1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationSurface mounting technologyPart 3: Standard method for the specification of components for Through Hole Reflow (THR) solderingBS EN 61760-3:2010National forewordThis British Stan
2、dard is the UK implementation of EN 61760-3:2010. It isidentical to IEC 61760-3:2010.The UK participation in its preparation was entrusted to Technical CommitteeEPL/501, Electronic assembly technology.A list of organizations represented on this committee can be obtained onrequest to its secretary.Th
3、is publication does not purport to include all the necessary provisions of acontract. Users are responsible for its correct application. BSI 2010ISBN 978 0 580 63929 6ICS 31.190Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under t
4、he authority of the StandardsPolicy and Strategy Committee on 30 June 2010.Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 61760-3:2010EUROPEAN STANDARD EN 61760-3 NORME EUROPENNE EUROPISCHE NORM April 2010 CENELEC European Committee for Electrotechnical Standardi
5、zation Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1000 Brussels 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61760-3:2010 E ICS
6、 31.190 English version Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010) Technique du montage en surface - Partie 3: Mthode normalise relative la spcification des composants pour le brasage par refusi
7、on trous traversants (THR, Through Hole Reflow) (CEI 61760-3:2010) Oberflchenmontagetechnik - Teil 3: Genormtes Verfahren zur Spezifizierung von Durchsteckmontage-Bauelementen fr das Aufschmelzlten (THR) (IEC 61760-3:2010) This European Standard was approved by CENELEC on 2010-04-01. CENELEC members
8、 are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application
9、to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has
10、the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the N
11、etherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. BS EN 61760-3:2010EN 61760-3:2010 - 2 - Foreword The text of document 91/856/CDV, future edition 1 of IEC 61760-3, prepared by IEC TC 91, Electronics assembly technology, was submitt
12、ed to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61760-3 on 2010-04-01. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent righ
13、ts. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2011-01-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2013-04-01 Annex
14、ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61760-3:2010 was approved by CENELEC as a European Standard without any modification. _ BS EN 61760-3:2010- 3 - EN 61760-3:2010 Annex ZA (normative) Normative references to international publications with t
15、heir corresponding European publications The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE Whe
16、n an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60062 - Marking codes for resistors and capacitors EN 60062 - IEC 60068 Series Environmental testing EN 60068 Series IEC 60068-2-20 - Enviro
17、nmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads EN 60068-2-20 - IEC 60068-2-21 - Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices EN 60068-2-21 - IEC 60068-2-
18、45 + A1 1980 1993 Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents EN 60068-2-45 + A1 1992 1993 IEC 60068-2-58 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering
19、 heat of surface mounting devices (SMD) EN 60068-2-58 - IEC 60068-2-77 - Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock EN 60068-2-77 - IEC 60068-2-82 - Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric component
20、s EN 60068-2-82 - IEC 60194 - Printed board design, manufacture and assembly - Terms and definitions EN 60194 - IEC 60286 Series Packaging of components for automatic handling EN 60286 Series IEC 60286-3 - Packaging of components for automatic handling - Part 3: Packaging of surface mount components
21、 on continuous tapes EN 60286-3 - IEC 60286-4 - Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of form E and G EN 60286-4 - BS EN 61760-3:2010EN 61760-3:2010 - 4 - Publication Year Title EN/HD Year IEC 60286-5 - Packaging o
22、f components for automatic handling - Part 5: Matrix trays EN 60286-5 - IEC 60749-20 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat EN 60749-20 - IEC 61760-2 - Surface mounting te
23、chnology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide EN 61760-2 - IEC 62090 - Product package labels for electronic components using bar code and two- dimensional symbologies EN 62090 - ISO 8601 - Data elements and interchange formats - Infor
24、mation interchange - Representation of dates and times - - BS EN 61760-3:2010 2 61760-3 IEC:2010 CONTENTS 1 Scope and object6 2 Normative references .6 3 Terms and definitions .7 4 Requirements to component design and component specifications.8 4.1 General requirement .8 4.2 Packaging .8 4.3 Labelli
25、ng of product packaging 9 4.4 Component marking 9 4.5 Storage and transportation 10 4.6 Component outline and design 10 4.6.1 Drawing and specification10 4.6.2 Pick-up area requirements.10 4.6.3 Bottom surface requirements.10 4.6.4 Requirements to terminals.10 4.6.5 Component height .14 4.6.6 Compon
26、ent weight.14 4.7 Mechanical stress .14 4.8 Component reliability.14 4.9 Additional requirements for compatibility with lead-free soldering 15 5 Specification of assembly process conditions .15 5.1 Mounting by soldering .15 5.2 Reflow soldering methods (recommended) 16 5.2.1 Vapour phase reflow sold
27、ering.16 5.2.2 Forced air convection reflow soldering.16 5.3 Cleaning (where applicable) 17 5.3.1 General .17 5.3.2 Fluid 17 5.3.3 Ultrasonic cleaning 17 5.3.4 Vapour 17 5.3.5 Spray.17 5.3.6 Plasma cleaning 17 5.4 Removal and/or replacement.17 5.4.1 Removal and/or replacement of soldered components
28、17 6 Typical process conditions18 6.1 Printing of solder paste .18 6.2 Component insertion .18 6.3 Soldering processes, temperature/time profiles .18 6.3.1 Vapour phase soldering.19 6.3.2 Forced gas convection reflow soldering .20 6.4 Typical cleaning conditions for assemblies 21 6.5 Inspection of
29、solder joints21 7 Requirements for components and component specifications for THR soldering processes.21 7.1 General .21 7.2 Wettability .21 BS EN 61760-3:201061760-3 IEC:2010 3 7.3 Dewetting22 7.4 Resistance to soldering heat .22 7.5 Resistance to cleaning solvent 22 7.5.1 Solvent resistance of co
30、mponent .22 7.5.2 Solvent resistance of marking22 7.6 Soldering profiles 22 7.7 Moisture sensitivity level (MSL) .22 Figure 1 Example of a component with marked specific orientation put in tape and tray.9 Figure 2 Example of components in a tape.9 Figure 3 Examples for clearances (stand-off) .10 Fig
31、ure 4 Examples for terminal shapes and position tolerances .12 Figure 5 Schematic example of contrast of bottom surface terminals underneath component body .13 Figure 6 Schematic example of contrast of bottom surface terminals outside component body .13 Figure 7 Component weight / pipette suction st
32、rength 14 Figure 8 Process steps for soldering 15 Figure 9 Examples for printing of solder paste .18 Figure 10 SnPb Vapour phase soldering temperature/time profile (terminal temperature).19 Figure 11 Lead-free SnAgCu Vapour phase soldering temperature/time profile (terminal temperature) 19 Figure 12
33、 Forced gas convection reflow soldering temperature/time profile for SnPb solders 20 Figure 13 Forced gas convection reflow soldering temperature/time profile for lead-free SnAgCu solders.20 Table 1 Basic cleaning processes 21 BS EN 61760-3:2010 6 61760-3 IEC:2010 SURFACE MOUNTING TECHNOLOGY Part 3:
34、 Standard method for the specification of components for through hole reflow (THR) soldering 1 Scope and object This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are inte
35、nded for usage in through hole reflow soldering technology. The object of this standard is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requi
36、rements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technolo
37、gy. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60062, Marking cod
38、es for resistors and capacitors IEC 60068 (all parts), Environmental testing IEC 60068-2-20, Environmental testing Part 2-20: Tests Test T: Test methods for solderability and resistance to soldering heat of devices with leads IEC 60068-2-21, Environmental testing Part 2-21: Tests Test U: Robustness
39、of terminations and integral mounting devices IEC 60068-2-45:1980, Basic environmental testing procedures Part 2-45: Tests Test XA and guidance: Immersion in cleaning solvents Amendment 1:1993 IEC 60068-2-58, Environmental testing Part 2-58: Tests Test Td: Test methods for solderability resistance t
40、o dissolution of metallization and to soldering heat of surface mounting devices (SMD) IEC 60068-2-77, Environmental testing Part 2-77: Tests Body strength and impact shock IEC 60068-2-82, Environmental testing Part 2-82: Tests Test XW1: Whisker test methods for electronic and electric components IE
41、C 60194, Printed board design, manufacture and assembly Terms and definitions IEC 60286 (all parts), Packaging of components for automatic handling BS EN 61760-3:201061760-3 IEC:2010 7 IEC 60286-3, Packaging of components for automatic handling Part 3: Packaging of surface mount components on contin
42、uous tapes IEC 60286-4, Packaging of components for automatic handling Part 4: Stick magazines for electronic components encapsulated in packages of form E and G IEC 60286-5, Packaging of components for automatic handling Part 5: Matrix trays IEC 60749-20, Semiconductor devices Mechanical and climat
43、ic test methods Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat IEC 61760-2, Surface mounting technology Part 2: Transportation and storage conditions of surface mounting devices (SMD) Application guide IEC 62090, Product package labels for elec
44、tronic components using bar code and two-dimensional symbologies ISO 8601, Data elements and interchange formats Information interchange Representation of dates and times 3 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 60194 and the following apply.
45、3.1 terminal pitch distance between the terminals of the component, either uniformly distributed or specifically defined 3.2 dewetting condition that results when molten solder coats a surface and then recedes to leave irregularly-shaped mounds of solder that are separated by areas that are covered
46、with a thin film of solder and with the basis metal not exposed 3.3 dissolution of metallization process of dissolving metal or a plated metal alloy, usually by introduction of chemicals NOTE For the purpose of this document standard, the dissolution of metallization also includes dissolution by exp
47、osure to molten solder. 3.4 pick-up force dynamic force exerted on the body of a component generally from above and its seating plane during the pick-up of the component (e.g. from a tape or tray) NOTE The maximum level is normally taken into account. 3.5 placement force dynamic force exerted on the
48、 component body generally from above and its seating plane occurring during the period between the components first contact with the substrate (or the soldering paste or adhesive, etc.) and its coming to rest NOTE The maximum level is normally taken into account. BS EN 61760-3:2010 8 61760-3 IEC:201
49、0 3.6 resistance to soldering heat ability of a component to withstand the effects of the heat generated by the soldering process 3.7 seating plane surface on which a component rests 3.8 solderability ability of a metal to be wetted by molten solder 3.9 solder meniscus contour of a solder shape that is the result of the surface tension forces that take place during wetting 3.10 stand off distance between the comp
