1、BSI Standards PublicationPrinted board assembliesPart 2: Sectional specification Requirements for surface mount soldered assembliesBS EN 61191-2:2013Copyright European Committee for Electrotechnical Standardization Provided by IHS under license with CENELECNot for ResaleNo reproduction or networking
2、 permitted without license from IHS-,-,-National forewordThis British Standard is the UK implementation of EN 61191-2:2013. It isidentical to IEC 61191-2:2013. It supersedes BS EN 61191-2:1999 which iswithdrawn.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/501, Elec
3、tronic assembly technology 31.240Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 31 October 2013.Amendments issued since publicationAmd. No. Date Text affectedBRIT
4、ISH STANDARDBS EN 61191-2:2013Copyright European Committee for Electrotechnical Standardization Provided by IHS under license with CENELECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-EUROPEAN STANDARD EN 61191-2 NORME EUROPENNE EUROPISCHE NORM October 2013 CENEL
5、EC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels 2013 CENELEC - All rights of exploitation in any form and by any means reserv
6、ed worldwide for CENELEC members. Ref. No. EN 61191-2:2013 E ICS 31.190; 31.240 Supersedes EN 61191-2:1998 English version Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2013) Ensembles de cartes imprimes - Partie 2: Spcif
7、ication intermdiaire - Exigences relatives lassemblage par brasage pour montage en surface (CEI 61191-2:2013) Elektronikaufbauten auf Leiterplatten - Teil 2: Rahmenspezifikation - Anforderungen an geltete Baugruppen in Oberflchenmontage (IEC 61191-2:2013) This European Standard was approved by CENEL
8、EC on 2013-07-10. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standard
9、s may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language a
10、nd notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Ge
11、rmany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. BS EN 61191-2:2013Copyright European Committee for Electrotechnical Standardizatio
12、n Provided by IHS under license with CENELECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-EN 61191-2:2013 - 2 - Foreword The text of document 91/1091/FDIS, future edition 2 of IEC 61191-2, prepared by IEC/TC 91 “Electronics assembly technology “ was submitted to
13、the IEC-CENELEC parallel vote and approved by CENELEC as EN 61191-2:2013. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2014-04-10 latest date by which the national sta
14、ndards conflicting with the document have to be withdrawn (dow) 2016-07-10 This document supersedes EN 61191-2:1998. EN 61191-2:2013 includes the following significant technical changes with respect to EN 61191-2:1998: IPC-A-610 on workmanship has been included as a normative reference; some of the
15、terminology used in the document has been updated; references to EN standards have been corrected; the use of lead-free solder paste and plating are addressed. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN sha
16、ll not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 61191-2:2013 was approved by CENELEC as a European Standard without any modification. BS EN 61191-2:2013Copyright European Committee for Electrotechnical Standardiz
17、ation Provided by IHS under license with CENELECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- 3 - EN 61191-2:2013 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in w
18、hole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publicati
19、on has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 61191-1 2013 Printed board assemblies Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related ass
20、embly technologies EN 61191-1 2013 IPC-A-610E 2010 Acceptability of Electronic Assemblies - - BS EN 61191-2:2013Copyright European Committee for Electrotechnical Standardization Provided by IHS under license with CENELECNot for ResaleNo reproduction or networking permitted without license from IHS-,
21、-,- 2 61191-2 IEC:2013 CONTENTS 1 Scope . 6 2 Normative references . 6 3 Conventions . 6 4 General requirements . 6 5 Classification 6 6 Surface mounting of components 7 6.1 General . 7 6.2 Alignment requirements . 7 6.3 Process control . 7 6.4 Surface mounted component requirements 7 6.5 Flatpack l
22、ead forming 7 6.5.1 General . 7 6.5.2 Surface mounted device lead bends 8 6.5.3 Surface mounted device lead deformation . 8 6.5.4 Flattened leads 8 6.5.5 Dual-in-line packages (DIPs) . 8 6.5.6 Parts not configured for surface mounting . 9 6.6 Small devices with two terminations 9 6.6.1 General . 9 6
23、.6.2 Stack mounting 9 6.6.3 Devices with external deposited elements . 9 6.7 Lead component body positioning . 9 6.7.1 General . 9 6.7.2 Axial-leaded components . 9 6.7.3 Other components . 9 6.8 Parts configured for butt lead mounting . 9 6.9 Non-conductive adhesive coverage limits 10 7 Acceptance
24、requirements . 10 7.1 General . 10 7.2 Control and corrective actions . 10 7.3 Surface soldering of leads and terminations 10 7.3.1 General . 10 7.3.2 Solder fillet height and heel fillets 10 7.3.3 Flat ribbon L and gull-wing leads . 13 7.3.4 Round or flattened (coined) leads 13 7.3.5 J leads. 15 7.
25、3.6 Rectangular or square end components . 16 7.3.7 Cylindrical end cap terminations 17 7.3.8 Bottom only terminations . 18 7.3.9 Leadless chip carriers with castellated terminations . 19 7.3.10 Butt joints 20 7.3.11 Inward L-shaped ribbon leads 21 7.3.12 Flat lug leads . 22 7.4 General post-solderi
26、ng requirements applicable to all surface-mounted assemblies 23 BS EN 61191-2:2013Copyright European Committee for Electrotechnical Standardization Provided by IHS under license with CENELECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-61191-2 IEC:2013 3 7.4.1 De
27、wetting 23 7.4.2 Leaching 23 7.4.3 Pits, voids, blowholes, and cavities 23 7.4.4 Solder wicking . 23 7.4.5 Solder webs and skins . 23 7.4.6 Bridging . 23 7.4.7 Degradation of marking . 23 7.4.8 Solder spikes . 23 7.4.9 Disturbed joint . 23 7.4.10 Component damage 24 7.4.11 Open circuit, non-wetting
28、. 24 7.4.12 Component tilting 24 7.4.13 Non-conducting adhesive encroachment 24 7.4.14 Open circuit, no solder available (skip) 24 7.4.15 Component on edge 24 8 Rework and repair 24 Annex A (normative) Placement requirements for surface mounted devices . 26 Figure 1 Lead formation for surface mounte
29、d device 8 Figure 2 Fillet height 12 Figure 3 Flat ribbon L and gull-wing leads 13 Figure 4 Round or flattened (coined) lead joint . 14 Figure 5 J lead joint . 15 Figure 6 Rectangular or square end components . 16 Figure 7 Cylindrical end-cap terminations 17 Figure 8 Bottom only terminations 18 Figu
30、re 9 Leadless chip carriers with castellated terminations . 19 Figure 10 Butt joints . 20 Figure 11 Inward L-shaped ribbon leads 21 Figure 12 Flat lug leads . 22 Table 1 Surface mounted solder joint defects . 25 BS EN 61191-2:2013Copyright European Committee for Electrotechnical Standardization Prov
31、ided by IHS under license with CENELECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- 6 61191-2 IEC:2013 PRINTED BOARD ASSEMBLIES Part 2: Sectional specification Requirements for surface mount soldered assemblies 1 Scope This part of IEC 61191 gives the requiremen
32、ts for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). 2 Normative references Th
33、e following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 61191
34、-1:2013, Printed board assemblies Part 1: Generic specification Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies IPC-A-610E:2010, Acceptability of Electronic Assemblies 3 Conventions Unless otherwise specified by the user, the word
35、“shall“ signifies that the requirement is mandatory. Deviations from any “shall“ requirement requires written acceptance by the user, e.g. via assembly drawing, specification or contract provision. The word “should” is used to indicate a recommendation or guidance statement. The word “may” indicates
36、 an optional situation. Both “should” and “may” express non-mandatory situations. “Will” is used to express a declaration of purpose. 4 General requirements Clause 4 of IEC 61191-1:2013 is a mandatory part of this standard. Workmanship of surface mount assemblies shall meet the requirements of IPC-A
37、-610E in accordance with the classification requirements of this standard. 5 Classification This standard recognizes that electrical and electronic assemblies are subject to classifications by intended end-item use. Three general end-product classes have been established to reflect differences in pr
38、oducibility, complexity, functional performance requirements, and verification (inspection/test) frequency. These are the following: Level A: General electronic products Level B: Dedicated service electronic products BS EN 61191-2:2013Copyright European Committee for Electrotechnical Standardization
39、 Provided by IHS under license with CENELECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-61191-2 IEC:2013 7 Level C: High performance electronic products The user of the assemblies is responsible for determining the level to which his product belongs. It should b
40、e recognized that there may be overlaps of equipment between levels. The contract shall specify the level required and indicate any exceptions or additional requirements to the parameters, where appropriate (see 4.3 of IEC 61191-1:2013). 6 Surface mounting of components 6.1 General This clause cover
41、s assembly of components that are placed on the surface to be manually or machine soldered and includes components designed for surface mounting as well as through-hole components that have been adapted for surface mounting technology. 6.2 Alignment requirements Sufficient process control at all sta
42、ges of design and assembly shall be in place to enable the post-soldering alignments and solder joint fillet controls specified in 7.3 to be achieved. Relevant factors affecting the requirements include land and conductor design, component proximities, component and land solderability, solder paste/
43、adhesive quantity and alignment and component placement accuracy. 6.3 Process control If suitable process controls are not in place to ensure compliance with 6.2 and the intent of Annex A, the detailed requirements of Annex A shall be mandatory. 6.4 Surface mounted component requirements The leads o
44、f lead surface mounted components shall be formed to their final configuration prior to mounting. Leads shall be formed in such a manner that the lead-to-body seal is not damaged or degraded and that they may be soldered into place by subsequent processes which do not result in residual stresses dec
45、reasing reliability. When the leads of dual-in-line packages, flatpacks, and other multilead devices become misaligned during processing or handling, they may be straightened to ensure parallelism and alignment prior to mounting, while maintaining the lead-to-body seal integrity. 6.5 Flatpack lead f
46、orming 6.5.1 General Leads on opposite sides of surface mounted flatpacks shall be formed such that the non-parallelism between the base surface of the component and the surface of the printed board (i.e. component cant) is minimal. Component cant is permissible provided the final configuration does
47、 not exceed the maximum spacing limit of 2,0 mm (see Figure 1). BS EN 61191-2:2013Copyright European Committee for Electrotechnical Standardization Provided by IHS under license with CENELECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- 8 61191-2 IEC:2013 Figure
48、1 Lead formation for surface mounted device 6.5.2 Surface mounted device lead bends Leads shall be supported during forming to protect the lead-to-body seal. Bends shall not extend into the seal (see Figure 1). The lead-bend radius (R) shall be 1 T (T = nominal lead thickness). The angle of that part of the lead between the upper and lower bends in relation to the mounting land shall be 45 minimum and 90 maximum. 6.5.3 Surface mounted device lead deformation Lead deformation (unintentional bending) may be allowed whe
