1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Add new vendor. Add pure tin prohibition. Editorial requirements throughout 17 Mar 2006 M. Radecki B Vendor part number update 19 July 2006 M. Radecki C Corrections to power rating (figure 2), table II and table IV 09 Aug 2007 M. Radecki D Vendor recommende
2、d changes. DoD requirements. Editorial requirements throughout 06 Aug 2009 M. Radecki E Vendor address change. Add new vendor. Editorial changes throughout. 1 Mar 2013 M. Radecki Prepared in accordance with ASME Y14.100 Source Control drawing REV STATUS OF PAGES REV E E E E E E E E PAGES 1 2 3 4 5 6
3、 7 8 PMIC N/A PREPARED BY Jesus V. Garcia III DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OH Original date of drawing 18 October 2005 CHECKED BY Andrew R. Ernst TITLE RESISTORS, CHIP, FIXED, BULK METAL FOIL, ULTRA PRECISION, STYLE 2512 APPROVED BY William E. Sindelar SIZE A CODE IDENT. NO. 037Z3 DWG N
4、O. 06002 REV E PAGE 1 OF 8 AMSC N/A 5905-2012-E04 CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS,
5、OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 06002 REV E PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a bulk metal foil, ultra precision, chip resistor, style 2512. 1.2 Part or Identifying Number (PIN). The complete PIN is as follows: 06002 - * * * | | | | Drawing number Resist
6、ance value (see 3.3.1) Power rating (see 3.3.4) Tolerance (see 3.3.3) 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications and standards. The following specifications, standards and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, t
7、he issues of these documents are those listed in the cited in the solicitation or contract (see 6.2). DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-55342 - Resistors, Chip, Fixed, Film, Nonestablished Reliability, Established Reliability, Space Level, General Specification for. DEPARTMENT OF DEFENSE S
8、TANDARDS MIL-STD-690 - Failure Rate Sampling Plans and Procedures. MIL-STD-790 - Standard Practice for Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications. (Copies of these documents are available online
9、at https:/assist.dla.mil/quicksearch/ or from the DLA Document Service, Building 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited here
10、in (except for related specification sheets), the text of this document takes precedence unless otherwise noted. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item req
11、uirements shall be as specified herein. 3.2 Interface and physical dimensions. The interface and physical dimensions shall be as specified in MIL-PRF-55342 and herein (see figure 1). Passivation is not applicable, however, a protective coating over the element shall be provided. Provided by IHSNot f
12、or ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 06002 REV E PAGE 3 3.3 Electrical characteristics 3.3.1 Resistance. The nominal resistance expressed in ohms is identified by six character
13、s, consisting of five digits and a letter. The letter is used simultaneously as a decimal point and as a multiplier. For resistance values: a. Greater than or equal to 1 ohm but less than 1,000 ohms, the letter “R“ is used to represent a decimal point. b. Greater than or equal to 1,000 ohms but less
14、 than 1 megohm, the letter “K“ is used to represent a decimal point. All digits preceding and following the letters (R or K) of the group represent significant figures. The resistance value designations are shown in table I. Minimum and maximum resistance values shall be as specified in 3.3.2. The s
15、tandard values for every decade shall follow the sequence specified in the 10 to 100 decade table of MIL-PRF-55342 for resistance tolerances D and F. The resistance values for tolerances T (inactive for new design), Q, A, B, and C may be any value within the limits specified herein, but it is prefer
16、red that values be chosen from the “B“ column of the 10 to 100 decade table of MIL-PRF-55342. The resistance values for tolerance D shall follow the standard values listed under tolerance B of MIL-PRF-55342. L W D T .249 .127 .032 .025 .005 .005 .005 MAX NOTES: 1. Dimensions are in Inches. Metric eq
17、uivalents are given for general information only. 2. The pictorial view of the styles above is given as representative of the envelope of the item. Slight deviations from the outline shown, which are contained within the envelope and do not alter the functional aspects of the device, are acceptable.
18、 3. Tolerances shall be +/- 0.005 inch (+/- 0.13 mm) unless otherwise specified. 4. The bottom view shown above represents the mounting side. FIGURE 1. Chip resistor. Inches mm .005 0.13 .025 0.64 .032 0.81 .127 3.232 .249 6.32 Uncoated ceramic Provided by IHSNot for ResaleNo reproduction or network
19、ing permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 06002 REV E PAGE 4 TABLE I. Designation of resistance values. Designation Resistance ohms 10R000 to 99R900 incl. 10 to 99.9 incl. 100R00 to 999R00 incl. 100 to 999 incl. 1K00
20、00 to 9K9900 incl. 1000 to 9,990 incl. 10K000 to 99K900 incl. 10,000 to 99,900 incl. 100K00 100,000 3.3.2 Resistance range and resistance temperature characteristic. The resistance range shall be from 10 ohms to 100 kilohms. The corresponding resistance temperature characteristic is specified in tab
21、le II. Table II. Resistance range and resistance temperature characteristic. Resistance range 1/ Resistance Temperature Characteristic (RTC) in ppm/OC 1/ Power rating (see 3.3.4) 250 - 150K 4 A 1/ 50 - 250 5 25 - 50 6 10 - 25 8 100 - 150K 2 B 1/ 50 - 100 3 10 - 50 4 250 - 100K 4 C 50 - 250 5 25 - 50
22、 6 10 - 25 8 100 - 100K 3 D 50 - 100 4 10 - 50 5 1/ Inactive for new design with corresponding resistance range and RTC. 3.3.3 Resistance tolerance. Resistors are available in resistance tolerances as specified in table III. TABLE III. Resistance tolerance. Symbol Resistance tolerance percent Availa
23、ble resistance range T 1/ 0.01 250 to 150k Q 0.02 A 0.05 100 to 100k B 0.1 50 to 100k C 0.25 25 to 100k D 0.5 10 to 100k F 1.0 1/ Inactive for new design Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO S
24、IZE A CODE IDENT NO. 037Z3 DWG NO. 06002 REV E PAGE 5 3.3.4 Power and voltage rating. The power rating is at 70OC derated to +150OC at zero power (see figure 2) and maximum voltage is specified in table IV. Table IV. Power and voltage rating. Symbol Maximum power rating (mWatts) Resistance range in
25、ohms Voltage (in volts) A 1/ 400 10 to 100K, incl E=PR E = Voltage P = Power R = Resistance B 1/ 750 C 400 D 750 10 to 65K, incl. 480 65k to 100k, incl. 1/ Inactive for new design FIGURE 2. Derating curve. 3.3.5 Termination. The termination material shall be in accordance with MIL-PRF-55342, code le
26、tter B 3.3.5.1 Pure tin. The use of pure tin, as an underplate or final finish, is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.3). 3.4 Thermal shoc
27、k. When resistors are tested as specified in MIL-PRF-55342 for thermal shock the change in resistance shall not exceed 0.03 percent +0.01 ohm. 3.5 Low temperature operation. When resistors are tested as specified in MIL-PRF-55342 for low temperature operation the change in resistance shall not excee
28、d 0.03 percent +0.01 ohm. 3.6 Short time overload. When resistors are tested as specified in MIL-PRF-55342 for short time overload the change in resistance shall not exceed 0.02 percent +0.01 ohm. 3.7 High temperature exposure. When resistors are tested as specified in MIL-PRF-55342 for high tempera
29、ture exposure the change in resistance shall not exceed 0.03 percent +0.01 ohm. 3.8 Resistance to soldering heat. When resistors are tested as specified in MIL-PRF-55342 for resistance to soldering heat the change in resistance shall not exceed 0.02 percent +0.01 ohm. -65 -50 -25 0 25 50 75 100 125
30、150 175 100 80 60 40 20 0 Percentofrated power70OC -55OC Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 06002 REV E PAGE 6 3.9 Moisture resistance. When resistors are
31、 tested as specified in MIL-PRF-55342 for moisture resistance the change in resistance shall not exceed 0.1 percent +0.01 ohm. 3.10 Life. When resistors are tested as specified in MIL-PRF-55342 for life the change in resistance shall not exceed 0.05 percent +0.01 ohm. 3.11 Resistance temperature cha
32、racteristic. When resistors are tested as specified in MIL-PRF-55342 the RTC shall not exceed the values specified (see 3.3.2). 3.12 Marking. Marking is not required on this resistor; however, each waffle pack and each unit package shall be marked with the PIN assigned herein (see 1.2), the manufact
33、urers identification code, the date code, and the lot code. At the option of the manufacturer, the resistor may be marked (i.e., laser, color dot, etc.). The marking shall remain legible after all tests. 3.13 Manufacturer eligibility. To be eligible for listing as an approved source of supply, a man
34、ufacturer shall be listed on the MIL-PRF-55342 Qualified Product List for at least one part, or perform the group A and group B inspections specified herein on a sample of parts agreed upon by the manufacturer and DLA Land and Maritime-VA. 3.13.1 Certificate of compliance. A certificate of complianc
35、e shall be required from manufacturers requesting to be listed as approved sources of supply. 3.14 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets
36、 or exceeds the operational and maintenance requirements and promotes economically advantageous life cycle costs. 3.15 Workmanship. Resistors shall be processed in such a manner as to be uniform in quality and be free from defects that will affect life, serviceability, or appearance. 4. VERIFICATION
37、 4.1 Product assurance program. The product assurance program specified in MIL-PRF-55342 and maintained in accordance with MIL-STD-790 is not applicable to this document. 4.2 Qualification inspection. Qualification inspection is not applicable to this document. 4.3 Product level qualification. The p
38、roduct level qualification specified in MIL-PRF-55342 and MIL-STD-690 is not applicable to this document. 4.4 Conformance inspection. 4.4.1 Inspection of product for delivery. Inspection of product for delivery shall consist of group A inspection (ER level only. PPM reporting, subgroup 1, subgroup 3
39、, are not applicable) and group B inspection of MIL-PRF-55342. 4.4.1.1 Certification. The procuring activity may accept a certificate of compliance in lieu of Group B inspection. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER,
40、COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 06002 REV E PAGE 7 5. PACKAGING 5.1 Packaging. For acquisition purpose, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personn
41、el, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activities within the Military Service or Defense Agency, or within the military services system commands. Packa
42、ging data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not m
43、andatory.) 6.1 Intended use. Chip resistors are intended to be used in thick or thin film circuits where microcircuity is intended, also, for use in surface mounting application. 6.2 Ordering data. The contract or purchase order should specify the following: a. Complete PIN (see 1.2). b. Requirement
44、s for delivery: One copy of the conformance inspection data or a certificate of compliance that parts have passed conformance inspection with each shipment of parts by the manufacturer. c. Packaging requirements (see 5.1). (i.e. Electrostatic discharge sensitive packaging). d. Whether the manufactur
45、er performs the group B tests or provides certificate of compliance with group B (see 4.4.1.1). 6.3 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years a
46、fter manufacture and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers
47、. For additional information on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin). 6.4 Tolerance caution. Soldering temperature used during installation may cause resistance to shift up to 0.05 %. 6.5 Recommended mounting. A low profile solder fillet is re
48、commended (25 percent to 85 percent of chip “T“ dimension). IR, vapor phase, and convection reflow are recommended. The resistance element must be mounted in the up position to prevent failure of the part. 6.6 Electrostatic charge. Under several combinations of conditions, these resistors can be ele
49、ctrically damaged, by electrostatic charges, and drift from specified value. Users should consider this phenomena when ordering or shipping resistors. Direct shipment to Government is controlled by MIL-DTL-39032 that specifies a preventative packaging procedure. 6.7 Pulse applications. Designers are CAUTIONED on using
