1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationEMC IC modelling Part 2: Models of integrated circuits for EMI behavioural simulation Conducted emissions modelling (ICEM-CE)BS EN 62433-2:2010National forewordThis British Stand
2、ard is the UK implementation of EN 62433-2:2010. It isidentical to IEC 62433-2:2008.The UK participation in its preparation was entrusted to Technical CommitteeEPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication doe
3、s not purport to include all the necessary provisions of acontract. Users are responsible for its correct application. BSI 2010ISBN 978 0 580 58523 4ICS 31.200Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of th
4、e StandardsPolicy and Strategy Committee on 28 February 2010Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 62433-2:2010EUROPEAN STANDARD EN 62433-2 NORME EUROPENNE EUROPISCHE NORM January 2010 CENELEC European Committee for Electrotechnical Standardization Comit
5、Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: Avenue Marnix 17, B - 1000 Brussels 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 62433-2:2010 E ICS 31.200 Eng
6、lish version EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE) (IEC 62433-2:2008) Compatibilit lectromagntique (CEM) - Partie 2: Modles de circuits intgrs pour la simulation du comportement lors de perturbations lectroma
7、gntiques -Modlisation des missions conduites (ICEM-CE) (CEI 62433-2:2008) EMV-IC-Modellierung - Teil 2: Modelle integrierter Schaltungen fr die Simulation des Verhaltens bei elektromagnetischer Beeinflussung - Modellierung leitungsgefhrter Aussendungen (ICEM-CE) (IEC 62433-2:2008) This European Stan
8、dard was approved by CENELEC on 2009-12-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concern
9、ing such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into it
10、s own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland,
11、Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. BS EN 62433-2:2010EN 62433-2:2010 - 2 - Foreword The text of document 47A/794/FDIS, future edition 1 of IEC 62433-2, prepar
12、ed by SC 47A, Integrated circuits, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 62433-2 on 2009-12-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an ide
13、ntical national standard or by endorsement (dop) 2010-09-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2012-12-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 62433-2:2008 was approved by CENEL
14、EC as a European Standard without any modification. _ BS EN 62433-2:2010- 3 - EN 62433-2:2010 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following referenced documents are indispensable for the application of this docume
15、nt. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Public
16、ation Year Title EN/HD Year IEC 61967 Series Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz EN 61967 Series IEC 61967-4 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm di
17、rect coupling method EN 61967-4 - BS EN 62433-2:2010 2 62433-2 IEC:2008(E) CONTENTS 1 Scope.7 2 Normative references .7 3 Terms and definitions .7 4 Philosophy .8 4.1 General .8 4.2 Conducted emission from core activity (digital culprit) .8 4.3 Conducted emission from I/O activity.9 5 Basic componen
18、ts 9 5.1 General .9 5.2 Internal Activity (IA).9 5.3 Passive Distribution Network (PDN) 10 6 IC macro-models 12 6.1 General .12 6.2 General IC macro-model .12 6.3 Block-based IC macro-model.13 6.3.1 Block component .13 6.3.2 Inter-Block Coupling component (IBC) .14 6.3.3 Block-based IC macro-model s
19、tructure 15 6.4 Sub-model-based IC macro-model 17 6.4.1 Sub-model component.17 6.4.2 Sub-model-based IC macro-model structure 18 7 Requirements for parameter extraction.19 7.1 General .19 7.2 Environmental extraction constraints .19 7.3 IA parameter extraction .19 7.4 PDN parameter extraction .19 7.
20、5 IBC parameter extraction.19 Annex A (informative) Model parameter generation20 Annex B (informative) Decoupling capacitors optimization .38 Annex C (informative) Conducted emission prediction40 Annex D (informative) Conducted emission prediction at PCB level .41 Bibliography43 Figure 1 Decompositi
21、on example of a digital IC for conducted emissions analysis .8 Figure 2 IA component.9 Figure 3 Example of IA characteristics in time domain .10 Figure 4 Example of IA characteristics in frequency domain.10 Figure 5 Example of a four-terminal PDN using lumped elements 11 Figure 6 Example of a seven-
22、terminal PDN using distributed elements 11 Figure 7 Example of a twelve-terminal PDN using matrix representation 12 Figure 8 General IC macro-model 13 Figure 9 Example of block component13 Figure 10 Example of block components for I/Os .14 BS EN 62433-2:201062433-2 IEC:2008(E) 3 Figure 11 Example of
23、 IBC with two internal terminals.15 Figure 12 Relationship between blocks and IBC.15 Figure 13 Block-based IC macro-model16 Figure 14 Example of block-based IC macro-model17 Figure 15 Example of simple sub-model.18 Figure 16 Sub-model-based IC macro-model .18 Figure A.1 Typical characterization curr
24、ent gate schematic22 Figure A.2 Current peak during switching transition .22 Figure A.3 Example of IA extraction procedure from design .23 Figure A.4 Technology Influence23 Figure A.5 Final current waveform for a program period.24 Figure A.6 Comparison between measurement and simulation.24 Figure A.
25、7 Lumped element model of a package25 Figure A.8 Circuit structure of the netlist 26 Figure A.9 Principle of the IA computation .27 Figure A.10 Process involved to model iA(t) .27 Figure A.11 iExt(t) measured using IEC 61967-428 Figure A.12 iA(t)and iExt(t) profiles 28 Figure A.13 Example of a hardw
26、are set-up used to extract the PDN parameters 30 Figure A.14 Miniature 50 coaxial connectors 30 Figure A.15 Impedance probe using two miniature coaxial connectors .31 Figure A.16 Open and short terminations .31 Figure A.17 Measurement probe model31 Figure A.18 De-embedding principle 32 Figure A.19 E
27、xample of a predefined PDN structure 33 Figure A.20 RL configuration .34 Figure A.21 RLC configuration .34 Figure A.22 RLC with magnetic coupling configuration.35 Figure A.23 Impedance seen from Vcc and Gnd 35 Figure A.24 Complete PDN component36 Figure A.25 Set-up for correlation (left), measuremen
28、t and prediction (right)37 Figure A.26 Set-up used to measure the internal decoupling capacitor 37 Figure B.1 Equivalent schematic of the complete electronic system .38 Figure B.2 Impedance prediction and measurements .39 Figure C.1 IEC 61967-4 test set-up standard .40 Figure C.2 Comparison between
29、prediction and measurement .40 Figure D.1 Prediction of the Vdcc noise level at PCB level.41 Figure D.2 Good agreements on the noise envelope42 BS EN 62433-2:2010 4 62433-2 IEC:2008(E) Table A.1 Typical parameters for CMOS logic technologies .20 Table A.2 Typical number of logic gates vs. CPU techno
30、logy .21 Table A.3 R, L and C parameters for various package types 21 Table A.4 Measurement configurations and extracted RLC parameters33 BS EN 62433-2:201062433-2 IEC:2008(E) 7 EMC IC MODELLING Part 2: Models of integrated circuits for EMI behavioural simulation Conducted emissions modelling (ICEM-
31、CE) 1 Scope This part of IEC 62433 specifies macro-models for ICs to simulate conducted electromagnetic emissions on a printed circuit board. The model is commonly called Integrated Circuit Emission Model - Conducted Emission (ICEM-CE). The ICEM-CE model can also be used for modelling an IC-die, a f
32、unctional block and an Intellectual Property block (IP). The ICEM-CE model can be used to model both digital and analogue ICs. Basically, conducted emissions have two origins: conducted emissions through power supply terminals and ground reference structures; conducted emissions through input/output
33、 (I/O) terminals. The ICEM-CE model addresses those two types of origins in a single approach. This standard defines structures and components of the macro-model for EMI simulation taking into account the ICs internal activities. This standard gives general data, which can be implemented in differen
34、t formats or languages such as IBIS, IMIC, SPICE, VHDL-AMS and Verilog. SPICE is however chosen as default simulation environment to cover all the conducted emissions. This standard also specifies requirements for information that shall be incorporated in each ICEM-CE model or component part of the
35、model for model circulation, but description syntax is not within the scope of this standard. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edi
36、tion of the referenced document (including any amendments) applies. IEC 61967 (all parts), Integrated Circuits Measurement of electromagnetic emissions, 150 KHz to 1 GHz IEC 61967-4, Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 4: Measurement of conducted emiss
37、ions 1 /150 direct coupling method 3 Terms and definitions For the purposes of this document, the following terms and definitions apply. BS EN 62433-2:2010 8 62433-2 IEC:2008(E) 3.1 external terminal terminal of an IC macro-model, which interfaces the model to the external environment of the IC, suc
38、h as power supply pins and I/O pins NOTE In this document, the name of each external terminal starts with “ET“. 3.2 internal terminal terminal of an IC macro-models component, which interfaces the component to other components of the IC macro-model NOTE In this document, the name of each internal te
39、rminal starts with “IT“. 4 Philosophy 4.1 General Integrated circuits will have more and more gates on silicon and technical progress will develop faster. To predict the electromagnetic behaviour of equipment, it is required to model the switching of the input and output interface and the internal a
40、ctivities of an integrated circuit effectively. Figure 1 depicts an example of decomposition of an IC to enable conducted emissions analysis. The internal digital activity (culprit) is a source of electromagnetic noise that originates in switching of active devices. The coupling path propagates the
41、emissions to the ICs external terminals: pins/pads. The coupling path is the power distribution network or I/O lines inside the IC. Digital Culprit(EmissionSource)Digital CouplingpathI/Os CouplingpathI/Os Culprit(Emission Source)I/OVdd VssInter Block Coupling PathVssVddPower DistributionNetworkICFig
42、ure 1 Decomposition example of a digital IC for conducted emissions analysis 4.2 Conducted emission from core activity (digital culprit) The current transients are created in the core area on the IC-die. Due to the characteristics of the digital coupling paths, the passive distribution network on pr
43、inted circuit board (PCB) and the availability of on-chip decoupling, a portion of these current transients will occur at the power supply pins of the IC. IEC 1644/08 BS EN 62433-2:201062433-2 IEC:2008(E) 9 NOTE These off-chip power supply currents can be measured according to the IEC 61967 series.
44、4.3 Conducted emission from I/O activity I/Os activities may create voltage fluctuations of power and ground levels, and conducted emissions appear at power and ground pins through the I/Os coupling path. And the output signals at output pins themselves are sources of conducted emissions to the prin
45、ted circuit boards. NOTE The measurement set-up is done according to the IEC 61967 series. 5 Basic components 5.1 General The basic components are component parts of the IC macro-model or block component or sub-model component. The following subclauses define the basic components. NOTE The block com
46、ponent and the sub-model component are defined in Subclause 6.3.1 and 6.4.1 respectively. 5.2 Internal Activity (IA) The Internal Activity (IA) component is the electromagnetic noise source that originates in switching of active devices in the IC or in a portion of the IC. This component is applicab
47、le for both analogue and digital circuitry. The IA is described using an independent current source or an independent voltage source with two internal terminals as shown in Figure 2. ITA-0ITA+0Figure 2 IA component The characteristics of IA component are typically described in the time domain, and t
48、he characteristics can also be described in the frequency domain. The description of an IA component shall contain the following information. Name of the IA component Names of its internal terminals Operational mode or test vector Domain (time or frequency) Definition of origin of time, and cycle-ti
49、me for the operational mode (for time domain) Definition of origin of phase (for frequency domain) Operational conditions and applicable ranges a) Power supply voltage ranges b) Temperature range IEC 1645/08 BS EN 62433-2:2010 10 62433-2 IEC:2008(E) c) Frequency range Characteristics of the IA a) Current or voltage waveform over the whol
