1、BRITISH STANDARDBS EN 61188-5-5:2007Printed boards and printed board assemblies Design and use Part 5-5: Attachment (land/joint) considerations Components with gull-wing leads on four sidesThe European Standard EN 61188-5-5:2007 has the status of a British StandardICS 31.180g49g50g3g38g50g51g60g44g4
2、9g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58BS EN 61188-5-5:2007This British Standard was published under the authority of the Standards Policy and Strategy Committee on
3、 31 December 2007 BSI 2007ISBN 978 0 580 60167 5National forewordThis British Standard is the UK implementation of EN 61188-5-5:2007. It is identical to IEC 61188-5-5:2007. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology.A list of
4、organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Compliance with a British Standard cannot confer immunity from legal obli
5、gations.Amendments issued since publicationAmd. No. Date CommentsEUROPEAN STANDARD EN 61188-5-5 NORME EUROPENNE EUROPISCHE NORM November 2007 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normu
6、ng Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61188-5-5:2007 E ICS 31.180 English version Printed boards and printed board assemblies - Design and use - Part 5-5
7、: Attachment (land/joint) considerations - Components with gull-wing leads on four sides (IEC 61188-5-5:2007) Cartes imprimes et cartes imprimes quipes - Conception et utilisation - Partie 5-5: Considrations sur les liaisons pistes-soudures - Composants sorties en aile de mouette sur quatre cts (CEI
8、 61188-5-5:2007) Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 5-5: Betrachtungen zur Montage (Anschlussflche/Verbindung) - Bauelemente mit Gullwing-Anschlssen auf vier Seiten (IEC 61188-5-5:2007) This European Standard was approved by CENELEC on 2007-11-01. CENELEC members a
9、re bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to
10、 the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has th
11、e same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands,
12、 Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Foreword The text of document 91/704/FDIS, future edition 1 of IEC 61188-5-5, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was appr
13、oved by CENELEC as EN 61188-5-5 on 2007-11-01. This standard is to be used in conjunction with EN 61188-5-1. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2008-08-01 latest
14、date by which the national standards conflicting with the EN have to be withdrawn (dow) 2010-11-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61188-5-5:2007 was approved by CENELEC as a European Standard without any modification. _ EN 61188-5-
15、5:2007 2 CONTENTS INTRODUCTION.5 1 Scope.6 2 Normative references .6 3 General information6 3.1 General component description .6 3.2 Marking .6 3.3 Carrier packaging format .7 3.4 Process considerations .7 4 PQFP (square) .7 4.1 Field of application 7 4.2 Component descriptions 7 4.3 Component dimen
16、sions .8 4.4 Solder joint fillet design .12 4.5 Land pattern dimensions .13 5 PQFP (rectangular) 16 5.1 Field of application 16 5.2 Component descriptions 17 5.3 Component dimensions .18 5.4 Solder joint fillet design .18 5.5 Land pattern dimensions .20 6 PLQFP (square) .22 6.1 Field of application
17、23 6.2 Component descriptions 22 6.3 Component dimensions .23 6.4 Solder joint fillet design .25 6.5 Land pattern dimensions .27 7 PLQFP (rectangular) 30 7.1 Field of application 30 7.2 Component descriptions 30 7.3 Component dimensions .31 7.4 Solder joint fillet design .32 7.5 Land pattern dimensi
18、ons .33 8 PTQFP (square) .34 8.1 Field of application 34 8.2 Component descriptions 34 8.3 Component dimensions .35 8.4 Solder joint fillet design .38 8.5 Land pattern dimensions .39 Bibliography42 Annex ZA (normative) Normative references to international publications with their corresponding Europ
19、ean publications 43 EN 61188-5-5:2007 3 Figure 5 PQFP (rectangular) 17 Figure 6 PQFP (rectangular) component dimensions .18 Figure 7 Solder joint fillet design20 Figure 8 PQFP (rectangular) land pattern dimensions 21 Figure 9 PLQFP (square).22 Figure 10 PLQFP (square) component dimensions 23 Figure
20、11 Solder joint fillet design27 Figure 12 PLQFP (square) land pattern dimensions .30 Figure 13 PLQFP (rectangular) 31 Figure 14 PLQFP (rectangular) component dimensions31 Figure 15 Solder joint fillet design33 Figure 16 PLQFP (rectangular) land pattern dimensions 34 Figure 17 PTQFP (square).35 Figur
21、e 18 PTQFP component dimensions 36 Figure 19 Solder joint fillet design39 Figure 20 PTQFP land pattern dimensions.41 Figure 1 PQFP (square).8 Figure 2 PQFP (square) component dimensions 9 Figure 3 Solder joint fillet design13 Figure 4 PQFP (square) land pattern dimensions.16 EN 61188-5-5:2007 4 INTR
22、ODUCTION This part of IEC 61188 covers land patterns for components with gull-wing leads on four sides. Each clause gives information in accordance with the following format. The proposed land pattern dimensions in this standard are based upon the fundamental tolerance calculation combined with the
23、given land protrusions and courtyard excesses (see IEC 61188-5-1, Generic requirements). The courtyard includes all issues of the normal manufacturing necessities. The unaltered land pattern dimensions of this part are generally applicable for the solder paste application plus reflow soldering proce
24、ss. For application of the wave soldering process, the land pattern dimensions normally have to be modified. Orientation parallel to the wave direction is preferable and special, suitably dimensioned solder thieves should be added. This standard offers a threefold land pattern dimensioning (levels 1
25、, 2, and 3) on the basis of a threefold set of land protrusions and courtyard excesses: maximum (max.); median (mdn) and minimum (min.). Each land pattern has been assigned an identification number to indicate the characteristics of the specific robustness of the land patterns. Users also have the o
26、pportunity to organize the information so that it is most useful for their particular design. If a user has good reason to use a concept different from that of IEC 61188-5-1, or if the user prefers unusual land protrusions, this standard should be used for checking the resulting solder fillet size.
27、It is the responsibility of the user to verify the SMD land patterns used for achieving an undisturbed mounting process including testing and an ensured reliability for the product stress conditions in use. Component dimensions listed in this standard are those available on the market and should be
28、regarded as for reference only. EN 61188-5-5:2007 5 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES DESIGN AND USE Part 5-5: Attachment (land/joint) considerations Components with gull-wing leads on four sides 1 Scope This part of IEC 61188 provides information on land pattern geometries used for the su
29、rface attachment of electronic components with gull-wing leads on four sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspect
30、ion, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design and the land pattern dimensions. The land pattern dimensions
31、 are based on a mathematical model that establishes a platform for a solder joint attachment to the printed board. The existing models create a platform that is capable of establishing a reliable solder alloy used to make that joint (lead-free, tin lead, etc.). Process requirements for solder reflow
32、 are different based on the solder alloy and should be analyzed in order that the process is above that temperature a sufficient time to form a reliable metallurgical bond. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated ref
33、erences, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 61188-5-1, Printed boards and printed board assemblies Design and use Part 5-1: Attachment (land/joint) considerations Generic requirements 3 General
34、 information 3.1 General component description The four-sided gull wing family is characterized by gull-wing leads on four sides of a square or rectangular package. The family includes both molded plastic and ceramic case styles. The acronyms PQFP (plastic quad flat pack) and CQFP (ceramic quad flat
35、 pack) are also used to describe the family. There are several lead pitches within the family form 1,0 mm to 0,30 mm. High lead-court packages are available in this family that accommodate complex, high lead-count chips. 3.2 Marking The PQFP and CQFP families of parts are generally marked with the m
36、anufacturers part numbers, manufacturers name or symbol and a pin 1 indicator. Some parts may have a pin 1 feature in the case shape instead of pin 1 marking. Additional markings may include date-code manufacturing lot and/or manufacturing location. EN 61188-5-5:2007 6 3.3 Carrier packaging format C
37、arrier packaging format may be provided in tube but packaging tray carries are preferred for best handling and high volume applications. Bulk packaging is not acceptable because of lead co-planarity required for placement and soldering. 3.4 Process considerations PQFP and CQFP packages are normally
38、processed by reflow solder operations. High lead-count fine pitch parts may require special processing outside the normal pick/place and reflow manufacturing operations. 4 PQFP (square) 4.1 Field of application This clause provides the component and land pattern dimensions for square PQFP (plastic q
39、uad flat pack) components. Basic construction of the PQFP device is also covered. At the end of this clause is a listing of the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions. 4.2 Component descriptions PQFPs are widely used in a variety of applications f
40、or commercial, industrial or military electronics. 4.2.1 Basic construction The quad flat pack has been developed for applications requiring low height and high density. The PQFP, along with the LSOP components, are frequently used in memory card applications (see Figure 1). 4.2.1.1 Termination mate
41、rials Leads shall be solder-coated with a tin/lead alloy. The solder should contain between 58 % to 68 % tin. Solder may be applied to the leads by hot dipping or by plating from solution. Plated solder terminations should be subjected to post plating reflow operation to fuse the solder. The tin/lea
42、d finish should be at least 0,007 5 mm thick. 4.2.1.2 Marking All parts shall be marked with a part number and an index area. The index area shall identify the location of pin 1. 4.2.1.3 Carrier package format The carrier package format for flat packs may be tubular in shape but, in most instances,
43、flat packs are delivered in a carrier tray. 4.2.1.4 Process considerations PQFPs are usually processed using standard reflow solder processes. Parts should be capable of withstanding ten cycles through a standard reflow system operating at 235 C. Each cycle shall consist of 60 s exposure at 235 C. E
44、N 61188-5-5:2007 7 IEC 2022/07 Figure 1 PQFP (square) 4.3 Component dimensions Land pattern dimensional data may need to be adjusted if the component dimensional data does not match JEDEC and/or JEITA sheets. Figure 2 provides the component dimensions for PQFP (square) components. EN 61188-5-5:2007
45、8 P W 0,25 LpH A L1S B L2 IEC 2023/07 Dimensions in millimetresL2 L1 Lp EIAJ codes JEDEC code Min. Max. Min. Max. Min. Max. P-QFP-0036-0505-1,00 P-QFP/036-5x5-1,00 12,95 13,45 12,95 13,45 0,73 1,03 P-QFP-0044-0505-0,80 P-QFP/044-5x5-0,80 12,95 13,45 12,95 13,45 0,73 1,03 P-QFP-0052-0505-0,65 P-QFP/0
46、52-5x5-0,65 12,95 13,45 12,95 13,45 0,73 1,03 P-QFP-0048-1212-0,80 P-QFP/048-12x12-0,80 14,95 15,45 14,95 13,45 0,73 1,03 P-QFP-0052-1414-1,00 P-QFP/052-14x14-1,00 16,95 17,45 16,95 17,45 0,73 1,03 P-QFP-0064-1414-0,80 P-QFP/064-14x14-0,80 16,95 17,45 16,95 17,45 0,73 1,03 P-QFP-0080-1414-0,65 P-QFP
47、/080-14x14-0,65 15,75 17,45 16,95 17,45 0,73 1,03 P-QFP-0100-1414-0,50 P-QFP/100-14x14-0,50 15,75 16,25 15,75 16,25 0,45 0,75 P-QFP-0120-1414-0,40 P-QFP/120-14x14-0,40 15,75 16,25 15,75 16,25 0,45 0,75 P-QFP-0168-1414-0,30 P-QFP/168-14x14-0,30 15,75 16,25 15,75 16,25 0,45 0,75 P-QFP-0076-2020-1,00 P
48、-QFP/076-20x20-1,00 22,95 23,45 22,95 23,45 0,73 1,03 P-QFP-0076-2020-1,00 P-QFP/076-20x20-1,00 22,95 23,45 22,95 23,45 0,73 1,03 P-QFP-0088-2020-0,80 P-QFP/088-20x20-0,80 22,95 23,45 22,95 23,45 0,73 1,03 P-QFP-0088-2020-0,80 P-QFP/088-20x20-0,80 22,95 23,45 22,95 23,45 0,73 1,03 W S* Min. Nom. Max
49、. Min. Max. B A P H Remarks 0,34 0,40 0,46 10,89 11,55 10,0 10,0 1,00 2,45 0,29 0,35 0,41 10,89 11,55 10,0 10,0 0,80 2,45 0,22 0,30 0,36 10,89 11,55 10,0 10,0 0,65 2,45 0,29 0,35 0,41 12,89 13,55 12,0 12,0 0,80 2,45 0,34 0,40 0,46 14,89 15,55 14,0 14,0 1,00 3,15 0,29 0,35 0,41 14,89 15,55 14,0 14,0 0,80 3,15 0,22 0,30 0,36 14,89 15,55 14,0 14,0 0,65 3,15 0,17 0,20 0,23 14,25 14,91 14,0 14,0 0,50 3,15 0,13 0,16 0,19 14,25 14,91 14,0 14,0 0,40 3,15 0,09 0,12 0,15 14,25 14,91 1
