1、BRITISH STANDARD BS EN 61190-1-1:2002 Attachment materials for electronic assembly Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly The European Standard EN 61190-1-1:2002 has the status of a British Standard ICS 31.190 BS EN 61190-1-1:2002 This B
2、ritish Standard, having been prepared under the direction of the Electrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 16 August 2002 BSI 16 August 2002 ISBN 0 580 40261 4 National foreword This British Standard is
3、the official English language version of EN 61190-1-1:2002. It is identical with IEC 61190-1-1:2002. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology, which has the responsibility to: A list of organizations represented on this comm
4、ittee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “
5、Search” facility of the BSI Electronic Catalogue or of British Standards Online. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from le
6、gal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK.
7、Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 22, an inside back cover and a back cover. The BSI copyright date displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. Date Com
8、mentsEUROPEAN STANDARD EN 61190-1-1 NORME EUROPENNE EUROPISCHE NORM June 2002 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 20
9、02 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61190-1-1:2002 E ICS 31.190 English version Attachment materials for electronic assembly Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electroni
10、cs assembly (IEC 61190-1-1:2002) Matriaux de fixation pour les assemblages lectroniques Partie 1-1: Exigences relatives aux flux de brasage pour les interconnexions de haute qualit dans les assemblages de composants lectroniques (CEI 61190-1-1:2002) Verbindungsmaterialien fr Baugruppen der Elektroni
11、k Teil 1-1: Anforderungen an Weichlt- Flussmittel fr hochwertige Verbindungen in der Elektronikmontage (IEC 61190-1-1:2002) This European Standard was approved by CENELEC on 2002-06-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for g
12、iving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three officia
13、l versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committ
14、ees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.NE 161-09-1:12002 -2 - Foreword The text of document 91/277/FDIS, future edi
15、tion 1 of IEC 61190-1-1, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61190-1-1 on 2002-06-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publicatio
16、n of an identical national standard or by endorsement (dop) 2003-03-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2005-06-01 Annexes designated “normative“ are part of the body of the standard. In this standard, annexes A and ZA are normative. Anne
17、x ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61190-1-1:2002 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 611
18、90-1-2 NOTE Harmonized as EN 61190-1-2:2002 (not modified). IEC 61190-1-3 NOTE Harmonized as EN 61190-1-3:2002 (not modified). IEC 61191-1 NOTE Harmonized as EN 61191-1:1998 (not modified). IEC 61191-2 NOTE Harmonized as EN 61191-2:1998 (not modified). IEC 61191-3 NOTE Harmonized as EN 61191-3:1998
19、(not modified). IEC 61191-4 NOTE Harmonized as EN 61191-4:1998 (not modified). ISO 9000 NOTE Harmonized as EN ISO 9000:2000 (not modified). ISO 9001 NOTE Harmonized as EN ISO 9001:2000 (not modified). Page2 EN6119011:2002161-09-11 EI:C0022 3 CONTENTS INTRODUCTION.5 1 Scope and object6 2 Normative re
20、ferences .6 3 Terms and definitions .6 4 Requirements.7 4.1 Conflict7 4.2 Flux classification and testing7 4.2.1 Standard classification for products .7 4.2.2 Composition 7 4.2.3 Activity 8 4.2.4 Flux characterization test methods 9 4.2.5 Qualification 11 4.2.6 Quality conformance11 4.2.7 Performanc
21、e11 4.2.8 Labelling13 5 Quality assurance provisions13 5.1 Responsibility for inspection13 5.1.1 Responsibility for compliance 13 5.1.2 Test equipment and inspection facilities 13 5.1.3 Inspection conditions.13 5.2 Classification of inspections 14 5.3 Materials inspection 14 5.4 Qualification inspec
22、tion .14 5.4.1 Sample size.14 5.4.2 Inspection routine14 5.5 Performance inspection.15 5.6 Quality conformance15 5.6.1 Sampling plan15 5.6.2 Rejected lots .16 5.7 Preparation of fluxes for testing.16 5.7.1 Flux form for test .16 5.7.2 Liquid fluxes 16 5.7.3 Solid fluxes16 5.7.4 Paste flux 16 5.7.5 S
23、older paste17 5.7.6 Other materials17 6 Preparation for delivery 18 6.1 Preservation-packing and packaging .18 7 Additional information.18 7.1 Flux activity.18 7.2 Flux and cleaning relationship .19 7.3 Ordering data 19 Page3 EN6119011:2002161-09-11 EI:C0022 4 Annex A (normative) .20 Annex ZA (norma
24、tive) Normative references to international publications with their corresponding European publications .22 Bibliography21 Figure 1 Wetting balance curve12 Table 1 Flux identification, materials of composition, activity levels8 Table 2 Test requirements for flux activity classification.9 Table 3 Typ
25、ical spread areas.12 Table 4 Solder flux test method classification.15 Table 5 Flux form for test.16 Table A.1 Qualification test report20 Page4 EN6119011:2002161-09-11 EI:C0022 5 INTRODUCTION This part of IEC 61190 defines the classification of soldering materials through specifications of test met
26、hods and inspection criteria. These materials include liquid flux, paste flux, solder- paste flux, solder-preform flux, and flux cored solder. It is not the intent of this standard to exclude any acceptable flux or soldering aid material; however, these materials must produce the desired electrical
27、and metallurgical interconnection. Requirements for soldering fluxes are defined in general terms for standardized classification. In practice, where more stringent requirements are necessary or other manufacturing processes are used, these should be defined as additional requirements by the user. F
28、ormic acid is not considered a flux for the purpose of this document. The generic specifications for soldering fluxes are given by ISO. This standard is intended to be applicable to all types of flux as used for soldering in general and to soldering in electronics in particular. The fluxes involved
29、relate to all aspects of application, such as in wave soldering, printed wiring board (PWB) fabrication, lead tinning, and solder reflow. Materials include solder pastes, flux-cored wire, and flux-coated preforms. Soldering fluxes covered by this standard are intended for use in various consumer, in
30、dustrial and commercial electronics soldering applications of industry applications. Page5 EN6119011:2002161-09-11 EI:C0022 6 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly 1 Scope and object This par
31、t of IEC 61190 specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electron
32、ics assembly technology. 2 Normative references The following referenced documents are indispensable for the application of the document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IE
33、C 60194, Printed board design, manufacture and assembly Terms and definitions IEC 61189-2, Test methods for electrical materials, interconnection structures and assemblies Part 2: Test methods for materials for interconnection structures IEC 61189-3, Test methods for electrical materials, interconne
34、ction structures and assemblies Part 3: Test methods for interconnection structures (printed boards) ISO 9002:1994, Quality systems Model for quality assurance in production, installation and servicing ISO 9455-16, Soft soldering fluxes Test methods Part 16: Flux efficacy tests, wetting balance meth
35、od 3 Terms and definitions For the purposes of this part of IEC 61190, the terms and definitions given in English only in IEC 60194 1)and the following apply. 3.1 form flux additionally classified according to the form that it takes liquid (L), solid (S), or paste (P) 3.2 inorganic flux aqueous flux
36、 solution of inorganic acids and halides IEC 60194 _ 1) Certain definitions of IEC 60194 have been translated into French. Page6 EN6119011:2002161-09-11 EI:C0022 7 3.3 organic flux primarily composed of organic materials other than rosin or resin 3.4 resin flux resin and small amounts of organic act
37、ivators in an organic solvent IEC 60194 3.5 rosin flux rosin in an organic solvent or rosin as a paste with activators IEC 60194 (primarily composed of natural resin, extracted from the oleoresin of pine trees and refined. Consists of one or more of the following types of rosin: gum rosin, wood rosi
38、n, tall oil rosin, modified or natural rosin. The rosins used must have a minimum acid value of 130, as deter- mined by 6C07 of the future IEC 61189-6.) 4 Requirements Except when otherwise specified on the design or assembly drawings or instructions by the user, the soldering fluxes covered by this
39、 part of IEC 61190 shall conform with the following subclauses. 4.1 Conflict In the event of conflict between the requirements of this specification and other requirements of the applicable acquisition documents, the precedence in which documents shall govern, in descending order, is as follows: a)
40、the applicable acquisition document; b) the applicable specification sheet/drawing; c) this specification; d) normative references. 4.2 Flux classification and testing 4.2.1 Standard classification for products Fluxes used in the process of soldering shall be classified according to the corrosive or
41、 conductive properties of the flux or flux residue (see table 1). 4.2.2 Composition Soldering fluxes shall also be classified according to the general chemical composition of the non-volatile portion. Based on a minimum 51 % composition of the non-volatile portion, the flux shall be classified as ei
42、ther rosin, resin, organic or inorganic (see table 1). Page7 EN6119011:2002161-09-11 EI:C0022 8 Table 1 Flux identification, materials of composition, activity levels a Flux materials of compositiona Flux activity levels (weight % halide)b IEC flux designatorc ISO flux designatord Low (2,0) H1 ROH1
43、1.1.2.Z Low (2,0) H1 REH1 1.2.2.Z Low (2,0) H1 ORH1 2.2.2 Low (2,0) H1 INH1 Not applicable (inorganic ISO flux is different) a Fluxes are available in S (solid), P (paste/cream) or L (liquid) forms. b The 0 and 1 indicate absence and presence of halides, respectively. See 4.2.3 for an explanation of
44、 L, M and H nomenclature. c See 7.2 and 7.3 for comparisons of RO, RE, OR and IN composition classes and L, M and H activity levels with the traditional classes such as R, RMA, RA, water soluble and low solids “no-clean“. d ISO designations are similar to IEC designators with minor differences in ch
45、aracteristics. 4.2.3 Activity The soldering fluxes of table 1 shall be further classified by test requirements relating to the activity of the flux and its residue. Soldering fluxes shall be characterized according to one of the following three types: a) L is low or no flux/flux residue activity; b)
46、 M is moderate flux/flux residue activity; c) H is high flux/flux residue activity. Page8 EN6119011:2002161-09-11 EI:C0022 9 These classes shall be further characterized using 0 or 1 to indicate the absence or the presence of halide in the flux. Both the L, M, H and 0, 1 classifications shall be det
47、ermined by the test methods in table 2. It is the responsibility of the material suppliers to characterize their fluxes in accordance with the classification requirements in this standard. 4.2.3.1 Flux type and activity classification In order to be classified as a specific type, a flux must meet al
48、l the characterization require- ments as shown in table 2. Flux used for the soldering of electronic assemblies shall be further assessed by the impact of flux residue on the performance of the assembly. Conductive properties of the flux residue shall meet the surface insulation resistance (SIR) req
49、uirements contained in table 2. Certain corrosive fluxes can meet one or more tests for the L-type flux. Failure to meet all test requirements shall cause the given flux to be classified as either type M or H. Table 2 Test requirements for flux activity classification Qualitative halide Flux type a Copper mirror Silver chromate (CI, Br) b Spot test (F) Quantitative hali
