1、Semiconductor devices Semiconductor interface forhuman body communicationPart 2: Characterization of interfacing performancesBS EN 62779-2:2016BSI Standards PublicationNational forewordThis British Standard is the UK implementation of EN 62779-2:2016. It isidentical to IEC 62779-2:2016.The UK partic
2、ipation in its preparation was entrusted to TechnicalCommittee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsible for its
3、 correct application. The British Standards Institution 2016.Published by BSI Standards Limited 2016ISBN 978 0 580 78702 7ICS 31.080.01Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and St
4、rategy Committee on 30 June 2016.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 62779-2:2016EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 62779-2 May 2016 ICS 31.080.01 English Version Semiconductor devices - Semiconductor interface for human body commun
5、ication - Part 2: Characterization of interfacing performances (IEC 62779-2:2016) Dispositifs semiconducteurs - Interface semiconducteurs pour les communications via le corps humain - Partie 2: Caractrisation des performances dinterfaage (IEC 62779-2:2016) Halbleiterbauelemente - Halbleiterschnittst
6、elle zur Kommunikation ber den menschlichen Krper - Teil 2: Beschreibung der Schnittstellenfunktion (IEC 62779-2:2016) This European Standard was approved by CENELEC on 2016-03-24. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving
7、 this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three of
8、ficial versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrote
9、chnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania
10、, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2
11、016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 62779-2:2016 EBS EN 62779-2:2016EN 62779-2:2016 2 European foreword The text of document 47/2268/FDIS, future edition 1 of IEC 62779-2, prepared by IEC/TC 47 “Semiconductor devices
12、“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 62779-2:2016. The following dates are fixed: g120 latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2016-12-24 g120 latest d
13、ate by which the national standards conflicting with the document have to be withdrawn (dow) 2019-03-24 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all su
14、ch patent rights. Endorsement notice The text of the International Standard IEC 62779-2:2016 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following note has to be added for the standard indicated : IEC 62779 NOTE Harmonized i
15、n EN 62779 series. BS EN 62779-2:2016 2 IEC 62779-2:2016 IEC 2016 CONTENTS FOREWORD . 3 INTRODUCTION . 5 1 Scope 6 2 Normative references. 6 3 Terms, definitions and letter symbols . 6 3.1 General terms . 6 3.2 Signal characteristics 9 3.3 Letter symbols 11 4 Measurement of electrical performances o
16、f electrode . 11 4.1 Measurement setup . 11 4.2 Measurement apparatus and signal specifications 12 4.2.1 Transmitter and receiver module 12 4.2.2 Synchronization module . 13 4.2.3 Measurement equipment 13 4.2.4 Signal specifications 13 4.3 Measurement procedure 14 4.3.1 General . 14 4.3.2 Attachment
17、 of transmitter and receiver modules 14 4.3.3 Transmission of pulse and synchronization signals . 14 4.3.4 Synchronization of measurement equipment . 14 4.3.5 Signal processing in receiver module 14 4.3.6 Measurement of pulse and processed signal . 14 4.3.7 Compensation for signal processing . 14 4.
18、3.8 Computation of impulse response and complex transfer function . 14 4.4 Post processing for electrode performances . 14 4.4.1 General . 14 4.4.2 In-band average signal-loss . 14 4.4.3 In-band average phase-shift . 15 4.4.4 RMS delay . 15 4.4.5 Coherent bandwidth . 15 Bibliography . 17 Figure 1 Pu
19、lse signal . 8 Figure 2 Synchronization signal 9 Figure 3 Measurement setup 12 Table 1 Letter symbols . 11 BS EN 62779-2:2016IEC 62779-2:2016 IEC 2016 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES SEMICONDUCTOR INTERFACE FOR HUMAN BODY COMMUNICATION Part 2: Characterization of
20、interfacing performances FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerni
21、ng standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their p
22、reparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates close
23、ly with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevan
24、t subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the tec
25、hnical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum ex
26、tent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provid
27、e conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or it
28、s directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses
29、arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention
30、 is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62779-2 has been prepared by IEC technical committee 47: Semiconductor devic
31、es. The text of this standard is based on the following documents: FDIS Report on voting 47/2268/FDIS 47/2278/RVDFull information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with th
32、e ISO/IEC Directives, Part 2. BS EN 62779-2:2016 4 IEC 62779-2:2016 IEC 2016 A list of all parts in the IEC 62779 series, published under the general title Semiconductor devices Semiconductor interface for human body communication, can be found on the IEC website. The committee has decided that the
33、contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be g120 reconfirmed, g120 withdrawn, g120 replaced by a revised edition, or g120
34、 amended. BS EN 62779-2:2016IEC 62779-2:2016 IEC 2016 5 INTRODUCTION The IEC 62779 series is composed of three parts as follow: g120 IEC 62779-1 defines general requirements of a semiconductor interface for human body communication. It includes general and functional specifications of the interface.
35、 g120 IEC 62779-2 defines a measurement method on electrical performances of an electrode that constructs a semiconductor interface for human body communication. g120 IEC 62779-3 defines functional type of a semiconductor interface for human body communication, and operational conditions of the inte
36、rface. BS EN 62779-2:2016 6 IEC 62779-2:2016 IEC 2016 SEMICONDUCTOR DEVICES SEMICONDUCTOR INTERFACE FOR HUMAN BODY COMMUNICATION Part 2: Characterization of interfacing performances 1 Scope This part of IEC 62779 defines a measurement method on electrical performances of an electrode that composes a
37、 semiconductor interface for human body communication (HBC). In the measurement method, a signal transmitter is electrically isolated from a signal receiver, so an isolation condition between the transmitter and receiver is maintained to accurately measure the electrodes performances. This part incl
38、udes general and functional specifications of the measurement method. HBC uses the body of a user as a transmission medium using near-field coupling inside the body: a signal transmitter and receiver are coupled with each other through a near field that is formed inside the human body and air. The i
39、ntensity of the near field is strong especially inside the body due to high dielectric constant of the body, so a data signal is transmitted through the human body by modulating the near field. A signal transmitter and receiver for HBC include an internal ground respectively, and, in most HBC applic
40、ations, the grounds are separated from each other as maintaining the coupling condition through the air. Quality of a data transmission strongly depends on a coupling degree between the grounds; hence, it is important to maintain the coupling degree between grounds of a signal transmitter and receiv
41、er for an accurate measurement of the electrodes performances. This part defines a measurement method to measure electrical performances of an electrode while the coupling degree between grounds of a signal transmitter and receiver is maintained. NOTE 1 HBC semiconductor interface consists of an ele
42、ctrode and analog front end. NOTE 2 General analog and digital modulation techniques can be used to modulate a near field used in HBC, and a modulation technique to be used is determined according to required performances for a data transmission and a HBC application. 2 Normative references The foll
43、owing referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. None. 3 Terms, definitions and letter symbols For the pur
44、poses of this document, the following terms and definitions apply. 3.1 General terms 3.1.1 electrode physical structure to transmit an electrical signal between an analog front end and the human body while attached to or located near the human body Note 1 to entry: An electrode transfers an electric
45、al signal to be transmitted to a non-metallic transmission channel, the human body. It also transfers an electrical signal received from the human body to the analog front end. BS EN 62779-2:2016IEC 62779-2:2016 IEC 2016 7 Note 2 to entry: electrode can have an adhesive material on its surface like
46、a disposable ECG electrode to be attached itself to the human body; or a metal surface for a simple implementation. In the case of a metal surface, an electrode makes contact with the human body by attaching it to the human body using an attachment aid like a rubber band; or simply touching it with
47、the hand. SOURCE: IEC 62779-1: 3.1.1, modified Note 2 to entry has been added. 3.1.2 transmitter module circuit module that generates a pulse signal to be transmitted to the human body through an electrode for measurement of the electrodes performances; and a synchronization signal of an optical typ
48、e to be transmitted through an optical cable for synchronization of the pulse signal transmitted through the human body Note 1 to entry: A transmitter module includes a signal amplifier to amplify the transmitting pulse signal; and a signal filter to remove a signal component causing an interference
49、 to other measurement modules and measurement equipment. 3.1.3 receiver module circuit module that processes a pulse signal received from the human body through an electrode to increase signal quality for measurement of the electrodes performances Note 1 to entry: A receiver module includes a signal amplifier to amplify the received pulse signal; and a signal filter to remove a noise or interference signal from the received pulse signal. 3.1.4 synchronization module circuit module that transfo
