1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI British StandardsWB9423_BSI_StandardColCov_noK_AW:BSI FRONT COVERS 5/9/08 12:55 Page 1Semiconductor devices Mechanical and climatic test methods Part 20-1: Handling, packing, labelling andshipping of
2、 surface-mount devices sensitive to the combined effect of moisture and soldering heatBS EN 60749-20-1:2009National forewordThis British Standard is the UK implementation of EN 60749-20-1:2009. It isidentical to IEC 60749-20-1:2009.The UK participation in its preparation was entrusted to Technical C
3、ommitteeEPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions of acontract. Users are responsible for its correct application. BSI 2009ISBN 978 0 580 54601 3ICS
4、 31.080.01Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of the StandardsPolicy and Strategy Committee on 31 July 2009Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 60749-20-
5、1:2009EUROPEAN STANDARD EN 60749-20-1 NORME EUROPENNE EUROPISCHE NORM June 2009 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: Avenue Marnix 17, B - 1000 Brussels 20
6、09 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60749-20-1:2009 E ICS 31.080.01 English version Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-moun
7、t devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009) Dispositifs semiconducteurs - Mthodes dessais mcaniques et climatiques - Partie 20-1: Manipulation, emballage, tiquetage et transport des composants pour montage en surface sensibles leffet combin de lhum
8、idit et de la chaleur de brasage (CEI 60749-20-1:2009) Halbleiterbauelemente - Mechanische und klimatische Prfverfahren - Teil 20-1: Handhabung, Verpackung, Kennzeichnung und Transport oberflchenmontierbarer Bauelemente, die empfindlich gegen die Kombination von Feuchte und Ltwrme sind (IEC 60749-20
9、-1:2009) This European Standard was approved by CENELEC on 2009-05-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliog
10、raphical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility
11、of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece,
12、Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. EN 60749-20-1:2009 - 2 - Foreword The text of document 47/2010/FDIS, future edition 1 of IEC 60749-20-1,
13、prepared by IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60749-20-1 on 2009-05-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standar
14、d or by endorsement (dop) 2010-02-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2012-05-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60749-20-1:2009 was approved by CENELEC as a European Sta
15、ndard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60749-37 NOTE Harmonized as EN 60749-37:2008 (not modified). IEC 60749-39 NOTE Harmonized as EN 60749-39:2006 (not modified). _ BS EN 60749-20-1:2009- 3 -
16、EN 60749-20-1:2009 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated refer
17、ences, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60749-20 -1)Semiconductor devices - Mechani
18、cal and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat EN 60749-20 200X2)IEC 60749-30 -1)Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior
19、 to reliability testing EN 60749-30 20053)1)Undated reference. 2)To be ratified. 3)Valid edition at date of issue. BS EN 60749-20-1:2009 2 60749-20-1 IEC:2009 CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope.7 2 Normative references .7 3 Terms and definitions .7 4 General applicability and reliability con
20、siderations9 4.1 Assembly processes9 4.1.1 Mass reflow .9 4.1.2 Localized heating 9 4.1.3 Socketed components .9 4.1.4 Point-to-point soldering .9 4.2 Reliability 9 5 Dry packing 10 5.1 Requirements10 5.2 Drying of SMDs and carrier materials before being sealed in MBBs.10 5.2.1 Drying requirements -
21、 level A2.10 5.2.2 Drying requirements - levels B2a to B5a10 5.2.3 Drying requirements - carrier materials10 5.2.4 Drying requirements - other .11 5.2.5 Excess time between bake and bag.11 5.3 Dry pack11 5.3.1 Description 11 5.3.2 Materials .11 5.3.3 Labels.13 5.3.4 Shelf life 14 6 Drying 14 6.1 Dry
22、ing options .14 6.2 Post exposure to factory ambient 16 6.2.1 Floor life clock .16 6.2.2 Any duration exposure.16 6.2.3 Short duration exposure 16 6.3 General considerations for baking .17 6.3.1 High-temperature carriers17 6.3.2 Low-temperature carriers.17 6.3.3 Paper and plastic container items17 6
23、.3.4 Bakeout times17 6.3.5 ESD protection 17 6.3.6 Reuse of carriers .17 6.3.7 Solderability limitations17 7 Use 18 7.1 Floor life clock start.18 7.2 Incoming bag inspection18 7.2.1 Upon receipt18 7.2.2 Component inspection .18 7.3 Floor life18 7.4 Safe storage19 BS EN 60749-20-1:200960749-20-1 IEC:
24、2009 3 7.4.1 Safe storage categories.19 7.4.2 Dry pack19 7.4.3 Dry atmosphere cabinet.19 7.5 Reflow.19 7.5.1 Reflow categories19 7.5.2 Opened MBB .19 7.5.3 Reflow temperature extremes 19 7.5.4 Additional thermal profile parameters 20 7.5.5 Multiple reflow passes .20 7.5.6 Maximum reflow passes 20 7.
25、6 Drying indicators .20 7.6.1 Drying requirements 20 7.6.2 Excess humidity in the dry pack.20 7.6.3 Floor life or ambient temperature/humidity exceeded.21 7.6.4 Level B6 SMDs21 Annex A (normative) Symbol and labels for moisture-sensitive devices22 Annex B (informative) Board rework.27 Annex C (infor
26、mative) Derating due to factory environmental conditions 28 Bibliography31 Figure 1 Typical dry pack configuration for moisture-sensitive SMDs in shipping tubes 11 Figure 2a Example humidity indicator card for level A2 13 Figure 2b Example humidity indicator card for levels B2a to B5a .13 Figure 2 E
27、xample humidity indicator cards .13 Figure A.1 Moisture-sensitive symbol (example) 22 Figure A.2 MSID label (example) .22 Figure A.3 Information label for level A1 or B1 (example).23 Figure A.4 Moisture-sensitive caution label for level A2 (example) .24 Figure A.5 Moisture-sensitive caution label fo
28、r levels B2-B5a (example) 25 Figure A.6 Moisture-sensitive caution label for level B6 (example) .26 Table 1 Dry packing requirements10 Table 2 Reference conditions for drying mounted or unmounted SMDs (user bake: floor life begins counting at time = 0 after bake)14 Table 3 Default baking times used
29、prior to dry-pack that were exposed to conditions 60 % RH (supplier bake: MET = 24 h) .16 Table 4 Moisture classification level and floor life 18 Table C.1 Recommended equivalent total floor life (days) for level A2 at 20 C, 25 C, 30 C and 35 C for ICs with Novolac, biphenyl and multifunctional epox
30、ies (reflow at same temperature at which component was classified) .28 Table C.2 Recommended equivalent total floor life (days) for levels B2a to B5a at 20 C, 25 C, 30 C and 35 C for ICs with Novolac, biphenyl and multifunctional epoxies (reflow at same temperature at which component was classified)
31、.29 BS EN 60749-20-1:2009 4 60749-20-1 IEC:2009 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat FOREWOR
32、D 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electr
33、ical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to techn
34、ical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organi
35、zation for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical
36、committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publicatio
37、ns is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national
38、and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in
39、conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees f
40、or any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the No
41、rmative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held res
42、ponsible for identifying any or all such patent rights. International Standard IEC 60749-20-1 has been prepared by IEC technical committee 47: Semiconductor devices. This standard cancels and replaces IEC/PAS 62168 and IEC/PAS 62169 published in 2000. IEC/PAS 62169 was based on a Joint (IPC/JEDEC) I
43、ndustry Standard. This first edition of IEC 60749-20-1 constitutes a technical revision. BS EN 60749-20-1:200960749-20-1 IEC:2009 5 The text of this standard is based on the following documents: FDIS Report on voting 47/2010/FDIS 47/2013/RVD Full information on the voting for the approval of this st
44、andard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the parts in the IEC 60749 series, under the general title Semiconductor devices Mechanical and climatic test methods, can be f
45、ound on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfir
46、med, withdrawn, replaced by a revised edition, or amended. BS EN 60749-20-1:2009 6 60749-20-1 IEC:2009 INTRODUCTION The advent of surface-mount devices (SMDs) introduced a new class of quality and reliability concerns regarding package damage cracks and delamination from the solder reflow process. T
47、his document describes the standardized levels of floor life exposure for moisture/reflow-sensitive SMDs along with the handling, packing and shipping requirements necessary to avoid moisture/reflow-related failures. IEC 60749-20 defines the classification procedure and Annex A of this document defi
48、nes the labelling requirements. Moisture from atmospheric humidity enters permeable packaging materials by diffusion. Assembly processes used to solder SMDs to printed circuit boards (PCBs) expose the entire package body to temperatures higher than 200 C. During solder reflow, the combination of rap
49、id moisture expansion, materials mismatch, and material interface degradation can result in package cracking and/or delamination of critical interfaces within the package. The solder reflow processes of concern are convection, convection/IR, infrared (IR), vapour phase (VPR) and hot air rework tools. The use of assembly processes that immerse the component body in molten solder are not recommended for most SMDs. This first edit
