65 C.3.2 The electrostatic potential . 66 C.3.3 The Debye length 66 C.3.4 Presheath . 67 C.3.5 Models of current through the sheath 68 C.3.6 Thin sheath space-charge-limited model 68 C.3.7 Thick sheath orbit motion limited (OML) model 69 C.3.8 General case . 70 C
24、.3.9 Magnetic field modification of charging currents 70 C.4 Current collection and grounding to the plasma 70 C.5 External surface charging . 71 C.5.1 Definition . 71 C.5.2 Processes . 71 C.5.3 Effects . 72 C.5.4 Surface emission processes . 72 C.5.5 Floating potential . 73 C.5.6 Conductivity and r
25、esistivity 74 C.5.7 Time scales . 76 C.6 Spacecraft motion effects . 76 C.6.1 Wakes . 76 C.6.2 Motion across the magnetic field . 79 C.7 Induced plasmas 80 C.7.1 Definition . 80 C.7.2 Electric propulsion thrusters 81 C.7.3 Induced plasma characteristics . 81 C.7.4 Charge-exchange effects 82 BS EN 16
26、603-20-06:2014EN 16603-20-06:2014 (E) 6 C.7.5 Neutral particle effects 83 C.7.6 Effect on floating potential . 83 C.8 Internal and deep-dielectric charging 83 C.8.1 Definition . 83 C.8.2 Relationship to surface charging . 84 C.8.3 Charge deposition . 85 C.8.4 Material conductivity 85 C.8.5 Time depe
27、ndence . 88 C.8.6 Geometric considerations 88 C.8.7 Isolated internal conductors 89 C.8.8 Electric field sensitive systems 89 C.9 Discharges and transients 90 C.9.1 General definition 90 C.9.2 Review of the process . 90 C.9.3 Dielectric material discharge. 91 C.9.4 Metallic discharge . 93 C.9.5 Inte
28、rnal dielectric discharge . 94 C.9.6 Secondary powered discharge 95 C.9.7 Discharge thresholds 95 Annex D (informative) Charging simulation . 97 D.1 Surface charging codes 97 D.1.1 Introduction . 97 D.2 Internal charging codes 99 D.2.1 DICTAT . 99 D.2.2 ESADDC . 99 D.2.3 GEANT-4 100 D.2.4 NOVICE 100
29、 D.3 Environment model for internal charging . 100 D.3.1 FLUMIC 100 D.3.2 Worst case GEO spectrum 100 Annex E (informative) Testing and measurement. . 101 E.1 Definition of symbols . 101 E.2 Solar array testing. 101 E.2.1 Solar cell sample . 101 E.2.2 Pre-testing of the solar array simulator (SAS) .
30、 102 E.2.3 Solar array test procedure . 104 E.2.4 Other elements . 108 BS EN 16603-20-06:2014EN 16603-20-06:2014 (E) 7 E.2.5 The solar panel simulation device . 109 E.3 Measurement of conductivity and resistivity 110 E.3.1 Determination of intrinsic bulk conductivity by direct measurement . 110 E.3.
31、2 Determination of radiation-induced conductivity coefficients by direct measurement 112 E.3.3 Determination of conductivity and radiation-induced conductivity by electron irradiation. 113 E.3.4 The ASTM method for measurement of surface resistivity and its adaptation for space used materials 113 Re
32、ferences . 115 Bibliography . 119 Figures Figure 6-1: Applicability of electrical continuity requirements 29 Figure 7-1: Solar array test set-up 41 Figure C-1 : Schematic diagram of potential variation through sheath and pre-sheath. 67 Figure C-2 : Example secondary yield curve 73 Figure C-3 : Schem
33、atic diagram of wake structure around an object at relative motion with respect to a plasma . 77 Figure C-4 : Schematic diagram of void region . 78 Figure C-5 : Schematic diagram of internal charging in a planar dielectric 84 Figure C-6 : Dielectric discharge mechanism. 92 Figure C-7 :Shape of the c
34、urrent in relation to discharge starting point. 92 Figure C-8 : Example of discharge on pierced aluminized Teflon irradiated by electrons with energies ranging from 0 to 220 keV. 93 Figure C-9 : Schematic diagram of discharge at a triple point in the inverted voltage gradient configuration with pote
35、ntial contours indicated by colour scale. 94 Figure E-1 : Photograph of solar cells sample Front face & Rear face (Stentor Sample. Picture from Denis Payan - CNES). 102 Figure E-2 : Schematic diagram of power supply test circuit . 103 Figure E-3 : Example of a measured power source switch response 1
36、03 Figure E-4 : Example solar array simulator . 104 Figure E-5 : Absolute capacitance of the satellite . 105 Figure E-6 : Junction capacitance of a cell versus to voltage 107 Figure E-7 : The shortened solar array sample and the missing capacitances . 108 Figure E-8 : Discharging circuit oscillation
37、s 109 Figure E-9 : Effect of an added resistance in the discharging circuit (SAS + resistance) 109 Figure E-10 : Setup simulating the satellite including flashover current 110 BS EN 16603-20-06:2014EN 16603-20-06:2014 (E) 8 Figure E-11 : Basic arrangement of apparatus for measuring dielectric conduc
38、tivity in planar samples . 111 Figure E-12 : Arrangement for measuring cable dielectric conductivity and cross-section through co-axial cable 111 Figure E-13 : Arrangement for carrying out conductivity tests on planar samples under irradiation . 112 Figure E-14 : Basic experimental set up for surfac
39、e conductivity 114 Tables Table 4-1: List of electrostatic and other plasma interaction effects on space systems . 21 Table 7-1: Tested voltage-current combinations . 38 Table 7-2: Typical inductance values for cables . 42 Table C-1 : Parameters in different regions in space 67 Table C-2 : Typical p
40、lasma parameters for LEO and GEO . 78 Table C-3 : Plasma conditions on exit plane of several electric propulsion thrusters 82 Table C-4 : Emission versus backflow current magnitudes for several electric propulsion thrusters 82 Table C-5 : Value of Eafor several materials 86 BS EN 16603-20-06:2014EN
41、16603-20-06:2014 (E) 9 Foreword This document (EN 16603-20-06:2014) has been prepared by Technical Committee CEN/CLC/TC 5 “Space”, the secretariat of which is held by DIN. This standard (EN 16603-20-06:2014) originates from ECSS-E-ST-20-06C. This European Standard shall be given the status of a nati
42、onal standard, either by publication of an identical text or by endorsement, at the latest by January 2015, and conflicting national standards shall be withdrawn at the latest by January 2015. Attention is drawn to the possibility that some of the elements of this document may be the subject of pate
43、nt rights. CEN and/or CENELEC shall not be held responsible for identifying any or all such patent rights. This document has been developed to cover specifically space systems and has therefore precedence over any EN covering the same scope but with a wider domain of applicability (e.g. : aerospace)
44、. According to the CEN-CENELEC Internal Regulations, the national standards organizations of the following countries are bound to implement this European Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, G
45、ermany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.” BS EN 16603-20-06:2014EN 16603-20-06:2014 (E) 10 Introduction The subject of spacecr
46、aft plasma interactions has been part of the spacecraft design process since spacecraft surface charging was first encountered as a problem in the earliest geostationary spacecraft. However, spacecraft surface charging is only one of the ways in which the space environment can adversely affect the e
47、lectrical state of spacecraft and satellite technology has evolved over the years. A need was identified for a standard that is up to date and comprehensive in its treatment of all the main environment-induced plasma and charging processes that can affect the performance of satellites in geostationa
48、ry and medium and low Earth orbits. This standard is intended to be used by a number of users, with their own design rules, and therefore it has been done to be compatible with different alternative approaches. This document aims to satisfy these needs and provides a consistent standard that can be
49、used in design specifications. The requirements are based on the best current understanding of the processes involved and are not radical, building on existing de-facto standards in many cases. As well as providing requirements, it aims to provide a straightforward brief explanation of the main effects so that interested parties at all stages of the design chain can have a common understanding of the problems faced and the meaning of the terms used. Guide for tailoring of the provisions for specific mission types are described in Annex B. Further description of the main pro
