1、October 2014Translation by DIN-Sprachendienst.English price group 7No part of this translation may be reproduced without prior permission ofDIN Deutsches Institut fr Normung e. V., Berlin. Beuth Verlag GmbH, 10772 Berlin, Germany,has the exclusive right of sale for German Standards (DIN-Normen).ICS
2、25.160.50!%;s$“2248001www.din.deDDIN EN ISO 9455-5Soft soldering fluxes Test methods Part 5: Copper mirror test (ISO 9455-5:2014);English version EN ISO 9455-5:2014,English translation of DIN EN ISO 9455-5:2014-10Flussmittel zum Weichlten Prfverfahren Teil 5: Kupferspiegeltest (ISO 9455-5:2014);Engl
3、ische Fassung EN ISO 9455-5:2014,Englische bersetzung von DIN EN ISO 9455-5:2014-10Flux de brasage tendre Mthodes dessai Partie 5: Essai au miroir de cuivre (ISO 9455-5:2014);Version anglaise EN ISO 9455-5:2014,Traduction anglaise de DIN EN ISO 9455-5:2014-10SupersedesDIN EN 29455-5:1994-02www.beuth
4、.deIn case of doubt, the German-language original shall be considered authoritative.Document comprises 10 pages09.14 DIN EN ISO 9455-5:2014-10 2 A comma is used as the decimal marker. National foreword This document (EN ISO 9455-5:2014) has been prepared by Technical Committee ISO/TC 44 “Welding and
5、 allied processes” in collaboration with Technical Committee CEN/TC 121 “Welding and allied processes” (Secretariat: DIN, Germany). The responsible German body involved in its preparation was the DIN-Normenausschuss Schweien und verwandte Verfahren (DIN Standards Committee Welding and Allied Process
6、es), Working Committee NA 092-00-08 AA Weichlten (DVS AG V 6.2). The DIN Standards corresponding to the International Standards referred to in this document are as follows: ISO 9454-1 DIN EN 29454-1 ISO 9455-1 DIN EN 29455-1 ISO 9455-2 DIN EN ISO 9455-2 ISO 9455-3 DIN EN ISO 9455-3 ISO 9455-6 DIN EN
7、 ISO 9455-6 ISO 9455-8 DIN EN 29455-8 ISO 9455-9 DIN EN ISO 9455-9 ISO 9455-10 DIN EN ISO 9455-10 ISO 9455-11 DIN EN 29455-11 ISO 9455-13 DIN EN ISO 9455-13 ISO 9455-14 DIN EN 29455-14 ISO 9455-15 DIN EN ISO 9455-15 ISO 9455-16 DIN EN ISO 9455-16 ISO 9455-17 DIN EN ISO 9455-17 Amendments This standa
8、rd differs from DIN EN 29455-5:1994-02 as follows: a) ISO 9455-5:2014 has been adopted as EN ISO 9455-5:2014; b) the standard has been editorially revised; c) the standard has been harmonized with current rules of presentation. Previous editions DIN EN 29455-5: 1994-02 DIN EN ISO 9455-5:2014-10 3 Na
9、tional Annex NA (informative) Bibliography DIN EN 29454-1, Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging DIN EN 29455-1, Soft soldering fluxes Test methods Part 1: Determination of non-volatile matter, gravimetric method DIN EN 29455-8, Soft so
10、ldering fluxes Test methods Part 8: Determination of zinc content DIN EN 29455-11, Soft soldering fluxes Test methods Part 11: Solubility of flux residues DIN EN 29455-14, Soft soldering fluxes Test methods Part 14: Assessment of tackiness of flux residues DIN EN ISO 9455-2, Soft soldering fluxes Te
11、st methods Part 2: Determination of non-volatile matter, ebulliometric method DIN EN ISO 9455-3, Soft soldering fluxes Test methods Part 3: Determination of acid value, potentio-metric and visual titration methods DIN EN ISO 9455-6, Soft soldering fluxes Test methods Part 6: Determination and detect
12、ion of halide (excluding fluoride) content DIN EN ISO 9455-9, Soft soldering fluxes Test methods Part 9: Determination of ammonia content DIN EN ISO 9455-10, Soft soldering fluxes Test methods Part 10: Flux efficacy test, solder spread method DIN EN ISO 9455-13, Soft soldering fluxes Test methods Pa
13、rt 13: Determination of flux spattering DIN EN ISO 9455-15, Soft soldering fluxes Test methods Part 15: Copper corrosion test DIN EN ISO 9455-16, Soft soldering fluxes Test methods Part 16: Flux efficacy test, wetting balance method DIN EN ISO 9455-17, Soft soldering fluxes Test methods Part 17: Sur
14、face insulation resistance comb test and electrochemical migration test of flux residues DIN EN ISO 9455-5:2014-10 4 This page is intentionally blank EN ISO 9455-5July 2014 ICS 25.160.50 Supersedes EN 29455-5:1993English Version Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO
15、9455-5:2014) Flux de brasage tendre - Mthodes dessai - Partie 5: Essai au miroir de cuivre (ISO 9455-5:2014) Flussmittel zum Weichlten - Prfverfahren - Teil 5: Kupferspiegeltest (ISO 9455-5:2014) This European Standard was approved by CEN on 28 May 2014. CEN members are bound to comply with the CEN/
16、CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Cent
17、re or to any CEN member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CEN member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the
18、 official versions. CEN members are the national standards bodies of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherl
19、ands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom. CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2014 CEN All rights of exploitation in any form and by any means reserved worldwide for CEN national Members. Ref. No.
20、EN ISO 9455-5:2014 EEUROPEAN COMMITTEE FOR STANDARDIZATIONCOMIT EUROPEN DE NORMALISATIONEUROPISCHES KOMITEE FR NORMUNGEUROPEAN STANDARDNORME EUROPENNEEUROPISCHE NORMContents Page Foreword . 3 1 Scope . 4 2 Normative references. 4 3 Principle 4 4 Reagents . 4 5 Apparatus 5 6 Procedure 5 6.1 Preparati
21、on of the flux test solution . 5 6.2 Preparation of copper mirrors for test . 6 6.3 Determination . 6 7 Assessment and expression of results . 6 8 Test report . 6 2DIN EN ISO 9455-5:2014-10 EN ISO 9455-5:2014 (E) ForewordThis document (EN ISO 9455-5:2014) has been prepared by Technical Committee ISO
22、/TC 44 Welding and allied processes in collaboration with Technical Committee CEN/TC 121 “Welding and allied processes” the secretariat of which is held by DIN. This European Standard shall be given the status of a national standard, either by publication of an identical text or by endorsement, at t
23、he latest by January 2015, and conflicting national standards shall be withdrawn at the latest by January 2015. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and/or CENELEC shall not be held responsible for identifying any o
24、r all such patent rights. This document supersedes EN 29455-5:1993. According to the CEN-CENELEC Internal Regulations, the national standards organizations of the following countries are bound to implement this European Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark,
25、Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. Endorsement notice
26、The text of ISO 9455-5:2014 has been approved by CEN as EN ISO 9455-5:2014 without any modification. “”EN ISO 9455 consists of the following parts, under the general title Soft soldering fluxes Test methods: Part 1: Determination of non-volatile matter, gravimetric method Part 2: Determination of no
27、n-volatile matter, ebulliometric method Part 3: Determination of acid value, potentiometric and visual titration methods Part 5: Copper mirror test Part 6: Determination and detection of halide (excluding fluoride) content Part 8: Determination of zinc content Part 9: Determination of ammonia conten
28、t Part 10: Flux efficacy test, solder spread method Part 11: Solubility of flux residues Part 13: Determination of flux spattering Part 14: Assessment of tackiness of flux residues Part 15: Copper corrosion test Part 16: Flux efficacy tests, wetting balance method Part 17: Surface insulation resista
29、nce comb test and electrochemical migration test of flux residues 3DIN EN ISO 9455-5:2014-10EN ISO 9455-5:2014 (E)1 ScopeThis part of ISO 9455 specifies a qualitative method for assessing the aggressiveness of a flux towards copper. The test is applicable to all fluxes of type 1 as defined in ISO 94
30、54-1.2 Normative referencesThe following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any a
31、mendments) applies.ISO 9454-1, Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packagingISO 9455-1, Soft soldering fluxes Test methods Part 1: Determination of non-volatile matter, gravimetric methodISO 9455-2, Soft soldering fluxes Test methods Part 2: De
32、termination of non-volatile matter, ebulliometric method3 PrincipleFor flux samples in the form of a solid or paste, and for flux-cored solder, a flux test solution containing 25 % (m/m) of solids is prepared. For liquid flux samples, the liquid is used full strength as the flux test solution. The f
33、lux test solution is then evaluated in terms of its attack on a copper film previously vacuum deposited onto a glass plate (copper mirror). A rosin reference solution, which should not cause removal of the copper film, is used as a control. The object of the test is to determine the flux reactivity
34、due to the presence of free halide activators.NOTE The presence of amines in the flux can cause misleading results in that the flux appears to pass the test, when in fact it has a highly reactive composition.4 ReagentsUse only reagents of recognized analytical grade and only distilled, or deionized,
35、 water.4.1 Acetone.4.2 Propan-2-ol.4.3 Degreasing agent, such as a suitable neutral organic solvent such as acetone or petroleum ether.4.4 Rosin reference solution, 25 % (m/m), prepared by dissolving 25 g of W-W grade colophony in 75 g of propan-2-ol (see 4.2).4.5 Ethylenediaminetetraacetic acid (ED
36、TA), 0,1 % (m/m) solution.4DIN EN ISO 9455-5:2014-10 EN ISO 9455-5:2014 (E) 5 ApparatusUsual laboratory apparatus and, in particular, the following.5.1 Temperature/humidity oven, capable of maintaining a temperature of 25 C and a relative humidity of (50 5) %.5.2 Copper mirrors. Thoroughly clean a n
37、umber of glass test plates, approximately 25 mm 50 mm or bigger (e.g. 50 mm 75 mm) in size, degrease them, if necessary, using the degreasing agent (see 4.3) and dry them.Deposit copper, by vacuum deposition, onto one surface of the dry test plates to a thickness of approximately 50 nm. The transmit
38、tance of the plate to normal incident monochromatic light at a wavelength of 500 nm shall be between 5 % and 15 %.Copper mirror test plates complying with these requirements are available commercially1)and can be used instead.Store the copper mirrors under dry nitrogen until use.5.3 Soxhlet extracti
39、on apparatus.6 Procedure6.1 Preparation of the flux test solution6.1.1 Liquid flux samplesUse liquid flux samples at full strength as the flux test solution.6.1.2 Solid flux samples6.1.2.1 Prepare by dissolution with propan-2-ol (see 4.2, but see also 6.1.2.2), a flux test solution containing 25 % b
40、y mass of the solid flux sample.6.1.2.2 If it is found that the flux is not soluble in propan-2-ol, then use another suitable water miscible solvent and give details of this solvent in the test report see Clause 8, item f).6.1.3 Flux-cored solder6.1.3.1 Cut a length of the flux-cored solder with a m
41、ass of approximately 150 g and seal the ends by crimping. Wipe the surface clean with a cloth moistened with acetone (see 4.1). Place the sample in a beaker, add sufficient water to cover the sample, and boil for 5 min to 6 min. Remove the sample, rinse it with acetone (see 4.1), and allow to dry.Wh
42、ile protecting the solder surface from contamination, cut the sample into short lengths (maximum 19 mm) using a razor blade so as not to crimp the cut ends. Place the cut segments into the extraction tube of a clean Soxhlet extraction apparatus (see 5.3) and extract the flux with propan-2-ol (see 4.
43、2, but see also 6.1.2.2) until the return condensate is clear.1) Copper mirror test plates suitable for this test method may be obtained from Evaporated Metal Films Corporation, Ithaca, New York, USA. This information is given for the convenience of users of this document and does not constitute an
44、endorsement by ISO of the product named.5DIN EN ISO 9455-5:2014-10EN ISO 9455-5:2014 (E)6.1.3.2 Determine the non-volatile matter content of the extract using the method in ISO 9455-1 or ISO 9455-2, and adjust the content by evaporation or by dilution with propan-2-ol (see 4.2, but see also 6.1.2.2)
45、 to 25 % by mass to produce the flux test solution.6.2 Preparation of copper mirrors for testSelect two copper mirrors (see 5.2) free from visible defects. Immediately before carrying out the test in 6.3, immerse the copper mirrors in the EDTA (see 4.5) for not more than 5 s, to remove any copper ox
46、ide. Rinse immediately in running water, then in acetone (see 4.1) and dry using warm air.6.3 DeterminationPlace the two freshly cleaned copper mirrors (see 6.2) onto a clean horizontal surface, mirror side up. Place one drop (maximum 0,05 ml) of the flux test solution (see 6.1) on one of the mirror
47、s and, at a distance of approximately 35 mm, one drop (maximum 0,05 ml) of the rosin reference solution (see 4.4). During this operation do not allow the dropper to touch the copper mirror.Repeat the procedure with the second copper mirror.Place the two mirrors in a horizontal position in the temper
48、ature/humidity oven (see 5.1) and condition the mirrors at 25 C 2 C and (50 5) % relative humidity for 24 h. Remove the mirrors from the oven and wash off the flux residues using propan-2-ol (see 4.2), or using the solvent used in 6.1. Dry the mirrors using a stream of warm air.Examine the copper mi
49、rrors against a white background.NOTE The presence of free halide activators in the flux test solution results in partial or complete removal of the copper film at the location of the drop, the copper mirror becoming progressively more transparent as the flux reactivity increases. The presence of amines in the flux can cause misleading results.7 Assessment and expression o
