1、BSI Standards PublicationMechanical standardization of semiconductor devicesPart 4: Coding system and classification into forms of package outlines for semiconductor device packagesBS EN 60191-4:2014Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy No
2、t for ResaleNo reproduction or networking permitted without license from IHS-,-,-National forewordThis British Standard is the UK implementation of EN 60191-4:2014. It is identical to IEC 60191-4:2013. It supersedes BS EN 60191-4:2000 which is withdrawn.The UK participation in its preparation was en
3、trusted to TechnicalCommittee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct application. The British
4、 Standards Institution 2014.Published by BSI Standards Limited 2014ISBN 978 0 580 71530 3ICS 31.080.01Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 31 March 2014
5、.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 60191-4:2014Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-EUROPEAN STANDARD E
6、N 60191-4 NORME EUROPENNE EUROPISCHE NORM March 2014 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels 2014 CENELEC - All
7、rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60191-4:2014 E ICS 31.080 Supersedes EN 60191-4:1999 + A1:2002 + A2:2002 English version Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms o
8、f package outlines for semiconductor device packages (IEC 60191-4:2013) Normalisation mcanique des dispositifs semiconducteurs - Partie 4: Systme de codification et classification en formes des botiers pour dispositifs semiconducteurs (CEI 60191-4:2013) Mechanische Normung von Halbleiterbauelementen
9、 - Teil 4: Codierungssystem fr Gehuse und Eingruppierung der Gehuse nach der Gehuseform fr Halbleiterbauelemente (IEC 60191-4:2013) This European Standard was approved by CENELEC on 2013-11-14. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditio
10、ns for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exist
11、s in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the natio
12、nal electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Port
13、ugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. BS EN 60191-4:2014Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-EN 601
14、91-4:2014 - 2 - Foreword The text of document 47D/837/FDIS, future edition 3 of IEC 60191-4, prepared by SC 47D, Semiconductor devices packaging, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-4:2014. The following dates we
15、re fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2014-09-21 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2016-11-14 This European Standard supersede
16、s EN 60191-4:1999 and its Amendments A1:2002 and A2:2002. EN 60191-4:2014 includes the following significant changes with respect to EN 60191-4:1999: a) Material code “S“ is added to indicate a silicon based package. b) Description of “WL“ is added to be used for general use. Attention is drawn to t
17、he possibility that some of the elements of this document may be the subject of patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60191-4:2013 was approved by CENELEC as a European
18、 Standard without any modification. BS EN 60191-4:2014Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Not for ResaleNo reproduction or networking permitted without license from IHS-,-,- 2 60191-4 IEC:2013 CONTENTS 1 Scope . 5 2 Coding system of pack
19、age outlines for semiconductor devices 5 3 Classification into forms of package outlines for semiconductor devices 5 4 Coding system for semiconductor-device packages . 6 4.1 General . 6 4.2 New descriptive codes . 6 4.3 Descriptive designators 6 4.3.1 General remarks 6 4.3.2 Minimum descriptive des
20、ignator . 6 4.3.3 Terminal-position prefix 8 4.3.4 Package-body-material prefix . 8 4.3.5 Package-specific feature prefix 9 4.3.6 Lead-form and terminal-count suffixes . 9 4.3.7 Detailed information field . 11 5 Coding system of package-outline styles . 12 Annex A (informative) Examples of descripti
21、ve coding system application . 15 Annex B (informative) Derivation and application of the descriptive coding system Common package names 22 Figure 1 Descriptive coding for semiconductor device packages . 7 Figure 2 Relationship of codes to profile . 10 Figure A.1 Typical package styles and descripti
22、ve coding system (1 of 4) . 17 Figure A.2 Examples of lead forms (or terminal shapes) . 21 Figure B.1 Descriptive coding system for common name of semiconductor-device package 22 Table 1 Package-outline-style codes. 8 Table 2 Terminal-position prefixes 9 Table 3 Prefixes for predominant package-body
23、 material 10 Table 4 Prefixes for package-specific features 10 Table 5 Suffixes for lead form (or terminal shape) . 12 Table A.1 Descriptive coding system application . 16 Table B.1 Basic package code and names 23 Table B.2 Common package name and descriptive code examples . 24 BS EN 60191-4:2014Cop
24、yright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-60191-4 IEC:2013 5 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 4: Coding system and classification into form
25、s of package outlines for semiconductor device packages 1 Scope This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators
26、 for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. 2 Coding system of package outlines for semiconductor devices The following coding system will be used in the publications concernin
27、g mechanical standardization: first: a three-digit serial number (000 to 999); second: a single reference letter indicating the form as shown in Table 1; third: a two-digit serial number (00 to 99) to indicate a variant of an outline drawing. The use of prefix P to indicate a provisional drawing rem
28、ains unchanged. Examples 101A00 050G13 P 101F01 3 Classification into forms of package outlines for semiconductor devices The package outline drawings for semiconductor devices are classified into forms according to the following scheme: form A: single-ended form B: heat-sink-mounted form C: stud-mo
29、unted form D: axial-leaded form E: surface-mounted form F: single-ended, heat-sink-mounted form G: dual and quad in-line form H: axial lead-less. BS EN 60191-4:2014Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Not for ResaleNo reproduction or netw
30、orking permitted without license from IHS-,-,- 6 60191-4 IEC:2013 4 Coding system for semiconductor-device packages 4.1 General The standard coding system is a method for identifying the physical features of an electronic device package family. The system is predicated upon a minimum two-character d
31、esignator, which indicates the package outline style. This designator can be extended, through the use of optional, user-selected fields, to provide additional package information such as terminal position and count, terminal form, package shape, and predominant body material. 4.2 New descriptive co
32、des If a new package that does not conform to one of the designated field character codes is being proposed, a new code may be recommended for standardization. 4.3 Descriptive designators 4.3.1 General remarks The package outline style code is the only compulsory field within this descriptive design
33、ation system. Additional information may be provided using optional prefixes and suffixes described by the system. In general, these fields are independent of one another. Unless otherwise indicated herein, the users of this system may pick and choose which of these fields they wish to implement for
34、 their specific application (see Figure 1). The descriptive designator may be extended with additional information, provided this information is separated from the descriptive designator by a slash (/) (see 4.3.7). NOTE Basic package codes and names are presented in Table B.1. 4.3.2 Minimum descript
35、ive designator The minimum descriptive designator is a two-letter code that classifies device packages into standard package outline styles. These styles identify general external physical features. Common two-letter descriptive codes or abbreviations are included, such as CC, FP, SO, GA. Figure A.1
36、 shows two-letter codes for various device package outline styles and depicts examples of each. Table 1 lists the two-letter package-outline-style codes described in Clause 5. BS EN 60191-4:2014Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Not for
37、 ResaleNo reproduction or networking permitted without license from IHS-,-,-60191-4 IEC:2013 7 Optional Optional Optional unless material prefix designator Minimum descriptive designator Optional Optional P S Q C C J 3 2 Material Features Position Package Form Count Figure 1 Descriptive coding for s
38、emiconductor device packages Terminal count (4.3.6.1, 4.3.6.2) A one-, two-, or three-digit suffix Lead form (4.3.6.1, 4.3.6.2, Table 5, Figure A.2) A single-letter suffix Package outline style (4.3.2, Table 1, Figure A.1) A double-letter designator Terminal position (4.3.3, Table 2) A single-letter
39、 prefix Package-specific features (4.3.5, Table 4) A single-letter or multi- letter prefix Package-body material (4.3.4, Table 3) A single-letter prefix IEC 2560/13 BS EN 60191-4:2014Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Not for ResaleNo r
40、eproduction or networking permitted without license from IHS-,-,- 8 60191-4 IEC:2013 Table 1 Package-outline-style codes Form Code Outline style E CC Chip-carrier package B CP Clamped package (press-pack) A CY Cylinder or can package D/E DB Disk-button package F FM Flange-mount package A FO Fibre op
41、tic device package E FP Flatpack package G GA Grid-array package G IL In-line package. The preferred designator is IP. G IP In-line package or inserted package. Restrict to DIP/SIP/ZIP. D/H LF Long-form horizontal package MA Microelectronic assembly B MP Power module package MW Microwave package B P
42、F Press-fit package C PM Post-(stud-) mount package E SO* Small-outline package A SS Special-shape package UC Uncased chip VP Vertical surface-mount package XA-XZ Non-defined family; vendor or user option * Industry practice sometimes uses “P“ for “package“ in the location normally occupied by this
43、field (except that there is no preceding hyphen), for example SOP. 4.3.3 Terminal-position prefix The two-letter, package-outline-style code may be supplemented with a single-letter prefix that identifies the physical terminal positions or, if applicable, the interconnect land pattern. Examples of t
44、hree-letter designators include common acronyms or abbreviations, such as DIP, LCC (QCC preferred), PGA, QFP, SIP, ZIP. NOTE 1 A terminal is defined as an externally available point of connection. NOTE 2 The proper terminal-position prefix is determined by the interconnect land structure. For exampl
45、e, the code for a single row of terminals formed into a staggered configuration would be “Z“. Table 2 gives a list of one-letter, terminal-position prefix codes. 4.3.4 Package-body-material prefix The three-letter descriptive designator (see 4.3.2) may be further supplemented by a single-letter pref
46、ix that identifies the predominant package-body material. This prefix shall not be used unless the terminal-position prefix described in 4.3.2 is also used. Examples of such four-letter descriptive designators include common acronyms or abbreviations, such as CDIP, PDIP, PLCC (PQCC preferred), MELF,
47、 PQFP. Table 3 gives a list of one-letter package-body-material prefix codes. BS EN 60191-4:2014Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-60191-4 IEC:2013 9 If
48、the package-body material is other than one of those defined in Table 3, the letter “X“ shall be used within the descriptive designator to signify a special or new material and shall later be replaced with an IEC-approved code. 4.3.5 Package-specific feature prefix Package-specific features may be described through the use of a multiletter prefix. The package-specific feature prefix shall be set off from the following portion of the descriptive designator by a dash (). Table 4 gives a list of p
