1、Surface mounting technology Environmental and endurancetest methods for surface mountsolder joint Part 1-3: Cyclic drop testBS EN 62137-1-3:2009raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI British StandardsNational forewordThis British Standard
2、 is the UK implementation of EN 62137-1-3:2009. It isidentical to IEC 62137-1-3:2008.The UK participation in its preparation was entrusted to Technical CommitteeEPL/501, Electronic assembly technology.A list of organizations represented on this committee can be obtained onrequest to its secretary.Th
3、is publication does not purport to include all the necessary provisions of acontract. Users are responsible for its correct application. BSI 2009ISBN 978 0 580 57386 6ICS 31.190Compliance with a British Standard cannot confer immunity fromlegal obligations.Amendments issued since publicationAmd. No.
4、 Date Text affectedBRITISH STANDARDBS EN 62137-1-3:2009EUROPEAN STANDARD EN 62137-1-3 NORME EUROPENNE EUROPISCHE NORM February 2009 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central
5、 Secretariat: avenue Marnix 17, B - 1000 Brussels 2009 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 62137-1-3:2009 E ICS 31.190 English version Surface mounting technology - Environmental and endurance test methods for surface
6、mount solder joint - Part 1-3: Cyclic drop test (IEC 62137-1-3:2008) Technologie de montage en surface - Mthodes dessais denvironnement et dendurance des joints brass monts en surface - Partie 1-3: Essai de chute cyclique (CEI 62137-1-3:2008) Oberflchenmontage-Technik - Verfahren zur Prfung auf Umge
7、bungseinflsse und zur Prfung der Haltbarkeit von Oberflchen-Ltverbindungen - Teil 1-3: Zyklische Fallprfung (IEC 62137-1-3:2008) This European Standard was approved by CENELEC on 2009-02-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions
8、for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three of
9、ficial versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical co
10、mmittees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the U
11、nited Kingdom. BS EN 62137-1-3:2009EN 62137-1-3:2009 - 2 - Foreword The text of document 91/802/FDIS, future edition 1 of IEC 62137-1-3, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 62137-1-3 on 2009-02-01. T
12、he following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2009-11-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2012-02-01 Annex ZA ha
13、s been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 62137-1-3:2008 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following note has to be added for the standard indicated: IEC 60068-2-27 NO
14、TE Harmonized as EN 60068-2-27:200X1)(not modified). IEC 60068-2-31 NOTE Harmonized as EN 60068-2-31:2008 (not modified). _ 1)To be ratified. BS EN 62137-1-3:2009- 3 - EN 62137-1-3:2009 Annex ZA (normative) Normative references to international publications with their corresponding European publicat
15、ions The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has b
16、een modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60068-1 -2)Environmental testing - Part 1: General and guidance EN 60068-1 19943)IEC 60194 -2)Printed board design, manufacture and assembly - Terms and definitions EN 60194 20
17、063)IEC 61188-5 Series Printed boards and printed board assemblies - Design and use - Part 5: Attachment (land/joint) considerations EN 61188-5 Series IEC 61190-1-2 -2)Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electro
18、nics assembly EN 61190-1-2 20073)IEC 61192-1 -2)Workmanship requirements for soldered electronic assemblies - Part 1: General EN 61192-1 20033)IEC 61249-2-7 -2)Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials, clad and unclad - Epoxide woven E-g
19、lass laminated sheet of defined flammability (vertical burning test), copper-clad EN 61249-2-7 + corr. September 20023)2005 IEC 61760-1 -2)Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) EN 61760-1 20063)2)Undated reference. 3)Valid e
20、dition at date of issue. BS EN 62137-1-3:2009 2 62137-1-3 IEC:2008 CONTENTS 1 Scope.5 2 Normative references .5 3 Terms and definitions .5 4 General remarks.6 5 Test equipment and materials.7 5.1 Reflow soldering oven .7 5.2 Drop impact test equipment.7 5.3 Test substrate .7 5.4 Solder alloy .7 5.5
21、Solder paste7 5.6 Specimen components 7 5.7 Strain gauge8 6 Mounting method8 7 Test method and procedure, and judgment conditions 8 7.1 Test procedure 8 7.2 Judgment conditions .9 8 Items to be included in the test report.9 9 Items to be given in the product specification .9 Annex A (normative) Drop
22、 impact test equipment.11 Annex B (normative) Test method and procedure.13 Annex C (informative) An example of test equipment and procedure16 Annex D (informative) An example of strain gauge attachment procedure18 Bibliography23 Figure 1 Area for evaluation in the cyclic drop test.6 Figure 2 Typical
23、 reflow soldering profile.8 Figure A.1 Conceptual illustration of a substrate securing jig (reference) .12 Figure B.1 Strain gauge attachment example and guide mark 13 Figure B.2 Strain and other waveforms (example)14 Figure B.3 Examples of crack (fracture) modes14 Figure B.4 Correlation between the
24、 number of failures and the maximum strain.15 Figure C.1 Example of drop impact test equipment and connections for testing .16 Figure D.1 Items to use19 Figure D.2 Strain gauge attachment procedures 21 Figure D.3 Gauge factor compensation 21 Figure D.4 Example of attaching strain gauge and guide mar
25、k dimensions 22 BS EN 62137-1-3:200962137-1-3 IEC:2008 5 SURFACE MOUNTING TECHNOLOGY ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT Part 1-3: Cyclic drop test 1 Scope The test method described in this part of IEC 62137 applies to solder joints between terminals of surface mo
26、unting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The propertie
27、s of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only t
28、he edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-1, Environmental testing Part 1: General and guidance IEC 60194, Printed boards design, manufacture and assembly Terms and definitions IEC 61249-2-7, Material
29、s for printed boards and other interconnecting structures Part 2-7: Reinforced base materials clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad IEC 61188-5 (all parts 5), Printed boards and printed board assemblies Design and use Part
30、5: Attachment (land-joint) considerations IEC 61190-1-2, Attachment materials for electronic assembly Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly IEC 61192-1, Workmanship requirements for soldered electronic assemblies Part 1: General IEC 61760-
31、1, Surface mounting technology Part 1: Standard method for the specification of surface mounting components (SMDs) 3 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 60068-1 and IEC 60194, as well as the following definitions, apply. 3.1 drop impact str
32、ength strength of the test substrate held by a jig that is dropped from a specified height, as represented by the number of cyclic drops that finally cause fracture at the intermetallic, the BS EN 62137-1-3:2009 6 62137-1-3 IEC:2008 surface plating, or within the joint between a surface mounting dev
33、ice (SMD) termination and a printed wiring board (PWB) copper land termination 3.2 strain substrate surface strain value indication measured by the strain gauge attached to the surface of the test substrate NOTE It is a numeric dimensionless quantity representing the degree of stretching observed wh
34、en the test substrate is distorted. 3.3 maximum strain maximum strain in the tensile side (+) on the measured strain waveform 3.4 momentary interruption detector device that detects extremely short electrical discontinuity (momentary interruptions) in a daisy-chain circuit 4 General remarks The mech
35、anical properties of the joint between a terminal to a land on a printed wiring board using lead-free solder are not the same for the joint using tin-lead solder due to the difference in composing elements of the solders. Thus it becomes important to test the mechanical properties of solder joints u
36、sing different solder alloys. This test is to evaluate the durability of joints that are formed by reflow soldering between SMD pins/electrodes and substrate lands in relation to drop heights. To evaluate the drop impact that the specimen joint receives, the strain can be used as an indicator of the
37、 impact, and it can quantitatively be measured using a strain gauge. NOTE This drop impact test is not intended to be targeted at components themselves. Refer to IEC 60068-2-27 and IEC 60068-2-31 for test methods of the components. Figure 1 is a conceptual illustration of the joint strength evaluati
38、on area of this test. Substrate Plated layers Substrate land SMD component Solder Evaluation area Intermetallic compound layers IEC 2095/08 Figure 1 Area for evaluation in the cyclic drop test BS EN 62137-1-3:200962137-1-3 IEC:2008 7 5 Test equipment and materials 5.1 Reflow soldering oven Unless ot
39、herwise specified, the reflow soldering oven shall be able to realize the temperature profile given in Figure 2. 5.2 Drop impact test equipment This test equipment shall consist of a tester with a substrate securing jig and a measuring instrument. Unless otherwise specified, the following specificat
40、ions apply. a) Tester: Use a tester that fulfills the requirements specified in Clause A.2. b) Substrate securing jig: Use a substrate securing jig that fulfills the requirements specified in A.2.2. c) Measuring instrument: Use a measurement instrument that fulfills the requirements specified in A.2
41、.3. 5.3 Test substrate Unless otherwise prescribed by the relevant specification, the test shall be conducted on a specimen (device) mounted by its normal means on the following substrate: a) Material: The substrate shall be a general double-sided board that is, as specified in IEC 61249-2-7. b) Thi
42、ckness: The substrate thickness shall be either 1,0 mm or as specified in IEC 61249-2-7. c) Size: The substrate shall be of a size that allows testing using the jig specified in 5.2 b). NOTE Since the substrate is supported at its margins, there should not be lands (e.g., check lands) at the margins
43、 of the substrate. d) Land geometry: The shape and size of a land shall comply with the IEC 61188-5 series or as specified by the component manufacturer. e) Surface protection: The solderable areas of the substrate (lands) shall be protected against oxidization by suitable means, e.g. by an organic
44、or inorganic surface protection layer. This protective layer shall not adversely have an effect on the solderability of the lands under the soldering conditions described in Clause 6. 5.4 Solder alloy Unless otherwise specified, the solder used in this test shall be Sn96,5Ag,30Cu0,5. 5.5 Solder past
45、e Unless otherwise specified, the solder paste used in this test shall comply with IEC 61190-1-2. The solder alloy specified in 5.4 shall be used for the solder paste. 5.6 Specimen components Unless otherwise specified, specimen components shall be of a structure that allows continuity to be checked
46、 (e.g., daisy chain). They shall be designed based on the same specifications as the actually used components. The solder joints should be checked, as specified in IEC 61192-1, and the pattern design should be in accordance with the IEC 61188-5 series. When using daisy-chain connections, care shall
47、be taken not to cause any break in wiring patterns on the substrate. For example, the wiring patterns should be drawn not in the longitudinal direction on the test substrate, but in the crosswise direction. BS EN 62137-1-3:2009 8 62137-1-3 IEC:2008 5.7 Strain gauge Unless otherwise specified, the fo
48、llowing specifications apply: a) The gauge length shall be 1 mm. b) The strain gauge shall be a foil-type gauge. c) The strain gauge shall be of a single-axis type. 6 Mounting method The following steps shall be taken: a) Apply the solder paste specified in 5.5 to the lands of a test substrate as sp
49、ecified in 5.3, using a metal mask with openings of the same size, shape and configuration as the lands on the substrate, made of stainless steel with a thickness of 100 m to 150 m. b) Mount the test specimen on the test substrate with solder paste applied. c) Use the reflow-soldering oven specified in 5.1 to solder the terminals under the conditions given below. Typical temperature profile of reflow soldering is given in Figure 2 as proposed in IEC
