1、Mrz 2007DEUTSCHE NORM DKE Deutsche Kommission Elektrotechnik Elektronik Informationstechnik im DIN und VDEPreisgruppe 35DIN Deutsches Institut fr Normung e.V. Jede Art der Vervielfltigung, auch auszugsweise, nur mit Genehmigung des DIN Deutsches Institut fr Normung e.V., Berlin, gestattet.ICS 01.040
2、.31; 31.180!,rra“9797962www.din.deDDIN EN 60194Konstruktion, Herstellung und Bestckung von Leiterplatten Begriffe und Definitionen (IEC 60194:2006);Deutsche Fassung EN 60194:2006, Text EnglischPrinted board design, manufacture and assembly Terms and definitions (IEC 60194:2006);German version EN 601
3、94:2006, text in EnglishConception, fabrication et assemblage des cartes imprimes Termes et dfinitions (CEI 60194:2006);Version allemande EN 60194:2006, texte en anglaisAlleinverkauf der Normen durch Beuth Verlag GmbH, 10772 Berlin www.beuth.deGesamtumfang 126 SeitenDIN EN 60194:2007-03 2 Beginn der
4、 Gltigkeit Die von CENELEC am 2006-06-01 angenommene EN 60194 gilt als DIN-Norm ab 2007-03-01. Nationales Vorwort Vorausgegangener Norm-Entwurf: E DIN IEC 60194:2004-09. Fr diese Norm ist das nationale Arbeitsgremium K 682 Montageverfahren fr elektronische Baugruppen“ der DKE Deutsche Kommission Ele
5、ktrotechnik Elektronik Informationstechnik im DIN und VDE (http:/www.dke.de) zustndig. Die enthaltene IEC-Publikation wurde vom TC 91 Electronics assembly technology“ erarbeitet. Das IEC-Komitee hat entschieden, dass der Inhalt dieser Publikation bis zu dem auf der IEC-Website unter http:/webstore.i
6、ec.ch“ mit den Daten zu dieser Publikation angegebenen Datum (maintenance result date) unverndert bleiben soll. Zu diesem Zeitpunkt wird entsprechend der Entscheidung des Komitees die Publikation besttigt, zurckgezogen, durch eine Folgeausgabe ersetzt oder gendert. Fr den Fall einer undatierten Verw
7、eisung im normativen Text (Verweisung auf eine Norm ohne Angabe des Ausgabedatums und ohne Hinweis auf eine Abschnittsnummer, eine Tabelle, ein Bild usw.) bezieht sich die Verweisung auf die jeweils neueste gltige Ausgabe der in Bezug genommenen Norm. Fr den Fall einer datierten Verweisung im normat
8、iven Text bezieht sich die Verweisung immer auf die in Bezug genommene Ausgabe der Norm. Der Zusammenhang der zitierten Normen mit den entsprechenden Deutschen Normen ergibt sich, soweit ein Zusammenhang besteht, grundstzlich ber die Nummer der entsprechenden IEC-Publikation. Beispiel: IEC 60068 ist
9、 als EN 60068 als Europische Norm durch CENELEC bernommen und als DIN EN 60068 ins Deutsche Normenwerk aufgenommen. EUROPISCHE NORM EUROPEAN STANDARD NORME EUROPENNE EN 60194 Juli 2006 ICS 31.180; 31.190 Deutsche Fassung Konstruktion, Herstellung und Bestckung von Leiterplatten Begriffe und Definiti
10、onen (IEC 60194:2006) Printed board design, manufacture and assembly Terms and definitions (IEC 60194:2006) Conception, fabrication et assemblage des cartes imprimes Termes et dfinitions (CEI 60194:2006) Diese Europische Norm wurde von CENELEC am 2006-06-01 angenommen. Die CENELEC-Mitglieder sind ge
11、halten, die CEN/CENELEC-Geschftsordnung zu erfllen, in der die Bedingungen festgelegt sind, unter denen dieser Europischen Norm ohne jede nderung der Status einer nationalen Norm zu geben ist. Auf dem letzten Stand befindliche Listen dieser nationalen Normen mit ihren bibliographischen Angaben sind
12、beim Zentralsekretariat oder bei jedem CENELEC-Mitglied auf Anfrage erhltlich. Diese Europische Norm besteht in drei offiziellen Fassungen (Deutsch, Englisch, Franzsisch). Eine Fassung in einer anderen Sprache, die von einem CENELEC-Mitglied in eigener Verantwortung durch bersetzung in seine Landess
13、prache gemacht und dem Zentralsekretariat mitgeteilt worden ist, hat den gleichen Status wie die offiziellen Fassungen. CENELEC-Mitglieder sind die nationalen elektrotechnischen Komitees von Belgien, Dnemark, Deutschland, Estland, Finnland, Frankreich, Griechenland, Irland, Island, Italien, Lettland
14、, Litauen, Luxemburg, Malta, den Niederlanden, Norwegen, sterreich, Polen, Portugal, Rumnien, Schweden, der Schweiz, der Slowakei, Slowenien, Spanien, der Tschechischen Republik, Ungarn, dem Vereinigten Knigreich und Zypern. CENELEC Europisches Komitee fr Elektrotechnische Normung European Committee
15、 for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Zentralsekretariat: rue de Stassart 35, B-1050 Brssel 2006 CENELEC Alle Rechte der Verwertung, gleich in welcher Form und in welchem Verfahren, sind weltweit den Mitgliedern von CENELEC vorbehalten. Ref. Nr. EN 601
16、94:2006 DForeword The text of the International Standard IEC 60194:2006, prepared by IEC TC 91, “Electronics assembly technology”, was submitted to the Unique Acceptance Procedure and was approved by CENELEC as EN 60194 on 2006-06-01 without any modification. This European Standard should be used in
17、 conjunction with IEC 60050-541 which provides for basic technical terms for board assembly technology not included in this standard. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement
18、 (dop): 2007-06-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow): 2009-06-01 Annex ZA has been added by CENELEC. Endorsement notice The text of the International Standard IEC 60194:2006 was approved by CENELEC as a European Standard without any modifi
19、cation. EN 60194:2006 2EN 60194:2006 3 1 Scope This International Standard defines the terminology used in the field of printed circuit boards and printed circuit board assembly products. 2 Normative references The following referenced documents are indispensable for the application of this document
20、. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60050(541), International Electrotechnical Vocabulary (IEV) Chapter 541: Printed circuits 3 General The terms have been classified acc
21、ording to the decimal classification code (DCC) and this DCC number appears to the right of the defined term. The DCC numbering is explained fully in Annex A. In order to avoid two ID numbers, the usual practice of numbering every paragraph (every term and definition) in front of the paragraph has n
22、ot been followed in this standard. The official IEC number is the number which follows the DCC and the period (21.xxxx). Annex B provides a list of acronyms listed numerically according to the DCC number. EN 60194:2006 4 4 Terms and definitions Abrasion Resistance 54.1821 The ability of a material t
23、o withstand surface wear. Abrasive Trimming 54.1318 Adjusting the value of a film component by notching it with a finely-adjusted stream of an abrasive material against the resistor surface. Absorption Coefficients 40.1727 The degree to which various materials absorb heat or radiant energy when comp
24、ared to each other. Absorptivity, Infra-red 40.0087 The ratio (or percentage) of the amount of energy absorbed by a substrate as compared with the total amount of incident energy. Accelerated Aging 93.0001 A test in which the parameters such as voltage and temperature are increased above normal oper
25、ating values to obtain observable or measurable deterioration in a relatively short period of time. Accelerated Life Test 93.0119 See “”Accelerated Aging”. Accelerated Test 93.0216 A test to check the life expectancy of an electronic component or electronic assembly in a short period of time by appl
26、ying physically severe condition(s) to the unit under test. Accelerator 53.0002 See “Catalyst”. Acceleration Factor (AF) 93.0260 The ratio of stress in reliability testing to the normal operating condition. Acceptance Quality Level (AQL) 90.0003 The maximum number of defectives likely to exist withi
27、n a population (lot) that can be considered to be contractually tolerable; normally associated with statistically derived sampling plans. Acceptance Tests 92.0004 Those tests deemed necessary to determine the acceptability of a product and as agreed to by both purchaser and vendor. Acceptance Inspec
28、tion (Criteria) 92.0288 An inspection that determines conformance of a product to design specifications as the basis for acceptance. Access Hole 60.1319 A series of holes in successive layers of a multilayer board, each set having their centres on the same axis. These holes provide access to the sur
29、face of the land on one of the layers of the board. (See Figure A.1.) Figure A.1 Access Hole Access Protocol 21.0005 An agreed principle for establishing how nodes in a network communicate electronically. Accordion Contact 36.0006 A type of connector contact that consists of a flat spring formed int
30、o a “Z” shape in order to permit high deflection without overstress. Accuracy 90.0007 The deviation of the measured or observed value from the true value. Acid Flux 46.0009 A solution of an acid and an inorganic, organic, or water soluble organic flux. (See also “Inorganic Flux”, “Organic Flux”, and
31、 “Water Soluble Organic Flux”.) EN 60194:2006 5 Acid Number 54.0010 The amount of potassium hydroxide in milligrams that is required to neutralize one gram of an acid medium. Acid Value 54.1217 See “Acid Number” Acid-Core Solder 46.0008 Wire solder with a self-contained acid flux. Actinic Radiation
32、52.0011 Light energy that reacts with a photosensitive material in order to produce an image. Active Desiccant 30.0397 Desiccant that is either fresh (new) or has been baked according to the manufacturers recommendations to renew desiccant to original specifications. Activated Rosin Flux 46.0012 A m
33、ixture of rosin and small amounts of organic-halide or organic-acid activators. (See also “Synthetic Activated Flux”.) Activating 53.0013 A treatment that renders nonconductive material receptive to electroless deposition. Activating Layer 53.0014 A layer of material that renders a nonconductive mat
34、erial receptive to electroless deposition. Activator 46.0015 A substance that improves the ability of a flux to remove surface oxides from the surfaces being joined. Active Device 30.0016 An electronic component whose basic character changes while operating on an applied signal. (This includes diode
35、s, transistors, thyristors, and integrated circuits that are used for the rectification, amplification, switching, etc., of analog or digital circuits in either monolithic or hybrid form.) Active Metal 36.0017 A metal that has a very high electromotive force. Active Trimming 54.1321 Adjusting the va
36、lue of a film circuit element in order to obtain a specified functional output from the circuit while it is electrically activated. Actual Size 90.0018 The measured size. Additive Process 53.1322 A Process for obtaining conductive patterns by the selective deposition of conductive material on clad o
37、r unclad base material. (See also “Semi-Additive Process” and “Fully-Additive Process”.) Add-On Component 30.0019 Discrete or integrated packaged or chip components that are attached to a film circuit in order to complete the circuits function. Adhesion (Pressure Sensitive Tape) 46.2038 The bond pro
38、duced by contact between pressure-sensitive adhesive and a surface. Adhesive 46.1728 A substance such as glue or cement used to fasten objects together. In surface mounting, an epoxy adhesive is used to adhere SMDs to the substrate. Adhesion Failure 96.0020 The rupture of an adhesive bond such that
39、the separation appears to be at the adhesive-adherent interface. Adhesion Layer 74.0021 The metal layer that adheres a barrier metal to a metal land on the surface of an integrated circuit. Adhesion Promotion 53.0022 The chemical process of preparing a surface to enhance its ability to be bonded to
40、another surface or to accept an over-plate. Adhesive Coated Substrate 41.0438 A base material upon which an adhesive coating is applied, for the purpose of retaining the conductive material (either additively applied or attached as foil for subtractive processing), that becomes part of a metal-clad
41、dielectric. EN 60194:2006 6 Adhesive-Coated Catalyzed Laminate41.1320 A base material with a thin polymer coating, that contains a plating catalyst, that is subsequently treated in order to obtain a microporous surface. Adhesive-Coated Uncatalyzed Laminate 41.1323 A base material with a thin polymer
42、 coating, that does not contain a plating catalyst, that is subsequently treated in order to obtain a microporous surface. Adhesive Transfer (Pressure Sensitive Tape) 75.0558 The transfer of adhesive from its normal position on the pressure sensitive tape to the surface to which the tape was attache
43、d, either during unwind or removal. Adsorbed Contaminant 96.0023 A contaminant attracted to the surface of a material that is held captive in the form of a gas, vapour or condensate. Advanced Statistical Method 91.0024 A statistical process analysis and control technique that is more- sophisticated
44、and less widely-applicable than basic statistical methods. Aging 90.0025 The change of a property, e.g. solderability, with time. (See also “Accelerated Aging”.) Air Contamination 14.0026 See “Air Pollution” Air Pollution 14.0027 Contamination of the atmosphere with substances that are toxic or othe
45、rwise harmful. Algorithm 11.0849 A set of procedures for the solution of a problem in a series of steps. Alignment Mark 22.0030 A stylized pattern that is selectively positioned on a substrate material to assist in alignment. (See Figure A.2.) Figure A.2 Alignment Mark Aliphatic Solvents 76.0031 “St
46、raight chain” solvents, derived from petroleum, of low solvent power. Alkaline Cleaner 76.0032 A material blended from alkali hydroxides and alkaline salts. All Metal Package 33.0579 A hybrid circuit package made solely of metal, without glass or ceramic. Allowable Temperature 75.0609 The temperatur
47、e range that an electronic circuit or component can perform its intended functions. Alloy, Tin Bismuth (Sn-Bi) 45.1947 An alloy that is used as a lead free solder and consisting of tin and bismuth as the main constituents. Sn-Bi58 has a low melting point of 138 C, but is not widely used because of i
48、ts brittle properties. Alloy, Tin Copper (Sn-Cu) 45.1948 An alloy that is used as a lead free solder consisting of tin and copper considered to be applicable for wave or reflow soldering. Alloy, Tin Silver (Sn-Ag) 45.1949 An alloy that is used as a lead free solder and consisting of tin and silver a
49、s the main constituents used as a high temperature solder. Alloy, Tin Silver Bismuth (Sn-Ag-Bi) 45.1950An alloy that is used as a lead free solder and consisting of tin, silver and bismuth as the main constituents. The Bi in Sn-Ag-Bi alloy reduces the melting temperature. The higher the Bi content is, higher the mechanical strength, but with poorer elongation capability. There is a limit to Bi content. Alloy, Tin Silver Copper (Sn-Ag-Cu) 45.1951 An alloy that is used as a
