1、BRITISH STANDARD BS QC 790131:1992 Specification for Harmonized system of quality assessment for electronic components Semiconductor devices Integrated circuits Blank detail specification Complementary MOS digital integrated circuits (series 4000 B and 4000 UB)BS QC790131:1992 BSI 11-1999 ISBN 0 580
2、 35649 3 Amendments issued since publication Amd. No. Date CommentsBS QC790131:1992 BSI 11-1999 i Contents Page National foreword ii Introduction 1 1 Marking and ordering information 3 2 Application related description 3 3 Specification of the function 3 4 Limiting values 3 5 Operating conditions 4
3、6 Electrical characteristics 4 7 Programming 6 8 Mechanical and environmental ratings, characteristics and data 6 9 Additional information 6 10 Screening 6 11 Quality assessment procedures 6 12 Structural similarity procedures 6 13 Test conditions and inspection requirements 7 14 Additional measurem
4、ent method 10 Table I 7 Table II 8 Table III 9 Table IV 10BS QC790131:1992 ii BSI 11-1999 National foreword This British Standard has been prepared under the direction of the Electronic Components Standards Policy Committee, ECL/-. It is identical with IEC Publication748-2-5 (QC790131) “Semiconducto
5、r devices. Integrated circuits. Part2: Digital integrated circuits. Section5: Blank detail specification for complementary MOS digital integrated circuits (series4000B and4000UB)” published by the International Electrotechnical Commission (IEC) and is a harmonized specification within the IECQ syste
6、m of quality assessment for electronic components. This blank detail specification is one of a series of blank detail specifications for semiconductor devices to be used with BSQC700000:1991 “Harmonized system of quality assessment for electronic components. Generic specification for discrete device
7、s and integrated circuits”. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Cross-referen
8、ces International Standard a Corresponding British Standard IEC 68-2-17 BS 2011 Environmental testing Part 2.1 Q:1981 Test Q. Sealing (Identical) IEC 617-12 BS 3939 Guide for graphical symbols for electrical power, telecommunications and electronics diagrams Part 12:1985 Binary logic elements (Ident
9、ical) IEC 747-10 BS QC 700000:1991 Harmonized system of quality assessment for electronic components. Generic specification for discrete devices and integrated circuits (Identical) IEC 748-2-4 BS QC 790104:1992 Harmonized system of quality assessment for electronic components. Semiconductor devices.
10、 Integrated circuits. Family Specification for complementary MOS digital integrated circuits, series4000 B and 4000 UB (Identical) IEC 748-11 BS QC 790100:1991 Harmonized system of quality assessment for electronic components. Semiconductor devices. Sectional specification for semiconductor integrat
11、ed circuits excluding hybrid circuits (Identical) IEC 749 BS 6493 Semiconductor devices Part 3:1985 Mechanical and climatic test methods (Identical) QC 001002 BS QC 001002:1991 Rules of Procedure of the IEC Quality Assessment System for Electronic Components (IECQ) (Identical) a Undated in the text.
12、 Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, pages 1 to 10 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover.BS QC7
13、90131:1992 BSI 11-1999 1 Introduction The IEC Quality Assessment System for Electronic Components is operated in accordance with the statutes of the IEC and under the authority of the IEC. The object of this system is to define quality assessment procedures in such a manner that electronic component
14、s released by one participating country as conforming with the requirements of an applicable specification are equally acceptable in all other participating countries without the need for further testing. This blank detail specification is one of a series of blank detail specifications for semicondu
15、ctor devices and shall be used with the following IEC publication: 747-10/QC700000, Semiconductor devices Part 10: Generic specification for discrete devices and integrated circuits. Required information Numbers shown in brackets on this and the following pages correspond to the following items of r
16、equired information, which should be entered in the spaces provided. Identification of the detail specification 1 The name of the National Standards Organization under whose authority the detail specification is issued. 2 The IECQ number of the detail specification. 3 The numbers and issue numbers o
17、f the generic, sectional and family specifications. 4 The national number of the detail specification, date of issue and any further information, if required by the national system. Identification of the component 5 Main function and type number. 6 Information on typical construction (materials, mai
18、n technology) and package. If the device has several kinds of derivative products, those differences shall be indicated, e.g.features of characteristics in the comparison table. If the device is electrostatic sensitive, a caution statement shall be added in the detail specification. 7 Outline drawin
19、g, terminal identification, marking and/or reference to the relevant document for outlines. 8 Category of assessed quality according to subclause 2.6 of the generic specification. 9 Reference data. The clauses given in square brackets on the next pages of this standard, which form the front page of
20、the detail specification, are intended for guidance to the specification writer and shall not be included in the detail specification. When confusion may arise as to whether a paragraph is only instruction to the writer or not, the paragraph shall be indicated between brackets.BS QC790131:1992 2 BSI
21、 11-1999 Name (address) of responsible NAI (and possibly of body from which specification is available). 1 Number of IECQ detail specification, plus issue number and/or date. 2 QC 790131-. ELECTRONIC COMPONENT OF ASSESSED QUALITY IN ACCORDANCE WITH: 3 National number of detail specification. 4 Gener
22、ic specification: Publication 747-10/QC 700000 This box need not be used if national number repeats IECQ number. Sectional specification: Publication 748-11/QC 790100 Family specification: Publication 748-2-4/QC 790104 and national references if different. BLANK DETAIL SPECIFICATION FOR COMPLEMENTAR
23、Y MOS DIGITAL INTEGRATED CIRCUITS, 4 000 B AND 4 000 UB SERIES 5 Type number(s) of the relevant device(s). Ordering information: see subclause 1.2 of this standard. Mechanical description 7 Short description 6 Outline references: Standard package references should be given, IEC number (mandatory if
24、available) and/or national number. Application: see clause 6 of this standard. Function: see clause 3 of this standard. Typical construction: Si. Encapsulation: cavity or non-cavity. Comparison table of characteristics for variant products. Outline drawing may be transferred to or given with more de
25、tails in clause 8 of this standard. CAUTION: Electrostatic sensitive devices. Terminal identification drawing showing pin assignments, including graphical symbols. Categories of assessed quality from subclause 2.6 of the generic specification. 8 Reference data 9 Marking: letters and figures, or colo
26、ur code. The detail specification shall prescribe the information to be marked on the device, if any. See subclause 2.5 of generic specification and/or subclause 1.1 of this standard. Reference data on the most important properties to permit comparison between types. Plus indication whether the devi
27、ce is a SSI, MSI or LSI. Information about manufacturers who have components qualified to this detail specification is available in the current Qualified Products List.BS QC790131:1992 BSI 11-1999 3 1 Marking and ordering information 1.1 Marking Any particular information other than that given in bo
28、x 7 and/or subclause 2.5 of the generic specification shall be given here. 1.2 Ordering information The following minimum information is necessary to order a specific device, unless otherwise specified: precise type reference (and nominal voltage value, if required); IECQ reference of detail specifi
29、cation with issue number and/or date when relevant; category of assessed quality as defined in subclause 2.6 of the generic specification and in clause9 of the sectional specification and, if required, screening sequence as defined in clause8 of the sectional specification; any other particulars. 2
30、Application related description See information given in box 6. 3 Specification of the function 3.1 Detailed block diagram A detailed block diagram of the device shall be given. The graphical symbol for the function shall be given. This may be obtained from a catalogue of standards of graphical symb
31、ols, or designed according to the rules of IEC Publication617-12. 3.2 Identification and function of terminals All terminals shall be identified on the block diagram (supply terminals, input or output terminals, input/output terminals). The terminal functions shall be indicated in a table as follows
32、: 3.3 Functional description A functional table shall be given here. 4 Limiting values (absolute maximum rating system) These values apply over the operating temperature range, unless otherwise specified. Curves should preferably be given under clause9 of this standard. All voltages are referenced t
33、o V SS . Terminal number Terminal symbol Terminal designation Function Function of terminal Input/output identification Type of output circuit Subclause Parameters Symbol Value Min. Max. 4.1 See family specification to 4.5 4.6 Power dissipation per output and per package P D 4.7 Continuous current i
34、nto any output 4.8 Transient energy rating BS QC790131:1992 4 BSI 11-1999 5 Operating conditions (within the specified operating temperature range) See clause5 of the family specification. Supply voltage range: V DD= + 3 to + 15 V. All voltages are referenced to V SS . 6 Electrical characteristics S
35、ee clause13 of this standard for inspection requirements. Recommended supply voltage range: V DD= 5, 10 and 15 V. (See clause5 of the family specification.) The electrical characteristics apply over the operating temperature range, unless otherwise stated. All voltages are referenced to V SS . 6.1 S
36、tatic characteristics See subclause 5.2.1 of the family specification (except for subclause 5.2.1.9). 6.2 Dynamic characteristics 6.2.1 Times characterizing the response of the circuit (see note 1)BS QC790131:1992 BSI 11-1999 5 Subclause Characteristic V DD (V) Symbol T amb min. + 25 C T amb max. Un
37、it Min. Max. Min. Max. Min. Max. 6.2.1.1 Propagation time (for normal outputs) (see note 2) 5 10 15 t PLH ns ns ns 5 10 15 t PHL ns ns ns 6.2.1.2 Output enable time (for three-state outputs) (see note 3) 5 10 15 t PZL ns ns ns 5 10 15 t PZH ns ns ns 6.2.1.3 Output disable time (for three-state outpu
38、ts) (see note 3) 5 10 15 t PLZ ns ns ns 5 10 15 t PHZ ns ns ns 6.2.1.4 Transition time (for normal outputs) (see note 2) 5 10 15 t TLH ns ns ns 5 10 15 t THL ns ns NOTE 1See detail specification. NOTE 2 NOTE 3 where: V x= V DDfor t PZLand t PLZ ; V x= V SSfor t PHZand t PZH .BS QC790131:1992 6 BSI 1
39、1-1999 6.2.2 Timing requirements 6.3 Timing diagrams Not appropriate. 6.4 Capacitances See subclause 5.2.1.9 of the family specification. 7 Programming Not appropriate. 8 Mechanical and environmental ratings, characteristics and data See subclause 12.2 of the sectional specification. 9 Additional in
40、formation See also family specification. To be given only as far as necessary for the specification and use of the device, for instance: temperature derating curves referred to in the limiting values; complete definition of a circuit for measurement, or of an additional method; detailed outline draw
41、ing. 10 Screening (if required) See clause 8 of the sectional specification. Burn-in conditions: the following information shall be specified: ambient temperature; supply voltage; frequency; circuit diagram and conditions. 11 Quality assessment procedures 11.1 Qualification approval procedures See c
42、lause 3 of the generic specification and subclause 5.1 of the sectional specification. 11.2 Capability approval procedures Under consideration. 12 Structural similarity procedures See clause6 of the sectional specification. Subclause Characteristic V DD (V) Symbol T amb min. + 25 C T amb max. Unit M
43、in. Max. Min. Max. Min. Max. 6.2.2.1 Set-up time (where appropriate) t su ns 6.2.2.2 Hold time (where appropriate) t h nsBS QC790131:1992 BSI 11-1999 7 13 Test conditions and inspection requirements 13.1 General These are given in the following tables, where the values and exact test conditions to b
44、e used shall be specified for a given type, as required by the relevant test in the relevant publication. The choice between alternative tests or test methods shall be made when a detail specification is written. When several devices are included in the same detail specification, the relevant condit
45、ions and/or values should be given on successive lines, where possible avoiding repetition of identical conditions and/or values. 13.2 Sampling requirements See clause9 of the sectional specification. 13.3 Inspection tables Tests shall be made at25 C, unless otherwise specified. Tests marked (D) are
46、 destructive tests. Table I Group A Lot-by-lot Sub-group Examination or test Conditions of test Limits A1 External visual examination 747-10, subcl. 4.2.1.1 A2 Verification of the function at 25 C unless otherwise specified In accordance with clause3 of this specification A2a (Not applicable to cate
47、gory I) Verification of the function at minimum and maximum operating temperatures (see note 4) A3 Static characteristics at 25 C See subclause 6.1 of this specification See subclause 6.1 of this specification A3a Static characteristics at minimum and maximum operating temperatures At T amb= T ambma
48、x. and T ambmin. Same conditions as sub-group A3 above Limits may be different from those in sub-group A3 A4 Dynamic characteristics at 25 C unless otherwise specified See subclause 6.2 of this specification See subclause 6.2 of this specification A4a (Not applicable to category I) Dynamic characteristics at minimum and maximum operating temperatures (see note 4) At T amb= T ambmax. and T ambmin. Same conditions as sub-group A4 above Limits may be different from those in sub-group A4 NOTE 4The manufacturer may use test results at25 C if he can demonstrate, on a periodic basis, the c
