1、BRITISH STANDARD BS EN 62326-4:1997 IEC 2326-4: 1996 QC 230500: 1996 Printed boards Part 4: Rigid multilayer printed boards with interlayer connections Sectionalspecification The European Standard EN 62326-4:1997 has the status of a British Standard ICS 31.180BSEN62326-4:1997 This British Standard,
2、having been prepared under the directionof the Electrotechnical Sector Board, was published underthe authority of the Standards Board and comes intoeffect on 15June1997 BSI 03-2000 ISBN 0 580 27485 3 National foreword This British Standard is the English language version of EN62326-4:1997. It is ide
3、ntical with IEC2326-4:1996. This Part of BSEN62326forms the sectional specification in the IEC quality assessment system for electronic components (IECQ) for rigid multilayer printed boards with interlayer connections. In the IECQ system, this specification is numbered QC230500. The UK participation
4、 in its preparation was entrusted to Technical Committee EPL/52, Printed circuits, which has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interest
5、s informed; monitor related international and European developments and promulgate them in the UK. A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references Attention is drawn to the fact thatAnnex ZA lists normative references to internation
6、al publications with their corresponding European publications. The British Standards which implement these international or European publications may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or using the “Find” facility of th
7、e BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Sum
8、mary of pages This document comprises a front cover, an inside front cover, pagesiandii, theEN title page, pages2to 32 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cov
9、er. Amendments issued since publication Amd. No. Date CommentsBSEN62326-4:1997 BSI 03-2000 i Contents Page National foreword Inside front cover Foreword 2 Text of EN 62326-4 3ii blankEUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 62326-4 January 1997 ICS 31.180 Descriptors: Printed boards, rig
10、id multilayer, interlayer connections, capability approval, sectional specification English version Printed boards Part 4: Rigid multilayer printed boards with interlayer connections Sectional specification (IEC 2326-4:1996) Cartes imprimes Partie 4: Cartes imprimes multicouches rigides avec connexi
11、ons intercouches Spcification intermdiaire (CEI 2326-4:1996) Leiterplatten Teil 4: Starre Mehrlagen-Leiterplatten mit Durchverbindungen Rahmenspezifikation (IEC2326-4:1996) This European Standard was approved by CENELEC on1996-12-09. CENELEC members are bound to comply with the CEN/CENELEC Internal
12、Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member
13、. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC m
14、embers are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit
15、 Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1997 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 62326-4:1997 EEN62326-4:1997 B
16、SI 03-2000 2 Foreword The text of document52/655/FDIS, future edition1of IEC2326-4, prepared by IECTC52, Printed circuits, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN62326-4on1996-12-09. The following dates were fixed: This part4is to be used in conjunction with
17、EN62326-1:1997 and EN62326-4-1:1997. Annexes designated “normative” are part of the body of the standard. Annexes designated “informative” are given for information only. In this standard, Annex ZA is normative and Annex A, Annex B andAnnex C are informative. Annex ZA has been added by CENELEC. Endo
18、rsement notice The text of the International Standard IEC2326-4:1996 was approved by CENELEC as a European Standard without any modification. Contents Page Foreword 2 1 Scope 3 2 Normative references 3 3 General 3 4 Capability approval and maintenance of capability approval 4 5 Test specimens 4 6 Te
19、st sequence 5 7 Quality assessment 6 8 Customer Detail Specification (CDS) data 6 9 Characteristics of printed boards 6 10 Capability test programme 21 11 Quality conformance inspection 21 12 Test specimens 22 Annex A (informative) Acronyms related to IECQ and their explanations 27 Annex B (informat
20、ive) Conversion table 28 Annex C (informative) Bibliography 31 Annex ZA (normative) Normative references to international publications with their corresponding European publications 32 Figure 1 Resin smear at interface 22 Figure 2 Circumferential defects 23 Figure 3 Conductor pattern defects 23 Figu
21、re 4 Minimum annular width (W 1 ) of external land 24 Figure 5 Minimum annular width (W 2 ) of internal land 24 Figure 6 Hole break-out 25 Figure 7 Examples of soldered holes 26 Table 1 Performance requirements 7 latest date by which the ENhas to be implemented at national level by publication of an
22、 identical national standard or by endorsement (dop) 1997-09-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) EN62326-4:1997 BSI 03-2000 3 1 Scope This part of IEC2326is applicable to rigid multilayer printed boards irrespective of their method of man
23、ufacture. It is the basis on which agreements between manufacturer and user are to be made. This standard provides additional information necessary to supplement the requirements of the Generic Specification, IEC2326-1, for the printed boards intended to be accepted under the IEC Quality Assessment
24、System for Electronic Components (IECQ). This standard establishes uniform requirements, specifies the characteristics to be assessed and the test methods to be used for quality conformance (whether by lot-by-lot inspection, process control, or periodic inspection). 2 Normative references The follow
25、ing normative documents contain provisions which, through reference in this text, constitute provisions of this part of IEC2326. At the time of publication, the editions indicated were valid. All normative documents are subject to revision, and parties to agreements based on this part of IEC2326 are
26、 encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. Members of IEC and ISO maintain registers of currently valid International Standards. IEC 68-2-3:1969, Environmental testing Part 2: Tests Test Ca: Damp heat, steady state. IEC
27、 68-2-20:1979, Environmental testing Part 2: Tests Test T: Soldering. IEC 68-2-38:1974, Environmental testing Part 2: Tests Test Z/AD: Composite temperature/humidity cyclic tests. IEC/FDIS 1189-3, Test methods for electrical materials, interconnections structures and assemblies Part 3: Test methods
28、for interconnection structures 1) . IEC 1249-5-1:1995, Materials for interconnection structures Part 5: Sectional specification set for conductive foils and films with and without coatings Section 1: Copper foils (for the manufacture of copper-clad base materials). IEC 2326-1:1995, Printed boards Pa
29、rt 1: Generic Specification. IEC 2326-4-1, Printed boards Part 4: Rigid multilayer printed boards with interlayer connections Section 1: Capability detail specification: Performance levels A, B and C. QC 001002:1986, Rules of Procedure of the IEC Quality Assessment System for Electronic Components (
30、IECQ). 3 General Unless otherwise specified all clauses and tables given in this standard are applicable to printed boards in compliance with the IECQ system. The procedure and requirements shall be in accordance with IEC2326-1. 3.1 Printed boards fully compliant with the requirements for standard p
31、erformance levels (level A, B, or C) This Sectional Specification (SS) applies to rigid multilayer printed boards and is intended as a basis for the preparation of Capability Detail Specifications (Cap DS) applying to performance levels (i.e. level A, level B or levelC), used in capability approval
32、procedures. It is usually necessary to have a Cap DS describing all the performance levels. A Cap DS is prepared by the IEC. Customer Detail Specifications (CDS) for printed boards as required by 7.2 of IEC2326-1. The CDS shall specify the selected performance level according to Table 1 of this stan
33、dard. The CDS data shall be provided by the customer and allocated a number within his own system. Printed boards materials for printed board fabrication may be any combination of base materials according to IEC1249-2-7, or IEC1249-2-11, or IEC1249-2-9, with prepreg according to IEC1249-4-1 and/or c
34、opper foil according to IEC1249-5-1and/or permanent polymer coating according to IEC1249-8-5. 1) At present at the stage of Final Draft International Standard.EN62326-4:1997 4 BSI 03-2000 Table 1 contains the characteristics that are used in the performance requirements important for rigid multilaye
35、r printed boards with interlayer connections and makes reference to the appropriate tests to verify these characteristics. The CDS data shall specify characteristics and tests from this table. Where additional details for a test have to be specified in the CDS data, an asterisk is shown in the relev
36、ant column. These details shall then be specified in accordance with IEC1189-3. Clause6 prescribes the test sequence. 3.2 Printed boards with non-standard requirements (performance level X) This Sectional Specification (SS) applies to rigid multilayer printed boards and is intended as a basis for th
37、e preparation of Customer Detail Specifications (CDS) for printed boards as required by 7.2 of IEC2326-1. The CDS shall be provided by the customer and he shall allocate a number within his own system. The customer has the responsibility for establishing the requirements usingTable 1 of this standar
38、d but in no case the performance level will be lower than performance level A. When another Risk Management Factor (RMF) is chosen the CDS data shall specify one of the more severe RMFs of Table1of IEC2326-1. Printed board materials used for printed board fabrication shall be specified in the CDS. W
39、here additional details for a test have to be specified in the CDS data, an asterisk is shown in the relevant column ofTable 1. These details shall then be specified in accordance with IEC1189-3. Clause6 prescribes the test sequence. 4 Capability approval and maintenance of capability approval In or
40、der to be a participant in the IECQ system the printed board manufacturer shall obtain capability approval in accordance with clause 5 of IEC2326-1. 4.1 Product capability In order to obtain product capability approval the manufacturer shall complete the test requirements detailed in the Cap DS for
41、which approval is sought. Approval to level A is limited only to performance levelA. Approval to level B is limited to performance levels A and B. Approval to level C extends to three registered performance levels (levels A, B or C). 4.2 Process capability For process capability 5.5.3 of IEC2326-1sh
42、all apply. 4.3 Maintenance of capability approval The manufacturer shall maintain the status of approved capability by successful completion of quality conformance or equivalent inspections of the product defined by CDS data for the level of the original capability approval. In the event of failure
43、to meet the requirements of the CDS data, remedial action shall be taken to correct the discrepancy. To maintain capability approval, the manufacturing performance shall be verified as defined above and in5.8 of IEC2326-1. 5 Test specimens 5.1 Printed boards fully compliant with the requirements for
44、 standard performance levels (level A, B or C) The specimens to be used as Capability Qualifying Component (CQC) shall be the Capability Test Board (CTB) or multiple arrangements of the CTB given in clause 6 of IEC2326-4-1, or a Production Panel (PP) that has similar specimens available for testing.
45、 For the definitions of level A, B and C see 3.2 of IEC2326-1 5.2 Printed boards with non-standard requirements (performance level X) The specimens shall be production panels that have suitable patterns available for testing. If additional patterns are necessary, they shall be fully defined in the C
46、DS data.EN62326-4:1997 BSI 03-2000 5 6 Test sequence The tests shall be carried out in the test group sequence as given below. Unless otherwise stated, the sequence of tests within a particular test group is not relevant. The test codes used for indicating the tests are the same codes as used inTabl
47、e 1. Test group 1: In-process tests Test group 2: Visual and dimensional examinations (non-destructive) Test group 3: Surface condition tests (non-destructive) Test group 4: Electrical tests (non-destructive) Test group 5: Destructive tests V5.2: Visual examination of internal conductors; V6.2: Visu
48、al examination of particles between internal conductors; D5.2: Dimensional examination of conductor widths on internal layers; D6.2: Dimensional examination of spacing between conductors on internal layers. V1: Visual examination of conformity; V2: Visual examination of appearance and workmanship; V
49、3: Visual examination of plated-through holes as received; V5.1: Visual examination of external conductors; V6.1: Visual examination of particles between external layers; V7: Visual examination of permanent polymer coatings; D1: Dimensional examination of board dimensions (external boundary); D2: Dimensional examination of board thickness in the zone of edge board contacts; D3.1: Dimensional examination of hole diameters; D4: Dimensional examination of slots, cut-outs and notches;
