1、BRITISH STANDARD BS EN 50390:2004 Space product assurance The manual soldering of high-reliability electrical connections The European Standard EN 50390:2004 has the status of a British Standard ICS 49.060 BS EN 50390:2004 This British Standard was published under the authority of the Standards Poli
2、cy and Strategy Committee on 14 September 2004 BSI 14 September 2004 ISBN 0 580 44466 X National foreword This British Standard is the official English language version of EN 50390:2004. The UK participation in its preparation was entrusted to Technical Committee GEL/107, Process management for avio
3、nics, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue under
4、 the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct appli
5、cation. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; mo
6、nitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 67 and a back cover. The BSI copyright notice displayed in this document indicates when the document was l
7、ast issued. Amendments issued since publication Amd. No. Date CommentsEUROPEAN STANDARD EN 50390 NORME EUROPENNE EUROPISCHE NORM July 2004 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung
8、Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2004 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 50390:2004 E ICS 49.060 English version Space product assurance The manual soldering of high-reliability electrical co
9、nnections Conformit pour les produits spatiaux - Manuel de soudabilit des connexions lectriques de haute fiabilit Raumfahrt-Produktsicherung Handlten elektrischer Verbindungen hoher Zuverlssigkeit This European Standard was approved by CENELEC on 2004-04-01. CENELEC members are bound to comply with
10、the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat
11、 or to any CENELEC member. This European Standard exists in two official versions (English, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official vers
12、ions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain
13、, Sweden, Switzerland and United Kingdom. EN 50390:2004 - 2 - Foreword This European Standard has been prepared by the former CENELEC BTTF 91-3, Space equipment standardization, the work of which has been transferred by 113 BT to CENELEC TC 107X, Process management for avionics. It is based on a pre
14、vious version 1)originally prepared by the ECSS Product Assurance Working Group, reviewed by the ECSS Technical Panel and approved by the ECSS Steering Board. The European Cooperation for Space Standardization (ECSS) is a cooperative effort of the European Space Agency, National Space Agencies and E
15、uropean industry associations for the purpose of developing and maintaining common standards. This European Standard is one of the series of space standards intended to be applied together for the management, engineering and product assurance in space projects and applications. Requirements in this
16、European Standard are defined in terms of what shall be accomplished, rather than in terms of how to organize and perform the necessary work. This allows existing organizational structures and methods to be applied where they are effective, and for the structures and methods to evolve as necessary w
17、ithout rewriting the standards. The formulation of this European Standard takes into account the existing ISO 9000 family of documents. The text of the draft was submitted to the formal vote and was approved by CENELEC as EN 50390 on 2004-04-01. The following dates were fixed: - latest date by which
18、 the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2005-04-01 - latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2007-04-01 1)ECSS-Q-70-08A. - 3 - EN 50390:2004 Contents Page Introduct
19、ion.8 1 Scope.8 2 Normative references.8 3 Terms, definitions and abbreviated terms .9 3.1 Terms and definitions 9 3.2 Abbreviated terms.17 4 Principles and prerequisites of reliable soldered connections .17 4.1 Principles17 4.2 Prerequisites.18 5 Preparatory conditions18 5.1 Facility cleanliness18
20、5.2 Environmental conditions19 5.3 Precautions against static charges 19 5.4 Lighting requirements19 5.5 Equipment and tools20 5.5.1 Brushes.20 5.5.2 Files20 5.5.3 Cutters and pliers 20 5.5.4 Bending tools20 5.5.5 Clinching tools.21 5.5.6 Insulation strippers21 5.5.7 Soldering irons and resistance s
21、oldering equipment 21 5.5.8 Non-contact heat sources21 5.5.9 Soldering tools22 5.5.10 Defective or uncalibrated equipment or tools .22 6 Materials selection.22 6.1 Solder.22 6.1.1 Form22 6.1.2 Composition22 6.1.3 Melting temperatures and choice .22 6.2 Flux.22 6.2.1 Rosin-based fluxes22 6.2.2 Corros
22、ive acid fluxes .23 6.3 Solvents24 6.3.1 Acceptable solvents.24 6.3.2 Drying.24 6.4 Flexible insulation materials24 6.5 Terminals24 6.5.1 Preferred terminals24 6.5.2 Tin-, silver- and gold-plated terminals24 6.5.3 Shape of terminals25 6.6 Wires25 6.7 PCBs.25 6.7.1 Boards.25 6.7.2 Plated-through hole
23、s.25 EN 50390:2004 - 4 - 6.7.3 Tin-lead finish on conductors.25 6.7.4 Gold finish on conductors 25 6.8 Conformal coating, staking compounds and potting materials25 7 Preparation for soldering 26 7.1 Preparation of conductors, terminals and solder cups26 7.1.1 Insulation removal.26 7.1.2 Damage to in
24、sulation.26 7.1.3 Damage to conductors.26 7.1.4 Insulation clearance26 7.1.5 Surface to be soldered 26 7.1.6 De-golding and pre-tinning of conductors 27 7.2 Preparation of the soldering bit27 7.2.1 Inspection27 7.2.2 Maintenance27 7.2.3 Copper bits for special soldering applications 28 7.2.4 Plated
25、bits.28 7.2.5 Tip in operation .28 7.3 Maintenance of resistance-type soldering electrodes.28 7.4 Handling (work station)28 7.5 Storage (work station) .28 7.5.1 Components28 7.5.2 PCBs.28 7.5.3 Materials requiring segregation28 7.5.4 Traceability28 7.6 Baking of PCBs .28 8 Mounting of components.29
26、8.1 General requirements29 8.1.1 Introduction.29 8.1.2 Heavy components29 8.1.3 Metal-case components.29 8.1.4 Glass-encased components.29 8.1.5 Stress relief.29 8.1.6 Reinforced plated-through holes31 8.1.7 Lead and conductor cutting31 8.1.8 Heat-generating components.31 8.1.9 Moulded components.31
27、 8.1.10 Hook-up wire.31 8.1.11 Location31 8.1.12 Conformal coating, cementing and encapsulation 31 8.2 Lead bending requirements .31 8.2.1 General.31 8.2.2 Components with leads terminating on the opposite side of a PCB 32 8.2.3 Components with leads terminating on the same side of a PCB.32 8.2.4 Co
28、nductors terminating on both sides of a non-plated-through hole.32 8.2.5 Non-bendable leads.33 8.3 Mounting of terminals to PCB 33 8.3.1 General.33 8.3.2 Methods of attachment 33 - 5 - EN 50390:2004 8.4 Lead attachment to PCBs34 8.4.1 General.34 8.4.2 Lead access holes.34 8.4.3 Clinched leads.36 8.4
29、.4 Stud leads.36 8.4.5 Lapped round leads.37 8.4.6 Lapped ribbon leads37 8.4.7 Lapped round- and ribbon-lead parts with solder connection on same side .38 8.5 Mounting of components to terminals 39 8.5.1 General.39 8.5.2 Special constraints39 8.6 Cordwood modules40 8.7 Mounting of connectors to PCBs
30、 .40 8.7.1 General.40 8.7.2 Special constraints40 9 Attachment of conductors to terminals, solder cups and cables 41 9.1 General.41 9.1.1 Conductors41 9.1.2 Terminals41 9.1.3 Component leads41 9.2 Wire termination41 9.2.1 Breakouts from cables.41 9.2.2 Minimum and maximum insulation clearance .41 9.
31、2.3 Multiple parallel entry 41 9.2.4 Variations41 9.2.5 Solid hook-up wire.41 9.2.6 Stress relief.41 9.2.7 Mechanical support .41 9.3 Turret and straight pin terminals42 9.3.1 Side route42 9.3.2 Bottom route42 9.4 Bifurcated terminals43 9.4.1 General.43 9.4.2 Bottom route43 9.4.3 Side route44 9.4.4
32、Top route.45 9.4.5 Combination of top and bottom routes .45 9.4.6 Combination of side and bottom routes45 9.5 Hook terminals 45 9.6 Pierced terminals45 9.7 Solder cups (connector type).47 9.8 Insulation tubing application 47 9.9 Wire and cable interconnections47 9.9.1 General.47 9.9.2 Preparation of
33、 wires 47 9.9.3 Preparation of shielded wires and cables.48 9.9.4 Pre-assembly48 9.9.5 Soldering procedures 48 EN 50390:2004 - 6 - 9.9.6 Cleaning49 9.9.7 Inspection49 9.9.8 Workmanship.49 9.9.9 Sleeving of interconnection49 9.10 Connection of stranded wires to PCBs.49 10 Soldering to terminals and P
34、CBs 51 10.1 General.51 10.1.1 Securing conductors51 10.1.2 Insulation sleeving, potting or coating51 10.1.3 Thermal shunts51 10.1.4 High-voltage connections51 10.2 Solder application to terminals 51 10.2.1 Soldering of swaged terminals onto PCBs .51 10.2.2 Soldering of conductors onto terminals (exc
35、ept cup)51 10.2.3 Soldering of conductors onto cup terminals .51 10.3 Solder application to PCB51 10.3.1 Solder coverage51 10.3.2 Solder fillets52 10.3.3 Soldering of component leads to plated-through holes.52 10.3.4 Solder application52 10.4 Wicking.52 10.5 Solder rework52 11 Cleaning of PCB assemb
36、lies.52 11.1 General.52 11.2 Ultrasonic cleaning52 11.3 Monitoring for cleanliness53 11.3.1 Cleanliness testing53 11.3.2 Testing frequency53 11.3.3 Test limits53 11.3.4 Test methods.53 12 Final inspection54 12.1 General.54 12.2 Acceptance criteria54 12.3 Rejection criteria.54 13 Verification.55 13.1
37、 General.55 13.2 Temperature cycling55 13.3 Vibration55 14 Quality assurance.56 14.1 General.56 14.2 Data56 14.3 Non-conformance56 14.4 Calibration.56 14.5 Traceability.56 14.6 Workmanship standards56 14.7 Inspection.56 14.8 Operator and inspector training and certification57 Annex A (informative) T
38、ypical satisfactory and unsatisfactory solder connections .58 - 7 - EN 50390:2004 Figures Figure 1 Profiles of correct and incorrect cutters for trimming leads20 Figure 2 Non-approved types of mechanical strippers .21 Figure 3 Stress relieved component terminations on PCB.30 Figure 4 Minimum lead be
39、nd 32 Figure 5 Component and solder termination on the same side32 Figure 6 Leads with solder termination on both sides .33 Figure 7 Types of terminal swaging 34 Figure 8 Clinched-lead terminations - unsupported holes35 Figure 9 Clinched lead terminations - plated through-holes.35 Figure 10 Stud ter
40、minations37 Figure 11 Through-hole lapped terminations.38 Figure 12 Design dimensions for single-surface lapped terminations. .39 Figure 13 Method of stress relieving parts attached to terminals.40 Figure 14 Side- and bottom-route connections to turret terminals .42 Figure 15 Bottom-route connection
41、s to bifurcated terminal .43 Figure 16 Side-route connection to bifurcated terminal .44 Figure 17 Top-route connection to bifurcated terminal 45 Figure 18 Connections to hook terminals46 Figure 19 Connections to pierced terminals46 Figure 20 Connections to solder cups (connector type) 47 Figure 21 M
42、ethods for securing wires .49 Figure 22 Stranded wires to PCBs50 Figure A.1 Soldered clinched terminals.58 Figure A.2 Soldered stud terminals.59 Figure A.3 Soldered turret terminals .60 Figure A.4 Soldered turret terminals .61 Figure A.5 Soldered bi furcated terminals62 Figure A.6 Soldered hook term
43、inals63 Figure A.7 Soldered cup terminals64 Figure A.8 Hand-soldered wire to shielded cable interconnections65 Figure A.9 Hand-soldered wire to shielded wire interconnections 66 Figure A.10 Hand-soldered wire interconnections details of defects.67 Tables Table 1 Chemical compositio n of spacecraft s
44、olders.23 Table 2 Guide to choice of solder types23 Table 3 Insulation clearance.26 Table 4 Dimensions for Figure 22.50 Table 5 Cleanliness test values 54 Table 6 Minimum severity for vibration testing 55 EN 50390:2004 - 8 - Introduction The main part of this standard is based on recommendations fro
45、m the National Aeronautics and Space Administration, and European soldering technology experts. Modifications have been incorporated into the text to provide for the specific requirement of low-outgassing electrical systems which are required by scientific and application satellites. Other additions
46、 have been made in the light of recent technological advances and results of metallurgical test programmes. The methods and workmanship contained in this standard are considered to be fully approved for normal spacecraft requirements. 1 Scope This standard defines the technical requirements and qual
47、ity assurance provisions for the manual soldering of high-reliability electrical connections intended for use in spacecraft and associated equipment. The rigorous requirements set by this standard ensure the high reliability of hand-soldered electrical connections intended to withstand normal terres
48、trial conditions and the vibrational G-loads and environment imposed by space flight. The proper tools, correct materials, design and workmanship are covered by this standard. Acceptance and rejection criteria are stated and some workmanship standards are included to discriminate between proper and
49、improper work. Wave-soldering processes and surface mount technologies are specified in separate documents, and those processes require to be verified as prescribed in the respective standard. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the refer
