1、BRITISH STANDARD BS EN 61249-8-8: 1997 IEC61249-8-8: 1997 Materials for interconnection structures Part8: Sectional specification set for non-conductive films and coatings Section8: Temporary polymer coatings The European Standard EN61249-8-8:1997 has the status of a British Standard ICS 31.180BSEN6
2、1249-8-8:1997 This British Standard, having been prepared under the directionof the Electrotechnical Sector Board, was published underthe authority of the Standards Board and comesintoeffect on 15December1997 BSI 04-2000 ISBN 0 580 28465 4 National foreword This British Standard is the English langu
3、age version of EN61249-8-8:1997. It is identical with IEC61249-8-8:1997. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology, which has the responsibility to: aid enquirers to understand the text; present to the responsible internation
4、al/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. A list of organizations represented on this committee can be obtained on request to its secre
5、tary. From1 January1997, all IEC publications have the number60000 added to the old number. For instance, IEC27-1 has been renumbered as IEC60027-1. For a period of time during the change over from one numbering system to the other, publications may contain identifiers from both systems. Cross-refer
6、ences Attention is drawn to the fact that CEN and CENELEC Standards normally include an annex which lists normative references to international publications with their corresponding European publications. The BritishStandards which implement these international or European publications may be found
7、in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards a
8、re responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, theEN title page, pages2 to8, an inside back cover and a back cov
9、er. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No. Date CommentsBSEN61249-8-8:1997 BSI 04-2000 i Contents Page National foreword Inside
10、 front cover Foreword 2 Text of EN61249-8-8 3ii blankEUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN61249-8-8 August1997 ICS 31.180 Descriptors: Interconnection structures,sectional specification, nonconductive films, nonconductive coatings, temporary coatings, polymer, properties English versi
11、on Materials for interconnection structures Part8: Sectional specification set for non-conductive films and coatings Section8: Temporary polymer coatings (IEC 61249-8-8:1997) Matriaux pour les structures dinterconnexion Partie8: Collection de spcifications intermdiaires pour les films et revtements
12、non conducteurs Section8: Revtements amovibles de polymre (CEI 61249-8-8:1997) Materialien fr Verbindungsstrukturen Teil8: Rahmenspezifikation fr nichtleitende Filme und Beschichtungen Hauptabschnitt8: Temporre Polymerbeschichtungen (IEC61249-8-8:1997) This European Standard was approved by CENELEC
13、on1997-07-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards ma
14、y be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions(English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to
15、the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United
16、 Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1997 CENELEC All rights of exploitation in any form and by any means res
17、erved worldwide for CENELEC members. Ref. No. EN61249-8-8:1997 EEN61249-8-8:1997 2 BSI 04-2000 Foreword The text of document52/680/FDIS, future edition1 of IEC61249-8-8, prepared by IEC TC52, Printed circuits, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN61249-8-8
18、on1997-07-01. The following dates were fixed: Anhnge, die als “normativ” bezeichnet sind, gehren zum Norminhalt. Anhnge, die als “informativ” bezeichnet sind, enthalten nur Informationen. In dieser Norm ist Anhang ZA normativ und ist Anhang A informativ. Der Anhang ZA wurde von CENELEC hinzugefgt. E
19、ndorsement notice The text of the International Standard IEC61249-8-8:1997 was approved by CENELEC as a European Standard without any modification. Contents Page Foreword 2 1 Scope 3 2 Normative references 3 3 Properties 3 3.1 General 3 3.2 Adhesion (pressure sensitive tape method) 4 3.3 Adhesion (h
20、and peel technique) 4 3.4 Thermal shock 4 3.5 Resistance to solvents after soldering 4 3.6 Solderability 4 3.7 Properties after mask removal (keypads) 4 4 Containers and their markings 4 Annex A (informative) Conversion table 5 Annex ZA (normative) Normative referencesto international publications w
21、ith their corresponding European publications Inside back cover latest date by which the ENhas to be implemented at national level by publication of an identical national standard or by endorsement (dop) 1998-04-01 latest date by which the national standards conflicting with the EN haveto be withdra
22、wn (dow) 1998-04-01EN61249-8-8:1997 BSI 04-2000 3 1 Scope This specification within the IEC61249 series details requirements for the qualification of temporary solder resist coatings. These have been referred to as a mask in this specification since they have the facility of being readily removed. P
23、eelable solder masks are applied(usually by screen printing) to areas of a completed printed board or panel prior to shipment, in order to protect areas of the board or panel during subsequent processes by the board assembler. Typically, peelable solder masks are used to protect keypad contacts duri
24、ng fluxing and subsequent mass soldering. Removal of the mask will then leave a residue-free untinned contact area. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks. Requiremen
25、ts for the release of printed boards using peelable solder masks should be included in the Customer Detail Specification(CDS). Requirements for the qualification of permanent polymeric solder resistive coatings are given in IEC61249-8-5 1) , which has been used as a template in constructing this spe
26、cification, in as far as it may apply. 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this section of IEC61249-8. At the time of publication, the editions indicated were valid. All normative documents are su
27、bject to revision, and parties to agreements based on this section of IEC61249-8 are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. Members of IEC and ISO maintain registers of currently valid International Standards. IEC600
28、68-2-20:1979, Basic environmental test procedures Part2: Tests Test T: Soldering. Amendment No.1(1987) IEC61189-1:1997, Test methods for electrical materials, interconnection structures and assemblies Part1: General test methods and methodology. IEC61189-2:1997, Test methods for electrical materials
29、, interconnection structures and assemblies Part2: Test methods for materials for interconnection structures. IEC61189-3:1997, Test methods for electrical materials, interconnection structures and assemblies Part3: Test methods for interconnection structures(printed boards). IEC61249-8-5, Materials
30、for interconnection structures Part8: Sectional specification set for non-conductive films and coatings Section5:Permanent polymer coatings 1) . IEC62326-4-1:1996, Printed board Part4: Rigid multilayer printed boards with interlayer connections Sectional specification Section1:Capability detail spec
31、ification: Performance levels A, B and C. 3 Properties 3.1 General In all cases the peelable solder masks shall be stored, applied, and cured in accordance with the material suppliers instructions. The cured coating shall produce a tough and resilient coating without voids and/or pinholes in the tem
32、porary solder mask. Unless otherwise specified, the test sample shall comprise five chequerboard test specimens, details of which are given in IEC62326-4-1, test specimen G. Many of the tests can be conducted in sequence on the same test specimen. The following tests are specified in IEC61249-8-5, b
33、ut are not considered necessary for peelable solder mask due to the nature and use of the material: mould growth resistance; flammability; hydrolytic stability/ageing; electric strength normal to the plane of the solder resist coating; permittivity and dissipation factor after damp heat and recovery
34、; comparative tracking index; corrosion at the edge; machinability; hardness; insulation resistance; moisture and insulation resistance; electromigration; high temperature storage; thermal cycling. 1) To be published.EN61249-8-8:1997 4 BSI 04-2000 3.2 Adhesion(pressure sensitive tape method) When te
35、sted in accordance with IEC61189-3 Test3X12, there shall be no evidence of peelable solder mask adhering to the printed board or in any holes. NOTEThis is the reverse of the requirement for permanent organic surface coatings. This test shall be conducted: a) without conditioning; b) after thermal sh
36、ock with the peelable mask down in accordance with IEC61189-3, test3N02. The float time shall be5s. This method is considered to be more objective than the hand peel technique, and is the referee method. 3.3 Adhesion(hand peel technique) A minimum of three complete production boards shall be used fo
37、r this test. The peelable solder mask shall be readily removable by hand, and shall detach in a single piece(pattern permitting). After removal of the mask, there shall be no residue or debris on the surface of the printed board or in any holes. This test shall be conducted: a) without conditioning;
38、 b) after conditioning(solder float) in accordance with IEC61189-3, test3N02. The float time shall be5s. This test is included to enable the evaluation of production boards, in addition to dedicated test specimens. 3.4 Thermal shock The specimen shall be preconditioned in accordance with IEC61189-1,
39、 test1P02 for between1h and4h. The specimens shall then be subjected to the thermal shock in accordance with IEC61189-3, test3N02 using an activated flux(0,2%), as specified in 6.6.2 of IEC60068-2-20. The float time shall be5s. After thermal shock the peelable solder mask shall not exhibit shrinkage
40、, charing, embrittlement or lifting. 3.5 Resistance to solvents after soldering After performing solder float according to3.4 the specimens shall be tested in accordance with IEC61189-3, test3C04. After application of the solvent there shall be no swelling, shrinkage, blistering or lifting of the pe
41、elable coating. 3.6 Solderability The specimens, after application and removal of the coating, shall be tested in accordance with IEC61189-3, test3X07. A non-activated flux shall be used, as specified in 6.6.1 of IEC60068-2-20. Tests shall be conducted on separate specimens of the same batch: a) bef
42、ore application of the peelable solder mask; b) after application and removal of the mask. The solderability of the specimens shall not be adversely affected by the process of applying and removal of the mask. 3.7 Properties after mask removal(keypads) 3.7.1 Contact resistance The contact resistance
43、 shall not exceed1007, unless otherwise stated in the material suppliers data, and/or in the Customer Detail Specification(CDS). This requirement shall be met: a) before application of the peelable solder mask; b) after application and removal of the mask. After removal of the peelable solder mask,
44、the rise in contact resistance shall not exceed15%. Specimens shall be tested in accordance with IEC61189-2, test2E16. 3.7.2 Board properties There shall be no degradation of the properties of the board as a result of mask application and removal, for example, solderability, susceptibility to electr
45、omigration, decrease of surface insulation resistance. 4 Containers and their markings The constituent compounds which are to be supplied to produce the cured peelable solder mask shall be supplied in sound, clean, dry containers. In addition to any statutory markings, each container in the consignm
46、ent shall be clearly and indelibly marked with the following: a) the type of material; b) the specified storage conditions and a final date for use; c) details of mixing and curing conditions; d) the lot or batch number and date of manufacture; e) the volume in the container; f) the identity of the
47、manufacturer and site of manufacture.EN61249-8-8:1997 BSI 04-2000 5 Annex A (informative) Conversion table IEC publication number Test method number Description Current IEC publication number Test method number IEC61189-1 1P01 Pre-conditioning, standard atmospheric conditioning IEC60326/9.1.1 18a IE
48、C61189-1 1P02 Pre-conditioning,125 C IEC60326/9.1.2 18b IEC61189-1 1P03 Accelerated ageing, steam/oxygen IEC60326/9.4 20a IEC61189-2 2C01 Resistance to sodium hydroxide IEC61189-2 2C02 Gel time of prepregnation IEC61189-2 2C03 Resin content of prepregnation by treated weight IEC61189-2 2C04 Volatile
49、 content of prepregnation IEC61189-2 2C05 Blistering after thermal shock IEC60249/3.7 IEC61189-2 2C06 Flammability, vertical IEC60249/4.3.4 IEC61189-2 2C07 Flammability, horizontal IEC60249/4.3.3 IEC61189-2 2C08 Flammability, flex material IEC60249/4.3.5 IEC61189-2 2C09 Melting viscosity of prepregnation materials IEC61189-2 2C10 Resin content of prepregnation by sublimation IEC61189-2 2D01 Thickness IEC60249/3.14 IEC61189-2 2E01 Surface tracking, moisture condition IEC60112 IEC61189-2 2E02 Electrical stre
