1、BRITISH STANDARD BS IEC60747-10:1991Incorporating Harmonized system of quality assessment for electronic componentsSemiconductor devicesGeneric specification for discrete devices and integrated circuitsICS 31.080corrigendumJune 2011National forewordThis British Standard is the UK implementation of I
2、EC 60747-10:1991. It is identical to IEC 60747-10:1991.BS QC 700000:1991/IEC 747-10:1991 (renumbered as BS IEC 60747-10:1991) and BS IEC 60748-11:2000 supersede BS 9450:1998, which has a status of obsolescence but remains available for use in connection with existing component approvals.The Technica
3、l Committee has reviewed the provisions of IEC 27, IEC 50, IEC 410, IEC 747-11, QC 001002, and ISO 2859 to which reference is made in the text, and has decided that they are acceptable for use in conjunction with this standard. Related British Standards to IEC 50, IEC 410, QC 001002, and ISO 2859 ar
4、e BS 6100-3.1, BS 6001-1, BS 9000-3, and BS 6001, respectively.This publication does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for its correct application.Compliance with a British Standard cannot confer immunity from legal obligati
5、ons.BS IEC 60747-10:1991This British Standard, having been prepared under the direction of the Electronic Components Standards Policy Committee, was published under the authority of the Standards Board and comes into effect on30 September 1991 BSI 2011The following BSI references relate to the work
6、on this standard: Committee reference ECL/24 Draft for comment 86/24762 DCAmendments/corrigenda issued since publicationAmd. No. Date Comments 9348 February 1997Indicated by a sideline in the margin31 July 2011 This corrigendum renumbers BS QC 700000:1991; IEC 747-10:1991 as BS IEC 60747-10:1991ISBN
7、 978 0 580 74820 2iContentsPage1 Scope 12 General 12.1 Order of precedence 12.2 Related documents 12.3 Units, symbols and terminology 22.4 Preferred values of voltages, currents and temperatures 22.5 Marking 22.5.1 Terminal identification 32.5.2 Type designation 32.5.3 Manufacturers name or trade ma
8、rk 32.5.4 Inspection lot identification code 32.6 Categories of assessed quality 32.7 Screening 32.8 Handling 43 Quality assessment procedures 43.1 Eligibility for qualification approval 43.1.1 Primary stage of manufacture 43.2 Commercially confidential information 43.3 Formation of inspection lots
9、43.4 Structurally similar devices 43.5 Granting of qualification approval 43.6 Quality conformance inspection 43.6.1 Division into groups and sub-groups 53.6.2 Inspection requirements 63.6.3 Supplementary procedure for reduced inspection 73.6.4 Sampling requirements for small lots 73.6.5 Certified R
10、ecords of Released Lots (CRRL) 73.6.6 Delivery of devices subjected to destructive ornon-destructive tests 73.6.7 Delayed deliveries 73.6.8 Supplementary procedure for deliveries 73.7 Statistical sampling procedures 83.7.1 AQL (Acceptable quality level) sampling plans 83.7.2 Lot tolerance per cent d
11、efective (LTPD) sampling plans 83.7.3 Correlation between AQL and LTPD sampling plans 83.8 Endurance tests where LTPD is specified 83.9 Endurance tests where the failure rate is specified 83.9.1 General 83.9.2 Selection of samples 83.9.3 Failures 83.9.4 Endurance test time and sample size 83.9.5 Pro
12、cedure to be used if the number of observedfailures exceeds the acceptance number 93.10 Accelerated test procedures 93.10.1 Requirements for eligibility in periodic testing 93.10.2 Procedure for thermally-accelerated electricalendurance testing 10BS IEC 60747-10:1991IEC 60747-10:1991 (E) BSI 2011iiP
13、age3.10.3 Damp heat (under consideration) 113.10.4 Voltage (under consideration) 113.11 Capability approval 113.11.1 General 113.11.2 Terms and definitions 123.11.3 Procedure for granting capability approval 133.11.4 Capability approval maintenance procedure 133.11.5 Procedure for reduction, extensi
14、on or change ofcapability approval 143.11.6 Procedure in case of deficiency in maintenance ofthe capability approval 143.11.7 Capability manual 143.11.8 Capability test programme 163.11.9 Verification of capability approval (quality audit) 173.11.10 Quality assurance of products delivered undercapab
15、ility approval 183.11.11 Marking and ordering information 183.11.12 Capability abstract for publication purposes 183.11.13 Detail specifications for custom components 193.11.14 Detail specifications for catalogue products 193.11.15 Detail specification register 194 Test and measurement procedures 19
16、4.1 Standard atmospheric conditions for electricaland optical measurements 194.2 Definition of a destructive list 194.3 Physical examination 204.3.1 Visual examination 204.3.2 Dimensions 204.3.3 Permanence of marking 204.4 Electrical and optical measurements 204.4.1 General conditions and precaution
17、s 204.5 Environmental tests 20Appendix A Lot tolerance per cent defective (LTPD)sampling plans 21Appendix B Dimensions to be checked 24Appendix C Directions for applied forces for mechanical tests 25Appendix D (informative) Assessment of quality levels inppm (parts per million) 27Figure C.1 Orientat
18、ion of a device to direction ofapplied force 25Figure C.2 Orientation of a flat package with radialleads from one side only to direction of applied force 26Figure C.3 Orientation of a cylindrical device to directionof applied force 26Figure C.4 Orientation of a dual-in-line device to directionof app
19、lied force 26Figure C.5 Orientation of a flat package device to directionof applied force 27Figure C.6 Orientation of a cylindrical device to directionof applied force 27BS IEC 60747-10:1991IEC 60747-10:1991 (E) BSI 2011iiiPageTable A-I LTPD sampling plans 22Table A-II Hypergeometric sampling plans
20、for smalllot sizes of200 or less 23Table A-III AQL and LTPD sampling plans 24Publication(s) referred to Inside back coverBS IEC 60747-10:1991IEC 60747-10:1991 (E) BSI 2011vi blank11 ScopeThis publication forms part of the IEC Quality Assessment System for Electronic Components (IECQ).This publicatio
21、n is a generic specification for semiconductor devices: discrete devices and integrated circuits, including multichip integrated circuits, but excluding hybrid circuits.It defines general procedures for quality assessment to be used in the IECQ System and gives general rules for: measurement methods
22、 of electrical characteristics; climatic and mechanical tests; endurance tests.NOTEThis publication must be supplemented by the approved sectional, family and blank detail specifications, where they exist, appropriate to the specific individual type or types.2 General2.1 Order of precedenceWhere the
23、re are conflicting requirements, documents shall rank in the following order of authority:1) the detail specification;2) the blank detail specification;3) the family specification, if any;4) the sectional specification;5) the generic specification;6) the basic specification;7) the IECQ Rules of Proc
24、edure;8) any other international (e.g.IEC) document to which reference is made;9) a national document.The same order of precedence shall apply to equivalent national documents.2.2 Related documentsThe detail specification shall indicate the applicable documents.IEC publications:Publication27: Letter
25、 symbols to be used in electrical technology.Publication50: International electrotechnical vocabulary (IEV).Publication68: Basic environmental testing.Publication68-1(1988): Part1: General and guidance.Publication68-2: Part2: TestsPublication191: Mechanical standardization of semiconductor devices.P
26、ublication191-1(1966) andsupplements:Part1: Preparation of drawings of semiconductor devices.Publication191-2(1966) andsupplements:Part2: Dimensions.Publication191-3(1974) andsupplements:Part3: General rules for the preparation of outline drawings of integrated circuits.Publication410(1973): Samplin
27、g plans and procedures for inspection by attributes.Publication617: Graphical symbols for diagrams.Publication747: Semiconductor devices. Discrete devices and integrated circuits.BS IEC 60747-10:1991IEC 60747-10:1991 (E) BSI 201122.3 Units, symbols and terminologyUnits, graphical symbols, letter sym
28、bols and terminology shall, wherever possible, be taken from the following publications: ISO Standard1000; IEC Publication27; IEC Publication50; IEC Publication617.Any other units, symbols or terminology peculiar to one of the semiconductor devices covered by this generic specification shall be take
29、n from the relevant IEC or ISO documents (see subclause2.2) or derived in accordance with the principles of the documents listed above.2.4 Preferred values of voltages, currents and temperaturesPreferred values of voltages, currents and temperatures for the measurement of characteristics, for tests
30、and for operating conditions, are given in IEC Publications747-1 and748-1.2.5 Markinga) On the deviceWhere space permits, the following information shall be marked on the device: 1) Index point for terminal identification (see subclause2.5.1).2) Type designation (see subclause2.5.2), categories of a
31、ssessed quality (see subclause2.6) and, where appropriate, screening sequence (see subclause2.7).3) Manufacturers name, initial or trade mark and, where appropriate, factory identification code (seesubclause2.5.3).4) Inspection lot identification code (see subclause2.5.4).Publication747-1(1983): Par
32、t1: General.Publication747-5(1984): Part5: Optoelectronic devices.Publication747-11(1985): Part11: Sectional specification for discrete devices.Publication748: Semiconductor devices. Integrated circuits.Publication748-1(1984): Part1: General.Publication748-2(1985): Part2: Digital integrated circuits
33、.Publication748-3(1986): Part3: Analogue integrated circuits.Publication748-11(1990): Part11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits.Publication749: Semiconductor devices. Mechanical and climatic test methods.Publication QC001002(1986): Rules of proce
34、dure of the IEC quality assessment system for electronic components (IECQ).ISO Publications:ISO Standard1000(1981): SI units and recommendations for the use of their multiples and of certain other units.ISO Standard8601(1988): Data elements and interchange formats Information interchange Representat
35、ion of dates and times.ISO Standard2859(1989): Sampling procedures for inspection by attributes.BS IEC 60747-10:1991IEC 60747-10:1991 (E) BSI 201135) Mark of conformity, unless a certificate of conformity is used.6) Reference to special handling precautions, where appropriate.Where space does not pe
36、rmit full marking, the detail specification shall give the minimum requirement in the above order of precedence.b) On the primary packagingThe following information shall appear on the primary packaging used as initial protection or wrapping for delivery: 1) all the information listed in Itema) of s
37、ubclause2.5, except the terminal marking;2) the detail specification reference;3) any special handling precautions, for example caution labels.2.5.1 Terminal identification (reference: IEC Publication747-1, chapterVI, clause8)The terminals shall be identified in the detail specification by reference
38、 to the specified outline or base drawing.2.5.2 Type designationWhen the type designation is marked on the component, it shall be given preferably in letters and figures, or with a colour code when specified in the detail specification. Colour codes may be given in the sectional specification.2.5.3
39、Manufacturers name or trade markIf the manufacturers name or trade mark does not enable traceability to the manufacturing factory, a factory identification code shall also be used.2.5.4 Inspection lot identification codeThis is given in ISO Standard8601 for the week, preceded by the last two digits
40、of the year (example:9145=45th week of1991). When marking-space on the device is restricted, the first digit of the year may be omitted (example:145=45th week of1991) when specified in the detail specification. It is the date that the lot was submitted for inspection. When more than one lot of a typ
41、e is submitted for inspection within the same week, an inspection lot identification suffix, such as a letter, shall be used to identify each successive lot.2.6 Categories of assessed qualityThis specification provides for three categories of assessed quality. The devices are grouped in an identifie
42、d and date-coded inspection lot, which is tested to the specified quality categories. The AQLs or LTPDs associated with the same inspection group may vary for each category and shall be as specified in the detail specification.The minimum requirements of the categories are as follows: The sectional
43、specifications shall define the minimum requirements for each category. A detail specification may contain additional requirements, including screening, to those given in the generic, sectional or blank detail specification.2.7 ScreeningA screening is an examination or test applied to all devices in
44、 a lot.Category I In which the type meets the requirements of qualification approval to categoriesII orIII. Each lot meets the inspection requirements of Group A which includes functional tests. Every three months, one lot meets the inspection requirements for solderability. Annually, one lot meets
45、Group B and Group C inspection requirements.Category II In which the lot meets the inspection requirements of Group A and Group B on alot-by-lot basis and of Group C on a periodic basis.Category III In which the lot is100% screened and meets the inspection requirements of Group A and Group B on a lo
46、t-by-lot basis and of Group C on a periodic basis.BS IEC 60747-10:1991IEC 60747-10:1991 (E) BSI 20114When required by the detail specification, all devices in the lot shall be screened by submitting them to one of the sequences given in the relevant table of the sectional specification and all defec
47、tives removed. Other sequences not specified herein are applicable only in case the above sequences are not correlated or in contradiction with recognized failure mechanisms. When a part of the screening process as given in the relevant table of the sectional specification forms part of the manufact
48、uring process in the prescribed sequence, these procedures need not be repeated. For the purpose of this specification, burn-in is defined as thermal and electrical stress applied to all devices in a lot for a specified period of time for the purpose of detecting and removing potential early failure
49、s.2.8 HandlingSee IEC Publication747-1, chapterIX.Adequate warning shall be displayed in the case of harmful products (e.g.BeO).3 Quality assessment proceduresQuality assessment comprises the procedure for obtaining qualification approval as defined in subclause3.5, followed by quality conformance inspection on a lot-by-lot basis (including screening if required) and on a periodic basis as qualified in the detail specification.The quality assessment tests are subdivided into Group A, B and C tests; these are performed lot by lot or periodically (a
