1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Add new resistance tolerance, dimension modification, and detail A. Add new vendors. Change voltage for 25 Vdc to 50 Vdc. 23 MAY 88 D. Moore B Add new requirements for resistance characteristic, power ratings, solderability, and dimensions. 26 MAY 89 D. Moo
2、re C Deleted ozone depleting substance. Editorial changes throughout. 4 OCT 93 D. Moore D Changes in accordance with NOR 5905-R001-94. 5 NOV 93 D. Moore E Update and validation of drawing. Change reference specification to MIL-PRF-914. Editorial changes throughout. 24 AUG 00 K. Cottongim F Changes i
3、n accordance with NOR 5905-R002-02. 6 JUN 02 K. Cottongim G Changes in accordance with NOR 5905-R003-03. 17 DEC 02 K. Cottongim H Remove vendor from suggest sources. Editorial changes throughout. 6 OCT 03 K. Cottongim J Add pure tin, manufacturers eligibility, and pulse application paragraphs. Edito
4、rial changes throughout. 3 JUL 12 M. Radecki K Remove vendor. Editorial changes throughout. 21 March 13 M. Radecki CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.100 REV STATUS OF PAGES REV K K K K K
5、K K K PAGES 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY Allen R. Knox DESIGN ACTIVITY: DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO 45444-5000 Original date of drawing: 20 August 1987 CHECKED BY David W. Withrow TITLE RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, 16 PIN, LEADLESS CHIP CARRIER APPROVED BY
6、David E. Moore SIZE A CODE IDENT. NO. 14933 DWG NO. 87014 REV K PAGE 1 OF 8 AMSC N/A 5905-2013-E33 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87014 REV K PAGE 2 1.
7、 SCOPE 1.1 Scope. This drawing describes the requirements for a 16 pin, leadless chip carrier, resistor network. These networks are available in hermetically sealed and nonhermetically sealed packages. 1.2 Part or Identifying Number (PIN). The complete PIN is as follows: 87014 - * * * * | | | | | |
8、| | | | Drawing number Schematic (1.2.1) Resistance (1.2.1.1) Tolerance (1.2.1.2) Characteristic (1.2.1.3) 1.2.1 Schematic. The schematic of the resistor network is identified by a single letter in accordance with figure 1. FIGURE 1. Schematics. 1.2.1.1 Resistance value designation. The resistance v
9、alue designations are in accordance with MIL-PRF-914. The resistance value designations for the “B” schematic are specified in table I. TABLE I. Resistance value designation. Resistance designator R1 (ohms) R2 (ohms) Resistance designator R1 (ohms) R2 (ohms) A001 82 130 A008 220 330 A002 120 200 A00
10、9 330 390 A003 130 210 A010 330 470 A004 160 260 A011 330 680 A005 180 240 A012 1,500 3,300 A006 180 390 A013 3,000 6,200 A007 220 270 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO.
11、 14933 DWG NO. 87014 REV K PAGE 3 1.2.1.2 Resistance tolerance. The resistance tolerance is identified as a single letter in accordance with table II. TABLE II. Resistance tolerance. Symbol Resistance tolerance (in percent) B 0.1 D 0.5 F 1.0 G 2.0 J 5.0 1.2.1.3 Characteristic. Resistor networks are
12、available in characteristics C, H, K, M, R, or V in accordance with MIL-PRF-914 (see 3.2). Matched ratio specified in MIL-PRF-914 for characteristics C and V are not applicable to schematic B. 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The follo
13、wing specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-914 - Resistor Networks, Fixed, Film, Surf
14、ace Mount, Nonestablished Reliability, and Established Reliability, General Specification For. DEPARTMENT OF DEFENSE STANDARD MIL-STD-202 - Test Methods for Electronic and Electrical Component Parts. MIL-STD-790 - Established Reliability and High Reliability Qualified Products List (QPL) Systems for
15、 Electrical, Electronic, and Fiber Optic Parts Specifications. MIL-STD-1285 - Marking of Electrical and Electronic Parts. * (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the DLA Document Service Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia
16、, PA 19111-5094.) 2.2 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein (except for related, specification sheets), the text of this document takes precedence. Nothing in this document,
17、however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-914 and as specified herein. 3.2 Interface and physical dimensions. The resistor shall meet t
18、he interface and physical dimensions as specified in MIL-PRF-914 and herein (see figure 2). Cavity constructions using wire bonding techniques shall be supplied only as a characteristic C hermetically sealed resistor network. Provided by IHSNot for ResaleNo reproduction or networking permitted witho
19、ut license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87014 REV K PAGE 4 Inches mm Inches mm Inches mm 0.003 0.08 0.016 0.41 0.050 1.27 0.005 0.13 0.020 0.51 0.085 2.16 0.010 0.25 0.025 0.64 0.250 6.35 0.015 0.38 0.040 1.02 0.300 7.62 NOTES: 1. Dim
20、ensions are in inches. 2. Metric equivalents are given for general information only. 3. Unless otherwise specified, tolerances are .008 (0.20 mm). 4. Adjacent corner pads may be rounded or diagonally cut to meet the .015 (0.38 mm) minimum requirement. FIGURE 2. Leadless chip carrier. 3.2.1 Terminati
21、on. Termination finish shall be tin-lead or hot solder dip as specified in MIL-PRF-914. 3.2.2 Pure tin. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be
22、 alloyed with a minimum of 3 percent lead, by mass (see 6.5). 3.3 Electrical characteristics. 3.3.1 Resistance range. The resistance range shall be 10 ohms to 100 kilohms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENT
23、ER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87014 REV K PAGE 5 3.3.2 Resistor power rating. The resistor power rating for individual resistors shall be in accordance with table III. 3.3.3 Package power rating. The package power rating shall be in accordance with table III. For temperatures i
24、n excess of 70oC, resistors shall be derated in accordance with MIL-PRF-914. TABLE III. Power ratings. Schematic Characteristic K and M Characteristics C, H, R, and V Element (watts) Network (watts) Element (watts) Network (watts) A 0.05 0.75 0.025 0.375 B 0.05 0.70 0.025 0.35 3.3.4 Power conditioni
25、ng. Power conditioning shall be in accordance with MIL-PRF-914 at 1.5 times the rated power specified for individual resistors (see 3.3.2). 3.3.5 Operating voltage. The maximum operating voltage shall be 50 Vdc. 3.3.6 Operating temperature. The operating temperature shall be -55oC to +125oC. 3.3.7 R
26、esistance temperature characteristic. The resistance temperature characteristic shall be in accordance with MIL-PRF-914. 3.3.8 TC tracking. The TC tracking shall be 10 ppm/oC. 3.3.9 Solderability. When resistors are tested as specified in 4.6, there shall be no evidence of electrical or mechanical d
27、amage. 3.3.9.1 Failure criteria for leadless packages. The criteria for acceptable solderability during evaluation of the terminations are: a. The total surface area of the dipped part of the termination is at least 95 percent covered by a continuous new solder coating. b. That pinholes, voids, poro
28、sity, nonwetting, or dewetting are not concentrated in one area and do not exceed 5 percent of the total metallized termination area. c. That there shall be no solder bridging between any termination area and any other termination area not connected to it by design. In the event that the solder dipp
29、ing causes bridging, the test shall not be considered a failure provided that a local application of heat (i.e., gas, soldering iron, or redipping) results in solder pullback and no wetting of the dielectric area are indicated by microscope examination at a magnification of between 10x and 20x. That
30、 area of the surface to be tested as specified in 4.6c shall include the total metallized area of both the castellations and the terminal pads. In case of a dispute, the percentage of coverage with pinholes or voids shall be determined by actual measurement of these areas, as compared to the total a
31、rea. 3.4 Environmental characteristic. The environmental characteristics shall be in accordance with MIL-PRF-914 characteristic C, H, K, M, R or V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A C
32、ODE IDENT NO. 14933 DWG NO. 87014 REV K PAGE 6 3.5 Marking. Marking shall be in accordance with MIL-STD-1285, except the PIN shall be as specified in 1.2, with the manufacturers CAGE number or trade mark and date code. 3.6 Recycled, recovered, or environmentally preferable materials. Recycled, recov
33、ered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. 3.7 Manufacturer eligibility. To be eligible for listing as a
34、 approved source of supply, a manufacturer shall be listed on the MIL-PRF-914 Qualified Products List for at least one part, or perform the group A and group B inspections specified herein on a sample agreed upon by the manufacturer and DLA Land and Maritime-VAT. 3.7.1 Certificate of compliance. A c
35、ertificate of compliance shall be required from manufacturers requesting to be listed as an approved source of supply. 3.8 Workmanship. Resistors shall be uniform in quality and free from any defects that will affect life, serviceability, or appearance. 4. VERIFICATION 4.1 Product assurance program.
36、 The product assurance program specified in MIL-PRF-914 and maintained in accordance with MIL-STD-790 is not applicable to this document. 4.2 Qualification inspection. Qualification inspection is not applicable to this document. 4.2.1 Failure rate qualification. The failure rate qualification specif
37、ied in MIL-PRF-914 is not applicable to this document. 4.3 Conformance inspections. 4.3.1 Inspection of product for delivery. Inspection of product for delivery shall consist of group A and group B inspections of MIL-PRF-914. 4.3.2 Certification. The acquiring activity, at its discretion, may accept
38、 a certificate of compliance with group B requirements in lieu of performing group B tests (see 6.2d). 4.4 Inspection of packaging. Inspection of packaging shall be in accordance with MIL-PRF-914. 4.5 “B” schematic tests. For the tests on “B” schematic, the dc resistance measurements, resistance tem
39、perature characteristics measurement, and short time overload power application shall be made between each terminal and the application common terminal without compensation for the shunt circuits. The pin to pin dc resistance measurements shall be used directly to determine the acceptability to sect
40、ion 3 requirements. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87014 REV K PAGE 7 4.6 Solderability. Solderability shall be in accordance with method 208 of MIL-ST
41、D-202. The following details shall apply: a. Application of flux. Flux type shall be in accordance with MIL-PRF-914. Terminations shall be immersed in the flux, which is at room ambient temperature, to the minimum depth necessary to cover the surface to be tested. The terminations shall be completel
42、y immersed by individually dipping each edge with the Y1 axis 30 degrees to 45 degrees from vertical. The terminations to be tested shall be immersed in the flux for a period of 5 seconds to 10 seconds. b. Solder dip. The dross and burned flux shall be skimmed from the surface of the molten solder.
43、(NOTE: May not require separate operation in wave or flow pot). The molten solder shall be maintained at a uniform temperature of 245C 5C. The surface of the molten solder shall be skimmed again prior to immersing the terminations in the solder. The part shall be attached to a dipping device and the
44、 flux covered terminations immersed one side at a time, in molten solder to the depth, and in the same manner specified in 4.6a. The immersed and emersion rates shall be 1.000 0.250 inch per second and dwell time in the solder bath shall be 5.0 seconds 0.5 second. After the dipping process, the part
45、 shall be allowed to cool in air. Residue flux shall be removed from the terminations by rinsing in a suitable solvent. If necessary, a soft cloth or cotton swab moistened with clean 91 percent isopropyl alcohol shall be used to remove all remaining flux. c. Examinations of terminations. After each
46、dip coated termination has been thoroughly cleaned of flux, the castellation and pad shall be examined using a magnification between 10x and 20x. 4.7 Visual and mechanical examination. Resistors shall be examined to verify that the materials, design, construction, physical dimensions, marking, and w
47、orkmanship are in accordance with the applicable requirements of MIL-PRF-914. 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When actual packaging of materiel is to be performed by DoD personnel or in-house c
48、ontractor personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activity within the Military Department or Defense Agency, or within the military services syst
49、em commands. Packaging data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Intended use. Resistor networks are used in
