1、BRITISH STANDARD BS QC 760000:1990 IEC 748-20: 1988 Incorporating Amendment No. 1 Harmonized system of quality assessment for electronic components Film and hybrid film integrated circuits Generic specification ICS 31.200BSQC760000:1990 This British Standard, having been prepared under the direction
2、of the Electronic Components Standards Policy Committee, was published underthe authority of the BoardofBSI and comes into effecton 30April1990 BSI 02-2000 The following BSI references relate to the work on this standard: Committee reference ECL/24 Draft for comment 85/22458 DC ISBN 0 580 17437 9 Co
3、mmittees responsible for this British Standard The preparation of this British Standard was entrusted by the Electronic Components Standards Policy Committee (ECL/-) to Technical Committee ECL/24, upon which the following bodies were represented: British Broadcasting Corporation British Telecom Busi
4、ness Equipment and Information Technology Association Electronic Components Industry Federation Electronic Engineering Association GAMBICA (BEAMA Ltd.) Ministry of Defence National Supervising Inspectorate Telecommunication Engineering and Manufacturing Association The following bodies were also rep
5、resented in the drafting of the standard through subcommittees and panels: Royal Signals and Radar Establishment Society of British Aerospace Companies Ltd. Amendments issued since publication Amd. No. Date of issue Comments 6754 September 1991 Correction to BS QC number only 9331 January 1997 Indic
6、ated by a sideline in the marginBSQC760000:1990 BSI 02-2000 i Contents Page Committees responsible Inside front cover National foreword ii Section 1. Scope, object and classification 1.1 Scope 1 1.2 Object 1 1.3 Technological classification of F and HFICs 1 Section 2. General 2.1 Order of precedence
7、 1 2.2 Related documents 2 2.3 Units and symbols 3 2.4 Terminology 3 2.5 Standard and preferred values 6 2.6 Marking 6 Section 3. Quality assessment procedures 3.1 Primary stage of manufacture 7 3.2 Manufacturing stages and sub-contracting 7 3.3 Manufacturer approval 7 3.4 Approval of film integrate
8、d circuits and hybrid film integrated circuits 7 3.5 Qualification approval 8 3.6 Capability approval 9 3.7 Certified records of released lots 12 3.8 Delayed deliveries 12 3.9 Delivery of F and HFICs subjected to destructive or non-destructive tests 12 3.10 Supplementary procedure for deliveries 12
9、3.11 Supplementary information 12 Section 4. Test and measurement procedures 4.1 General 13 4.2 Standard conditions for testing 13 4.3 Visual examination 15 4.4 Electrical measurement procedures 15 4.5 Environmental testing procedures 17 Figure 1 14 Table I 1 Publications referred to Inside back cov
10、erBSQC760000:1990 ii BSI 02-2000 National foreword This British Standard has been prepared under the direction of the Electronic Components Standards Policy Committee and is identical with IEC Publication748-20:1988(QC 760000) “Semiconductor devices. Integrated circuits. Part20: Generic specificatio
11、n for film integrated circuits and hybrid film integrated circuits” including amendment1:1995, published by the International Electrotechnical Commission (IEC). This British Standard is a harmonized specification within the IECQ system of quality assessment for electronic components. Cross-reference
12、s. The British Standard harmonized withQC 001001and QC001002isBS9000 “General requirements for a system for electronic components of assessed quality” Part1:1981 “Specification of basic rules and procedures”. International Standard Corresponding British Standard IEC 27 No corresponding standard BS 2
13、011 Basic environmental testing procedures IEC 68-2-1:1974 Part 2.1A:1977 Tests A. Cold (Identical) IEC 68-2-2:1974 Part 2.1B:1977 Tests B. Dry Heat (Identical) IEC 68-2-3:1969 Part 2.1Ca:1977 Test Ca. Damp heat, steady state (Identical) IEC 68-2-6:1982 Part 2.1Fc:1983 Test Fc. Vibration (sinusoidal
14、) (Identical) IEC 68-2-7:1983 Part 2.1Ga:1984 Test Ga. Acceleration, steady state (Identical) IEC 68-2-11:1981 Part 2.1Ka:1982 Test Ka. Salt mist (Identical) IEC 68-2-14:1984 Part 2.1N:1985 Test N. Change of temperature (Identical) IEC 68-2-17:1978 Part 2.1Q:1981 Test Q. Sealing (Identical) IEC 68-2
15、-20:1979 Part 2.1T:1981 Test T. Soldering (Identical) IEC 68-2-21:1983 Part 2.1U:1984 Test U. Robustness of terminations and integral mounting devices (Identical) IEC 68-2-27:1972 Part 2.1Ea:1977 Test Ea. Shock (Identical) IEC 68-2-30:1980 Part 2.1Db:1981 Test Db and guidance: Damp heat, cyclic (12
16、+ 12 hour cycle) (Identical) IEC 68-2-45:1980 Part 2.1XA:1981 Test XA and guidance. Immersion in cleaning solvents (Identical) IEC 68-3-1:1974 Part 3A the sectional specification; the generic specification; rules of procedure (IECQ), IEC Publication QC 001002; basic rules (IECQ), IEC Publication QC
17、001001; any other international documents, for example IEC publications to which reference is made. The same order of precedence shall apply to equivalent national documents. Film 1) Thick film 2) Thin film 3) Other Circuit structure 1) Passive thin and thick film circuits 2) Active thin and thick f
18、ilm circuits 3) Hybrid film integrated circuits 4) Multiple substrate combinations Added components 0) None 1) All types of passive and/or encapsulated active devices 2) All types of passive and active devices including unencapsulated semiconductor dice Circuit encapsulation 1) None 2) Embedded 3) C
19、avity with any organic seal or wall 4) Cavity with inorganic seal and wallsBSQC760000:1990 2 BSI 02-2000 2.2 Related documents The detail specification shall indicate the applicable documents. IEC publications: Publication 27-1:1971: Letter symbols to be used in electrical technology, Part1:General.
20、 50: International Electrotechnical Vocabulary (IEV). 68: Basic environmental testing procedures. 68-1:1982: Part 1: General and guidance. 68-2: Part 2: Tests. 68-2-1:1974: 68-2-1A:1976: Tests A: Cold. First supplement to Publication 68-2-1:1974. 68-2-2:1974: 68-2-2A:1976: Tests B: Dry heat. first s
21、upplement to Publication 68-2-2:1974. 68-2-3:1969: Test Ca: Damp heat, steady state. 68-2-6:1982: Test Fc and guidance: Vibration (sinusoidal). 68-2-7:1983: Test Ga and guidance: Acceleration, steady state. 68-2-11:1981: Test Ka: Salt mist. 68-2-14:1984: Test N: Change of temperature. 68-2-17:1978:
22、Test Q: Sealing. 68-2-20:1979: Test T: Soldering. 68-2-21:1983: Test U: Robustness of terminations and integral mounting devices. 68-2-27:1972: Test Ea: Shock. 68-2-30:1980: Test Db and guidance: Damp heat, cyclic (12 + 12-hour cycle). 68-2-45:1980: Test XA and guidance: Immersion in cleaning solven
23、ts. 68-3-1:1974: Part 3: Background information, Section 1 cold and dry heat tests. 191-1:1966: Mechanical standardization of semiconductor devices. Part1:Preparation of drawings of semiconductor devices. 191-2:1966: Part 2: Dimensions. 191-3:1974: Part 3: General rules for the preparation of outlin
24、e drawings of integrated circuits. 410:1973: Sampling plans and procedures for inspection by attributes. 695-2-2:1980: Fire hazard testing, Part 2: Test methods. Needle-flame test. 747-1:1983: Semiconductor devices. Discrete devices and integrated circuits, Part1:General. 748-1:1984: Semiconductor d
25、evices. Integrated circuits, Part 1: General. 749:1984: Mechanical and climatic test methods. QC 001001:1986: Basic rules for the IEC quality assessment system for electronic components (IECQ). QC 001002:1986: Rules of procedure of the IEC quality assessment system for electronic components (IECQ).B
26、SQC760000:1990 BSI 02-2000 3 2.3 Units and symbols Units, graphical symbols and letter symbols shall, whenever possible, be taken from the following publications: Any other units and symbols required shall be derived in accordance with the principles of the publications listed above. 2.4 Terminology
27、 (for information) Terminology shall, wherever possible, be taken from: IEC Publication 50: International Electrotechnical Vocabulary (IEV). Any other terminology required should be derived in accordance with the principles of this publication. 2.4.1 microelectronics (IEC 748-1) the concept of the c
28、onstruction and use of highly miniaturized electronic circuits 2.4.2 microcircuit (IEC 748-1) a microelectronic device, having a high equivalent circuit-element and/or component density, which is considered as a single unit NOTEA microcircuit may be a micro-assembly or an integrated (micro) circuit.
29、 2.4.3 integrated circuit (IEC 748-1 modified) a circuit in which a number of circuit elements are inseparably associated and electrically interconnected such that, for the purpose of specification, testing, commerce and maintenance, it is considered indivisible NOTEFor this definition, a circuit el
30、ement does not have an envelope or external connection and is not specified or sold as a separate item. 2.4.4 integrated microcircuit (IEC 748-1 modified) a microcircuit in which a number of circuit elements are inseparably associated and electrically interconnected such that, for the purpose of spe
31、cification and testing and commerce and maintenance, it is considered indivisible NOTE 1For this definition, a circuit element does not have an envelope or external connection and is not specified or sold as a separate item. NOTE 2Where no misunderstanding is possible, the term “integrated microcirc
32、uit” may be abbreviated to “integrated circuit”. NOTE 3Further qualifying terms may be used to describe the technique used in the manufacture of a specific integrated microcircuit. Examples of use of qualifying terms: semiconductor monolithic integrated circuit; semiconductor multi-chip integrated c
33、ircuit: thin film integrated circuit; thick film integrated circuit; hybrid integrated circuit. 2.4.5 micro-assembly (IEC 748-1 modified) a microcircuit consisting of various components and/or integrated micro-circuits which are constructed separately and which can be tested before being assembled a
34、nd packaged NOTE 1For this definition, a component has external connections and possibly an envelope as well and it can also be specified and sold as a separate item. NOTE 2Further qualifying terms may be used to describe the form of the components and/or the assembly techniques used in the construc
35、tion of a specific micro-assembly. Examples of use of qualifying terms: IEC Publication 27: Letter symbols to be used in electrical technology. IEC Publication 617: Graphical symbols for diagrams. ISO Standard 1000:1981: SI units and recommendations for the use of their multiples and of certain othe
36、r units.BSQC760000:1990 4 BSI 02-2000 semiconductor multi-chip micro-assembly; discrete component micro-assembly. 2.4.6 semiconductor integrated circuit (IEV 521-10-06 modified) an integrated circuit whose elements and interconnections are formed within and upon a semiconductor 2.4.7 multichip micro
37、circuit a microcircuit containing chip components for surface mounting which are separately mounted upon a substrate 2.4.8 film a layer of solid formed by any deposition process in-situ upon a solid substrate 2.4.9 foil a solid film which can be handled independent of a substrate 2.4.10 thin film a
38、film deposited upon a substrate by an accretion process such as vacuum evaporation, sputtering and chemical vapour deposition 2.4.11 thick film a film deposited upon a substrate, usually by a screen printing process 2.4.12 film integrated circuit an integrated circuit whose elements and interconnect
39、ions are films formed on an insulating substrate surface. The film elements may be active or passive 2.4.13 hybrid integrated circuit an integrated circuit formed by any combination of semiconductor and film integrated circuits or by the combination of any of these circuits with discrete elements 2.
40、4.14 hybrid film integrated circuit a film integrated circuit on which at least one component, encapsulated or unencapsulated, has been mounted 2.4.15 passive hybrid film integrated circuit a hybrid film integrated circuit in which all the elements are passive 2.4.16 active hybrid film integrated ci
41、rcuit a hybrid film integrated circuit in which at least one element is active 2.4.17 semiconductor chip hybrid film integrated circuit a hybrid film integrated circuit containing one or more unencapsulated semiconductor devices 2.4.18 substrate a piece of material forming a supporting base for film circuit elements and/or added components
