1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationMechanical standardization ofsemiconductor devicesPart 6-18: General rules for the preparation of outlinedrawings of surface mounted semiconductor devicepackages Design guide for
2、 ball grid array (BGA)BS EN 60191-6-18:2010Incorporating corrigendum 2010May National forewordThis British Standard is the UK implementation of EN 60191-6-18:2010. It isidentical to IEC 60191-6-18:2010,The UK participation in its preparation was entrusted to Technical CommitteeEPL/47, Semiconductors
3、.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions of acontract. Users are responsible for its correct application. BSI 2010 ISBN 978 0 580 71947 9 ICS 31.080.01Compliance with a
4、British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 30 April 2010.Date Text affectedBRITISH STANDARDBS EN 60191-6-18:2010corrigendum incorporating The start and finish of introduced o
5、r altered by corrigendum is indicatedin the by tags. is indicatedaltered by in.the by tagsAmendments/corrigenda issued since publication31 October 2010textImplementation of IEC corrigendum May 2010IEC corrigendum May 2010texttext TextMay 2010.EUROPEAN STANDARD EN 60191-6-18 NORME EUROPENNE EUROPISCH
6、E NORM February 2010 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: Avenue Marnix 17, B - 1000 Brussels 2010 CENELEC - All rights of exploitation in any form and by
7、any means reserved worldwide for CENELEC members. Ref. No. EN 60191-6-18:2010 E ICS 31.080.01 English version Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for bal
8、l grid array (BGA) (IEC 60191-6-18:2010) Normalisation mcanique des dispositifs semiconducteurs - Partie 6-18: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs pour montage en surface - Guide de conception pour les botiers matriciels billes (BGA) (CEI 60191-
9、6-18:2010) Mechanische Normung von Halbleiterbauelementen - Teil 6-18: Allgemeine Regeln fr die Erstellung von Gehusezeichnungen von SMD-Halbleitergehusen - Konstruktionsleitfaden fr Ball-Grid-Array (BGA) (IEC 60191-6-18:2010) This European Standard was approved by CENELEC on 2010-02-01. CENELEC mem
10、bers are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on applicat
11、ion to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat
12、has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, t
13、he Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. - 2 - Foreword The text of document 47D/753A/FDIS, future edition 1 of IEC 60191-6-18, prepared by SC 47D, Mechanical standardization for semiconductor devices, of IEC TC 47, Sem
14、iconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-18 on 2010-02-01. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and CENELEC shall not be held responsible for ident
15、ifying any or all such patent rights. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2010-11-01 latest date by which the national standards conflicting with the EN have to be
16、 withdrawn (dow) 2013-02-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60191-9-18:2010 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for
17、 the standards indicated: IEC 60191-6-2 NOTE Harmonized as EN 60191-6-2. IEC 60191-6-4 NOTE Harmonized as EN 60191-6-4. IEC 60191-6-5 NOTE Harmonized as EN 60191-6-5. _ BS EN 60191-6-18:2010EN 60191-6-18:2010 (E)- 3 - Annex ZA (normative) Normative references to international publications with their
18、 corresponding European publications The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an
19、 international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60191-6 - Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted
20、 semiconductor device packages EN 60191-6 - BS EN 60191-6-18:2010EN 60191-6-18:2010 (E) 4 CONTENTS 1 Scope.5 2 Normative references .5 3 Terms and definitions .5 4 Terminal position numbering.6 5 Nominal package dimension .6 6 Symbols and drawings7 7 Dimensions 10 8 Recommended BGA variations .16 Bi
21、bliography20 Figure 1 Cavity down type7 Figure 2 Cavity up type 8 Figure 3 Pattern of terminal position areas.9 Figure 4 Example of the terminal depopulations.15 Table 1 Group 1: Dimensions appropriate to mounting and interchangeability10 Table 2 Group 2: Dimensions appropriate to mounting and gaugi
22、ng.13 Table 3 Combinations of D, E, e, MD, ME, and n 14 Table 4 P-BGA (Cavity up) 1,27 mm pitch16 Table 5 P-BGA (Cavity up) 1,0 mm pitch16 Table 6 P-BGA (Cavity down) 1,27 mm pitch18 Table 7 T-BGA 1,27 mm pitch 18 Table 8 T-BGA 1,0 mm pitch19 Table 9 P-BGA and C-BGA (Flip-chip interconnection) 1,0 m
23、m pitch.19 BS EN 60191-6-18:2010EN 60191-6-18:2010 (E) 5 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for ball grid array (BGA) 1 Scope This part of IEC 60191 provide
24、s standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the
25、edition cited applies. For undated references, the latest edition of the referenced document applies. IEC 60191-6, Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages 3 Terms and definition
26、s For the purposes of this document, the terms and definitions given IEC 60191 (series) and the following apply. 3.1 ball grid array BGA package that has metal balls attached to one side of a substrate in a matrix of at least three rows and three columns; terminals may be missing from some row-colum
27、n intersections NOTE BGA stands for “Ball Grid Array” in compliance with the existing standards 3.2 plastic ball grid array P-BGA 3.3 tape ball grid array T-BGA BGA with a polyimide tape substrate 3.4 ceramic ball grid array C-BGA BGA with a ceramic substrate 3.5 P-BGA (Flip chip interconnection) BG
28、A with an organic substrate and a die bonded to a substrate through metal bumps (See Bibliography).BGA with a rigid organic substrateBS EN 60191-6-18:2010EN 60191-6-18:2010 (E) 6 3.6 recommended BGA variation BGA variation with the specific dimensions and ball counts as the first choice for producti
29、on packages other than recommended BGA variations are the least choice for production to avoid endless proliferation of BGA outlines. 4 Terminal position numbering When a package is viewed from the terminal side with the index corner in the bottom left corner position, terminal rows are lettered fro
30、m bottom to top starting with A, then B, C, AA, AB, etc., while terminal columns are numbered from left to right starting with 1. Terminal positions are designated by a row-column grid system and shown as alphanumeric identification, e.g., A1, B1, or AC34. The letters I, O, Q, S, X and Z are not use
31、d for naming the terminal rows. 5 Nominal package dimension A nominal package dimension is defined as “the package width (E) length (D)”, which is expressed in the tenths place in millimetre. BS EN 60191-6-18:2010EN 60191-6-18:2010 (E) 7 6 Symbols and drawings BGA outline is shown in the Figure 1 an
32、d 2. A1(8) (7) E y S (1) S A A4(9) v D (3) MDE A B S X1M bp1 A e (2) SE(ZE) (11) e SD(10) (ZD) (5) (6) ME2 3 4 5 (7) D C B A (10) (2) B v S X2 M (4) S y1IEC 2507/09 The symbols in this figure are explained in IEC 60191-6. Figure 1 Cavity down type BS EN 60191-6-18:2010EN 60191-6-18:2010 (E) 8 : E 1
33、2 3 4 5 D C B A A (8) E y S (1) S A1v D (3) MDA B S X1M bpe (2) SE(ZE) e (10) (SD) (5) (6) ME(10) (2) v S X2M (4) S y1(ZD) IEC 2508/09 The symbols in this figure are explained in IEC 60191-6. Figure 2 Cavity up type BS EN 60191-6-18:2010EN 60191-6-18:2010 (E) 9 Notes relating to Figure 1 and Figure
34、2: (1) Datum S is defined as the seating plane on which a package free stands by contact of the balls. (2) The distance between the centrelines of any two adjacent rows or columns of balls. (3) The hatched zone indicates the index-marking area where whole index mark will be contained. (4) The profil
35、e tolerance that controls of package size and orientation is applied to all four sides of the package outline. (5) The tolerance of position that controls the relationship of the balls applies to all balls. (6) The terminal diameter “bp” is the maximum diameter of individual balls as measured in the
36、 plane parallel to the seating plane. (7) It shows the lid made of mould compound, glob top resin, metal cap, ceramics, etc. It may be flat, convex, or concave shape. (8) The primary stand-off height is defined by the height from the seating plane to the package substrate. (9) The secondary stand-of
37、f height is defined by the height from the seating plane to the lid that is the lowest surface on the cavity-down configuration. (10) SDand SEare the dimensions that define the positions of balls next to the datum A and B. NOTE An array pattern of permissible terminal-existing zones including true p
38、osition tolerance is shown in Figure 3. b3 maxSEe e SDb3 max= bpmax+ x IEC 2509/09 The symbols in this figure are explained in IEC 60191-6. Figure 3 Pattern of terminal position areas BS EN 60191-6-18:2010EN 60191-6-18:2010 (E) 10 7 Dimensions Table 1 Group 1: Dimensions appropriate to mounting and
39、interchangeability Unit: mm Term Symbol Specification Recommended value Nominal package dimension E D (1) A nominal package dimension is defined as “the package width (E) length (D)”, which is expressed in the tenths place in millimetre. (2) Variations on nominal package dimensions are: 7,07,0 25,02
40、5,0 8,08,0 27,027,0 9,09,0 29,029,0 10,010,0 31,031,0 11,011,0 33,033,0 12,012,0 35,035,0 13,013,0 37,537,5 14,014,0 40,040,0 15,015,0 42,542,5 16,016,0 45,045,0 17,017,0 47,547,5 18,018,0 50,050,0 19,019,0 52,552,5 20,020,0 55,055,0 21,021,0 57,557,5 23,023,0 60,060,0 Refer to Table 4 through 9 Pac
41、kage length D (1) Package length D 7,0 25,0 8,0 27,0 9,0 29,0 10,0 31,0 11,0 33,0 12,0 35,0 13,0 37,5 14,0 40,0 15,0 42,5 16,0 45,0 17,0 47,5 18,0 50,0 19,0 52,5 20,0 55,0 21,0 57,5 23,0 60,0 Refer to Table 4 through 9 BS EN 60191-6-18:2010EN 60191-6-18:2010 (E) 11 Table 1 (continued) Unit:mm Term S
42、ymbol Specification Recommended value Package width E (1) Package width E 7,0 25,0 8,0 27,0 9,0 29,0 10,0 31,0 11,0 33,0 12,0 35,0 13,0 37,5 14,0 40,0 15,0 42,5 16,0 45,0 17,0 47,5 18,0 50,0 19,0 52,5 20,0 55,0 21,0 57,5 23,0 60,0 Refer to Table 4 through 9 Profile tolerance of package body v v = 0,
43、20 Profile tolerance includes body-edge burr - Profile height A Amax1,20 1,70 6,00 ”A” includes heat slug thickness, package warpage and tilt errors. “A” does not include the height of external heat sink or chip capacitors - Primary stand-off height A1e A1 minA1 nomA1 max1,27 1,00 0,5 0,4 0,6 0,5 0,
44、7 0,6 - BS EN 60191-6-18:2010EN 60191-6-18:2010 (E) 12 Table 1 (continued) Unit mm Term Symbol Specification Recommended value Secondary stand-off height A4A4 min= 0,25 Terminal grid pitch e 1,27 1,00 Terminal diameter bp e bpminbpnombpmax1,27 1,00 0,60 0,50 0,75 0,60 0,90 0,70 Positional tolerance
45、with respect to the body datum x1e x11,27 1,00 0,30 0,25 Terminal-to-terminal positional tolerance x2e x21,27 1,00 0,15 0,10 Coplanarity y e y 1,27 1,00 0,20 0,20 Parallelism tolerance of the top surface y1y1= 0,35 Center terminal(s) position in length SDWhen MDis an odd number, SD= 0. When MDis an
46、even number, SD= e /2. Center terminal(s) position in width SEWhen MEis an odd number, SE= 0. When MEis even number, SE= e /2. BS EN 60191-6-18:2010EN 60191-6-18:2010 (E) 13 Table 1 (continued) Unit mm Term Symbol Specification Recommended value Terminal matrix Terminal balls will be placed on the m
47、atrix determined by terminal pitch e, matrix size MDand ME, and centre ball position SDand SE. Any terminal balls may be omitted from the terminal matrix Number of terminals n Refer to Table 3 Refer to Table 4 through 9 Maximum matrix size in length MDMaximum matrix size in width METable 2 Group 2:
48、Dimensions appropriate to mounting and gauging Unit: mm Term Symbol Specification Recommended value Overhang dimension in length (ZD) (ZD) = D -(MD-1) e / 2 Overhang dimension in width (ZE) (ZE) = E -(ME -1) e / 2 BS EN 60191-6-18:2010EN 60191-6-18:2010 (E) 14 Table 3 Combinations of D, E, e, MD, ME
49、, and n e = 1,27 mm e = 1,00 mm D and E mm MD maxME maxnmaxMD max-1ME max-1nmaxMD maxME maxnmaxMD max-1ME max-1nmax7,0 5 25 4 16 6 36 5 25 8,0 6 36 5 25 7 49 6 36 9,0 6 36 5 25 8 64 7 49 10,0 7 49 6 36 9 81 8 64 11,0 8 64 7 49 10 100 9 81 12,0 9 81 8 64 11 121 10 100 13,0 10 100 9 81 12 144 11 121 14,0 10 100 9 81 13 169 12 144 15,0 11 121
