BS IEC 61523-3-2004 Delay and power calculation standards - Standard delay formaty (SDF) for the electronic design process《延迟和功率计算标准 电子设计过程用标准延迟格式(SDF)》.pdf

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1、BRITISH STANDARD BS IEC 61523-3:2004 Delay and power calculation standards Part 3: Standard Delay Format (SDF) for the electronic design process ICS 35.240.50 BS IEC 61523-3:2004 This British Standard was published under the authority of the Standards Policy and Strategy Committee on 15 December 200

2、4 BSI 15 December 2004 ISBN 0 580 44887 8 National foreword This British Standard reproduces verbatim IEC 61523-3:2004 and implements it as the UK national standard. The UK participation in its preparation was entrusted to Technical Committee GEL/93, Design automation, which has the responsibility t

3、o: A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards C

4、orrespondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard does

5、not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European develop

6、ments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the IEC title page, pages 2 to 90, an inside back cover and a back cover. The BSI copyright notice displayed in this document indicates when the document was last issued. Amendments is

7、sued since publication Amd. No. Date CommentsINTERNATIONAL STANDARD IEC 61523-3 First edition 2004-09 IEEE 1497 Delay and power calculation standards Part 3: Standard Delay Format (SDF) for the electronic design process Reference number IEC 61523-3(E):2004 IEEE Std. 1497(E):2001 BSIEC615233:2004 CON

8、TENTS FOREWORD. 3 IEEE Introduction. 71. Overview. 8 1.1 Scope. 8 1.2 Organization of this standard 8 2. References. 9 3. Conventions 9 3.1 Terminology conventions 9 3.2 Syntactic conventions 9 4. SDF in the design process. 12 4.1 Sharing of timing data. 12 4.2 Using multiple SDF files in one design

9、. 12 4.3 Timing data and constraints 13 4.4 Timing environments 13 4.5 Back-annotation of timing data for design analysis 13 4.6 Forward-annotation of timing constraints for design synthesis. 15 4.7 Timing models supported by SDF. 16 5. Defining the standard delay format. 18 5.1 SDF file content 18

10、5.2 Header section. 20 5.3 Cells 25 5.4 Delays 28 5.5 Timing checks. 46 5.6 Labels 60 5.7 Timing environment 62 Annex A (normative) Syntax of SDF . 74 Annex B (informative) SDF file examples . 84 Annex C (informative) List of Participants. 89 Pusilbdeh yb IEC uecil rednecn from 4002 .EEEI .EEEI lAr

11、listhg erdevres. BSIEC615233:20042INTERNATIONAL ELECTROTECHNICAL COMMISSION _ DELAY AND POWER CALCULATION STANDARDS Part 3: Standard Delay Format (SDF) for the electronic design process FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization co

12、mprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International St

13、andards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this pr

14、eparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two orga

15、nizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form

16、 of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretat

17、ion by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or reg

18、ional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) Attention is drawn to the possibility that some of the elements of t

19、his IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC/IEEE 61523-3 has been processed through IEC technical committee 93: Design automation. The text of this standard is based on the follow

20、ing documents: IEEE Std FDIS Report on voting 1497 (2001) 93/191/FDIS 93/196/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives. The commit

21、tee has decided that the contents of this publication will remain unchanged until 2006. IEC 61523 consists of the following parts, under the general title Delay and power calculation standards: IEC 61523-1, Part 1: Integrated circuit delay and power calculation systems Psilbudeh yb IEC uecil rednecn

22、 from 4002 .EEEI .EEEI lAir lsthg erdevres. BSIEC615233:20043IEC 61523-2, Part 2: Pre-layout delay calculation specification of CMOS ASIC libraries IEC/IEEE 61523-3, Part 3: Standard Delay Format (SDF) for the electronic process Psilbudeh yb IEC uecil rednecn from 4002 .EEEI .EEEI lAir lsthg erdevre

23、s. BSIEC615233:20044IEC/IEEE Dual Logo International Standards This Dual Logo International Standard is the result of an agreement between the IEC and the Institute of Electrical and Electronics Engineers, Inc. (IEEE). The original IEEE Standard was submitted to the IEC for consideration under the a

24、greement, and the resulting IEC/IEEE Dual Logo International Standard has been published in accordance with the ISO/IEC Directives. IEEE Standards documents are developed within the IEEE Societies and the Standards Coordinating Committees of the IEEE Standards Association (IEEE-SA) Standards Board.

25、The IEEE develops its standards through a consensus development process, approved by the American National Standards Institute, which brings together volunteers representing varied viewpoints and interests to achieve the final product. Volunteers are not necessarily members of the Institute and serv

26、e without compensation. While the IEEE administers the process and establishes rules to promote fairness in the consensus development process, the IEEE does not independently evaluate, test, or verify the accuracy of any of the information contained in its standards. Use of an IEC/IEEE Dual Logo Int

27、ernational Standard is wholly voluntary. The IEC and IEEE disclaim liability for any personal injury, property or other damage, of any nature whatsoever, whether special, indirect, consequential, or compensatory, directly or indirectly resulting from the publication, use of, or reliance upon this, o

28、r any other IEC or IEEE Standard document. The IEC and IEEE do not warrant or represent the accuracy or content of the material contained herein, and expressly disclaim any express or implied warranty, including any implied warranty of merchantability or fitness for a specific purpose, or that the u

29、se of the material contained herein is free from patent infringement. IEC/IEEE Dual Logo International Standards documents are supplied “AS IS”. The existence of an IEC/IEEE Dual Logo International Standard does not imply that there are no other ways to produce, test, measure, purchase, market, or p

30、rovide other goods and services related to the scope of the IEC/IEEE Dual Logo International Standard. Furthermore, the viewpoint expressed at the time a standard is approved and issued is subject to change brought about through developments in the state of the art and comments received from users o

31、f the standard. Every IEEE Standard is subjected to review at least every five years for revision or reaffirmation. When a document is more than five years old and has not been reaffirmed, it is reasonable to conclude that its contents, although still of some value, do not wholly reflect the present

32、 state of the art. Users are cautioned to check to determine that they have the latest edition of any IEEE Standard. In publishing and making this document available, the IEC and IEEE are not suggesting or rendering professional or other services for, or on behalf of, any person or entity. Neither t

33、he IEC nor IEEE is undertaking to perform any duty owed by any other person or entity to another. Any person utilizing this, and any other IEC/IEEE Dual Logo International Standards or IEEE Standards document, should rely upon the advice of a competent professional in determining the exercise of rea

34、sonable care in any given circumstances. Interpretations Occasionally questions may arise regarding the meaning of portions of standards as they relate to specific applications. When the need for interpretations is brought to the attention of IEEE, the Institute will initiate action to prepare appro

35、priate responses. Since IEEE Standards represent a consensus of concerned interests, it is important to ensure that any interpretation has also received the concurrence of a balance of interests. For this reason, IEEE and the members of its societies and Standards Coordinating Committees are not abl

36、e to provide an instant response to interpretation requests except in those cases where the matter has previously received formal consideration. Comments for revision of IEC/IEEE Dual Logo International Standards are welcome from any interested party, regardless of membership affiliation with the IE

37、C or IEEE. Suggestions for changes in documents should be in the form of a proposed change of text, together with appropriate supporting comments. Comments on standards and requests for interpretations should be addressed to: Secretary, IEEE-SA Standards Board, 445 Hoes Lane, P.O. Box 1331, Piscataw

38、ay, NJ 08855-1331, USA and/or General Secretary, IEC, 3, rue de Varemb, PO Box 131, 1211 Geneva 20, Switzerland. Authorization to photocopy portions of any individual standard for internal or personal use is granted by the Institute of Electrical and Electronics Engineers, Inc., provided that the ap

39、propriate fee is paid to Copyright Clearance Center. To arrange for payment of licensing fee, please contact Copyright Clearance Center, Customer Service, 222 Rosewood Drive, Danvers, MA 01923 USA; +1 978 750 8400. Permission to photocopy portions of any individual standard for educational classroom

40、 use can also be obtained through the Copyright Clearance Center. NOTE Attention is called to the possibility that implementation of this standard may require use of subject matter covered by patent rights. By publication of this standard, no position is taken with respect to the existence or validi

41、ty of any patent rights in connection therewith. The IEEE shall not be responsible for identifying patents for which a license may be required by an IEEE standard or for conducting inquiries into the legal validity or scope of those patents that are brought to its attention. Psilbudeh yb IEC uecil r

42、ednecn from 4002 .EEEI .EEEI lAir lsthg erdevres. BSIEC615233:20045 IEEE Standard for Standard Delay Format (SDF) for the Electronic Design ProcessSponsorDesign Automation Standards Committee of the IEEE Computer SocietyApproved 5 December 2001IEEE-SA Standards BoardAbstract:The Standard Delay Forma

43、t (SDF) is defined in this standard. SDF is a textual file format for representing the delay and timing information of electronic systems. While both human and machine readable, in its most common usage it will be machine written and machine read in support of timing analysis and verification tools,

44、 and of other tools requiring delay and timing information. The primary audience for this standard is the implementors of tools supporting the format, but anyone with a need to understand the formats contents will find it useful.Keywords:computer, computer languages, delay, delay backannotation, dig

45、ital systems, electron- ic systems, hardware, hardware design, SDF, timing, timing analysis, timing backannotation, timing verification Psilbudeh yb IEC uecil rednecn from 4002 .EEEI .EEEI lAir lsthg erdevres. BSIEC615233:20046 poCry.EEEI 1002 thgi r llAreser sthgiv.deiiiThe Standard Delay Format (S

46、DF) was designed to serve as a simple textual medium for communicating timing information and constraints between EDA tools. The original version was designed by Rajit C. Chan- dra in 1990 while at Cadence Design Systems, and was intended as a means of communicating macrocell and interconnect delays

47、 from Gate Ensemble to Verilog-XL, Veritime and other stand-alone tools requiring timing data. Because it was originally targeted for annotation to tools using the Verilog language, many SDF constructs are analogous to those in Verilog specify blocks. Those already familiar with the Verilog specify

48、block will nd many of the SDF constructs familiar, such as SETUP and PATHPULSE. SDF also includes constructs for annotating interconnect delays, and can be used for forward annotation by specifying path delay con- straints from timing analysis to oorplanners, and synthesis and layout tools. SDF was

49、rst introduced into the EDA marketplace in 1991 where it won quick acceptance. Cadence placed SDF in the public domain in 1992 when it turned control over to Open Verilog International (OVI), and OVI delivered the rst SDF standard, version 2.0, in June, 1993 (SDF version 1.0 was used by Cadence). OVI has since introduced version 2.1 in February, 1994, and version 3.0 in May, 1995. VHDL (IEEE 1076) also takes advantage of SDF through the VITAL standard.

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