1、Identification cards Test methods Part 6: Proximity cards AMENDMENT 1: Additional PICC classes Amendment 1:2013 (IDT) toNational Standard of CanadaCAN/CSA-ISO/IEC 10373-6:12(ISO/IEC 10373-6:2011, IDT)NOT FOR RESALE. / PUBLICATION NON DESTINE LA REVENTE.Standards Update ServiceAmendment 1:2013 toCAN/
2、CSA-ISO/IEC 10373-6:12January 2013Title: Identification cards Test methods Part 6: Proximity cards AMENDMENT 1: Additional PICC classesPagination: 20 pages (iii preliminary and 17 text)To register for e-mail notification about any updates to this publicationgo to shop.csa.caclick on CSA Update Servi
3、ceThe List ID that you will need to register for updates to this publication is 2422237.If you require assistance, please e-mail techsupportcsagroup.org or call 416-747-2233.Visit CSA Groups policy on privacy at csagroup.org/legal to find out how we protect your personal information.Reference number
4、ISO/IEC 10373-6:2011/Amd.1:2012(E)ISO/IEC 2012INTERNATIONAL STANDARD ISO/IEC10373-6Second edition2011-01-15AMENDMENT 12012-05-01Identification cards Test methods Part 6: Proximity cards AMENDMENT 1: Additional PICC classes Cartes didentification Mthodes dessai Partie 6: Cartes de proximit AMENDEMENT
5、 1: Classes addtionnelles de PICC ISO/IEC 10373-6:2011/Amd.1:2012(E) COPYRIGHT PROTECTED DOCUMENT ISO/IEC 2012 All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and
6、microfilm, without permission in writing from either ISO at the address below or ISOs member body in the country of the requester. ISO copyright office Case postale 56 CH-1211 Geneva 20 Tel. + 41 22 749 01 11 Fax + 41 22 749 09 47 E-mail copyrightiso.org Web www.iso.org ii ISO/IEC 2012 All rights re
7、servedAmendment 1:2013 to CAN/CSA-ISO/IEC 10373-6:12ISO/IEC 10373-6:2011/Amd.1:2012(E) ISO/IEC 2012 All rights reserved iiiForeword ISO (the International Organization for Standardization) and IEC (the International Electrotechnical Commission) form the specialized system for worldwide standardizati
8、on. National bodies that are members of ISO or IEC participate in the development of International Standards through technical committees established by the respective organization to deal with particular fields of technical activity. ISO and IEC technical committees collaborate in fields of mutual
9、interest. Other international organizations, governmental and non-governmental, in liaison with ISO and IEC, also take part in the work. In the field of information technology, ISO and IEC have established a joint technical committee, ISO/IEC JTC 1. International Standards are drafted in accordance
10、with the rules given in the ISO/IEC Directives, Part 2. The main task of the joint technical committee is to prepare International Standards. Draft International Standards adopted by the joint technical committee are circulated to national bodies for voting. Publication as an International Standard
11、requires approval by at least 75 % of the national bodies casting a vote. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. ISO and IEC shall not be held responsible for identifying any or all such patent rights. Amendment 1 to ISO/
12、IEC 10373-6:2011 was prepared by Joint Technical Committee ISO/IEC JTC 1, Information technology, Subcommittee SC 17, Cards and personal identification. Amendment 1:2013 to CAN/CSA-ISO/IEC 10373-6:12ISO/IEC 10373-6:2011/Amd.1:2012(E) ISO/IEC 2012 All rights reserved 1Identification cards Test method
13、s Part 6: Proximity cards AMENDMENT 1: Additional PICC classes Page 2, 3.1 Add the following term and definition, and renumber all subsequent definitions: 3.1.5 loading effect change in PCD antenna current caused by the presence of PICC(s) in the field due to the mutual coupling modifying the PCD an
14、tenna resonance and quality factor Page 5, 3.2 Add the following symbol between UT_APDU and WUPB(N): VloadDC voltage measured at connector CON3 of the Reference PICC Page 6, 5.2 Replace 5.2 and its subclauses by the following: 5.2 Calibration coils This clause defines the size, thickness and charact
15、eristics of the calibration coils 1 and 2. Calibration coil 1 shall be used only in test PCD assembly 1 and calibration coil 2 shall be used only in test PCD assembly 2. 5.2.1 Size of the calibration coil card The calibration coil card shall consist of an area which has the height and width of an ID
16、-1 type defined in ISO/IEC 7810:2003 containing a single turn coil concentric with the card outline (see Figure 1). Amendment 1:2013 to CAN/CSA-ISO/IEC 10373-6:12ISO/IEC 10373-6:2011/Amd.1:2012(E) 2 ISO/IEC 2012 All rights reservedFigure 1 Calibration coils 1 and 2 5.2.2 Thickness and material of th
17、e calibration coil card The thickness of the calibration coil card shall be less than that of an ID-1 card. It shall be constructed of a suitable insulating material. 5.2.3 Coil characteristics The coil on the calibration coil card shall have one turn. Relative dimensional tolerance shall be 2 %. Th
18、e outer size of the calibration coil 1 shall be 72 mm 42 mm with corner radius 5 mm. NOTE 1 The area over which the field is integrated is approximately 3000 mm2. NOTE 2 At 13,56 MHz the approximate inductance is 250 nH and the approximate resistance is 0,4 . The open circuit calibration factor for
19、the calibration coil 1 is 0,318 V (rms) per A/m (rms) Equivalent to 900 mV (peak-to-peak) per A/m (rms). The outer size of the calibration coil 2 shall be 47 mm 24 mm with corner radius 2 mm. NOTE 3 The area over which the field is integrated is approximately 1100 mm2. NOTE 4 At 13,56 MHz the approx
20、imate inductance is 140 nH and the approximate resistance is 0,3 . The open circuit calibration factor for the calibration coil 2 is 0,118 V (rms) per A/m (rms) Equivalent to 333 mV (peak-to-peak) per A/m (rms). The coil shall be made as a printed coil on printed circuit board (PCB) plated with 35 m
21、 copper. Track width shall be 500 m with a relative tolerance of 20 %. The size of the connection pads shall be 1,5 mm 1,5 mm. A high impedance oscilloscope probe with an input admittance equivalent to a parallel capacitance Cp9 k at 13,56 MHz shall be used to measure the (open circuit) voltage indu
22、ced in the coil. NOTE 5 The high impedance oscilloscope probe ground connection should be as short as possible, less than 20 mm or coaxial connection. Amendment 1:2013 to CAN/CSA-ISO/IEC 10373-6:12ISO/IEC 10373-6:2011/Amd.1:2012(E) ISO/IEC 2012 All rights reserved 3Page 7, 5.3 Replace 5.3 and its su
23、bclauses by the following: 5.3 Test PCD assembly Two test PCD assemblies are defined: Test PCD assembly 1 for PICCs of classes 1, 2 and 3 and for PICCs which do not claim compliance with a class; Test PCD assembly 2 for PI CCs of classes 4, 5 and 6. Each test PCD assembly shall consist of a circular
24、 test PCD antenna and two parallel sense coils: sense coil a and sense coil b. The test set-up is shown in Figure 2. The sense coils shall be connected such that the signal from one coil is in opposite phase to the other. The 10 potentiometer P1 serves to fine adjust the balance point when the sense
25、 coils are not loaded by a PICC or any magnetically coupled circuit. The capacitive load of the probe including its parasitic capacitance shall be less than 14 pF. NOTE 1 The capacitance of the connections and of the oscilloscope probe should be kept to a minimum for reproducibility. NOTE 2 In order
26、 to avoid any unintended misalignment in case of an unsymmetrical set-up the tuning range of the potentiometer P1 is only 10 . If the set-up cannot be compensated by the 10 potentiometer P1 the overall symmetry of the set-up should be checked. NOTE 3 The high impedance oscilloscope probe ground conn
27、ection should be as short as possible, less than 20 mm or coaxial connection. Sense coil aSense coil bTest PCD antenna tooscilloscopeProbe+ +Identical length twisted pairs or coaxial cables of less than100 mm 240 1 %240 1 %P110 Figure 2 Test set-up (principle) Amendment 1:2013 to CAN/CSA-ISO/IEC 103
28、73-6:12ISO/IEC 10373-6:2011/Amd.1:2012(E) 4 ISO/IEC 2012 All rights reserved5.3.1 Test PCD antenna In test PCD assembly 1 the test PCD antenna 1 shall have a diameter of 150 mm. In test PCD assembly 2 the test PCD antenna 2 shall have a diameter of 100 mm. Each test PCD antenna construction shall co
29、nform to the corresponding drawings in Annex A. The matching of each test PCD antenna should be accomplished by using an impedance analyzer or a network analyzer or an LCR meter. If either an impedance analyzer or a network analyzer or an LCR meter is not available, then the matching may be accompli
30、shed with the procedure given in Annex B. 5.3.2 Sense coils In test PCD assembly 1 the size of the sense coils 1 shall be 100 mm 70 mm with corner radius 10 mm. In test PCD assembly 2 the size of the sense coils 2 shall be 60 mm 47 mm with corner radius 10 mm. Each sense coil construction shall conf
31、orm to the corresponding drawings in Annex C. 5.3.3 Assembly of Test PCD The sense coils 1 and test PCD antenna 1 shall be assembled parallel and with the sense and antenna coils coaxial and such that the distance between the active conductors is 37,5 mm as shown in Figure 3. The sense coils 2 and t
32、est PCD antenna 2 shall be assembled parallel and with the sense and antenna coils coaxial and such that the distance between the active conductors is 23 mm as shown in Figure 3. The dimensional tolerance shall be better than 0,5 mm. The distance between the coil in the DUT and the calibration coil
33、shall be equal with respect to the coil of the test PCD antenna. NOTE These distances are chosen to offer a strong and homogenous magnetic field in the DUT position. Amendment 1:2013 to CAN/CSA-ISO/IEC 10373-6:12ISO/IEC 10373-6:2011/Amd.1:2012(E) ISO/IEC 2012 All rights reserved 5Figure 3 Test PCD a
34、ssembly 1 and test PCD assembly 2 Page 10, 5.4.2 Replace the first paragraph with the following: “The Reference PICCs coils layouts are defined in Annex D. If connectors are used between the coils and the circuitry, those connectors shall have minimal, if any, effect on the RF measurements.” Page 11
35、, 5.4.3 Replace “6 V” by “Vload” in steps f), g) and i) and in NOTE. Page 12, 6.2.1.2 Replace step a) with the following: a) Adjust the RF power delivered by the signal generator to the test PCD antenna to a field strength of the average level specified in ISO/IEC 14443-1:2008, 4.4 as measured by th
36、e calibration coil. Amendment 1:2013 to CAN/CSA-ISO/IEC 10373-6:12ISO/IEC 10373-6:2011/Amd.1:2012(E) 6 ISO/IEC 2012 All rights reservedPage 13 of ISO/IEC 10373-6:2011, 6.2.1.2 Replace step d) with the following: d) Adjust the RF power delivered by the signal generator to the test PCD antenna to a fi
37、eld strength of the maximum level specified in ISO/IEC 14443-1:2008, 4.4 as measured by the calibration coil. Page 13, 6.2.1.2 Replace step f) with the following: f) Apply for 5 min an ASK 100 % modulation to this field with the following duty cycle: 5 s at 0 A/m (rms); 25 s at the maximum level spe
38、cified in ISO/IEC 14443-1:2008, 4.4. Page 14, 7.1 Replace the first sentence with the following paragraphs, table and note: “All the PCD tests described below will be done in the operating volumes as defined by the PCD manufacturer for each supported class. All PCD tests of ISO/IEC 14443-2 parameter
39、s shall be performed using Reference PICCs 1, 2 and 3 and optionally other Reference PICCs corresponding to the optional classes supported by the PCD, with the relevant parameters and test PCD assembly as defined in Table 3. Table 3 Classes parameters Class Reference PICC VloadR2minR2maxTest PCD ass
40、embly 1 1 6 V 870 1070 Test PCD assembly 1 2 2 4,5 V 1030 1260 Test PCD assembly 1 3 3 4,5 V 1080 1320 Test PCD assembly 1 4 4 4,5 V 990 1210 Test PCD assembly 2 5 5 4,5 V 960 1170 Test PCD assembly 2 6 6 4,5 V 900 1100 Test PCD assembly 2 NOTE Vloadmay be harmonized to 4,5 V for all classes in futu
41、re revisions of ISO/IEC 10373-6.” Amendment 1:2013 to CAN/CSA-ISO/IEC 10373-6:12ISO/IEC 10373-6:2011/Amd.1:2012(E) ISO/IEC 2012 All rights reserved 7Page 15, 7.1.1 Add the following paragraph at the end of the subclause: “The maximum and minimum field strength values to be used with each Reference P
42、ICC are given in ISO/IEC 14443-2:2010/Amd.2:1), Table 1.” Page 15, 7.1.1.2 Replace items a) to d) in the Procedure for Hmintest with the following: a) Tune the Reference PICC to 13,56 MHz as described in 5.4.3. b) Place the Reference PICC into the DUT position on the Test PCD assembly producing the
43、Hminoperating condition on the calibration coil. Check that the jumper J1 is set to position b and that a DC voltage of Vloadas defined in Table 3 is measured at connector CON3. Alternatively, the jumper J1 may be set to position c and the voltage on CON2 is adjusted to obtain a DC voltage of Vloada
44、s defined in Table 3 at connector CON3. In both cases, the operating field condition shall be verified by monitoring the voltage on the calibration coil and adjusted if necessary. WARNING R2 value should be between R2minand R2maxas defined in Table 3Check this range at least once before using the al
45、ternative method. c) Position the Reference PICC within the defined operating volume of the PCD under test. The DC voltage at CON3 shall exceed Vloadas defined in Table 3. Page 15, 7.1.1.3 Replace the paragraph with the following: “The test report shall confirm the operating volume in which the DC v
46、oltage measured at CON3 for R2 or variable load resistor adjusted to Hminand Hmaxfield strength fulfils the requirements defined in steps d) of the two procedures of 7.1.1.2.” Page 15, 7.1.2 Delete 7.1.2 and its subclauses. Page 16, 7.1.3 Delete 7.1.3 and its subclauses. 1)To be published. Amendment
47、 1:2013 to CAN/CSA-ISO/IEC 10373-6:12ISO/IEC 10373-6:2011/Amd.1:2012(E) 8 ISO/IEC 2012 All rights reservedPage 16, 7.1.4.2 Replace step d) by the following: d) Apply and adjust a DC voltage at CON2 to obtain a DC voltage at connector CON3 of Vloadas defined in Table 3. Page 17, 7.1.5.2 Replace step
48、c) by the following: c) Apply and adjust a DC voltage at CON2 to obtain a DC voltage at connector CON3 of Vloadas defined in Table 3. Page 18, 7.2.1.2 Replace the first paragraph starting with “Step 1” with the following: “Step 1: The load modulation test circuit of Figure 2 and the test PCD assembl
49、y of Figure 3 defined for the PICC class (see ISO/IEC 14443-2:2010/Amd.2:, 8.2.2) are used. If the PICC does not claim to meet the requirements of one particular class as specified in ISO/IEC 14443-1:2008/Amd.1:2012, then select the test PCD assembly 1.” Page 21, 7.2.4 Replace 7.2.4 and its subclauses with the following: 7.2.4 PICC maximum loading effect 7.2.4.1 Purpose This test is used to measure the PICC loading effect.
