1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Vendor recommended changes. Current DoD requirements. Editorial requirements throughout 06 Aug 2009 M. Radecki B Vendor address change. Editorial changes throughout. 1 Mar 2013 M. Radecki Prepared in accordance with ASME Y14.100 Source control drawing REV S
2、TATUS OF PAGES REV B B B B B B B B PAGES 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY Jesus V. Garcia III DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OH Original date of drawing 1 November 2007 CHECKED BY Andrew R. Ernst TITLE RESISTORS, CHIP, FIXED, BULK METAL FOIL, ULTRA PRECISION, STYLE 1206 APPROVED BY Mi
3、chael A. Radecki SIZE A CODE IDENT. NO. 037Z3 DWG NO. 07025 REV B PAGE 1 OF 8 AMSC N/A 5905-2012-E10 CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from
4、 IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 07025 REV B PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a bulk metal foil, ultra precision, chip resistor, style 1206. 1.2 Part or Identifying Number (PIN). The complete PIN is as f
5、ollows: 07025 - * * * Drawing number Resistance value (see 3.3.1) Power rating (see 3.3.3) Tolerance (see 3.3.4) 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications and standards. The following specifications, standards and handbooks form a part of this document to the extent spec
6、ified herein. Unless otherwise specified, the issues of these documents are those listed in the cited in the solicitation or contract (see 6.2). DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-55342 - Resistors, Chip, Fixed, Film, Nonestablished Reliability, Established Reliability, Space Level, General
7、 Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-690 - Failure Rate Sampling Plans and Procedures. MIL-STD-790 - Standard Practice for Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications. (Copi
8、es of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the DLA Document Service, Building 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. Unless otherwise noted herein or in the event of a conflict between the text of this document and
9、 the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this
10、 document and the references cited herein (except for related specification sheets), the text of this document takes precedence unless otherwise noted. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Ite
11、m requirements. The individual item requirements shall be as specified herein. 3.2 Interface and physical dimensions. The interface and physical dimensions shall be as specified in MIL-PRF-55342 and herein (see figure 1). Passivation is not applicable, however, a protective coating over the element
12、shall be provided. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 07025 REV B PAGE 3 L W D T .126 .062 .020 .025 .005 .005 .005 MAX NOTES: 1. Dimensions are in Inches
13、. Metric equivalents are given for general information only. 2. The pictorial view of the styles above is given as representative of the envelope of the item. Slight deviations from the outline shown, which are contained within the envelope and do not alter the functional aspects of the device, are
14、acceptable. 3. Tolerances shall be +/- 0.005 inch (+/- 0.13 mm) unless otherwise specified. 4. The bottom view shown above represents the mounting side. FIGURE 1. Chip resistor. 3.3 Electrical characteristics 3.3.1 Resistance. The nominal resistance expressed in ohms is identified by six characters,
15、 consisting of five digits and a letter. The letter is used simultaneously as a decimal point and as a multiplier. For resistance values: a. Greater than or equal to 1 ohm but less than 1,000 ohms, the letter “R“ is used to represent a decimal point. b. Greater than or equal to 1,000 ohms but less t
16、han 1 megohm, the letter “K“ is used to denote that a decimal point is located three places to the right. All digits preceding and following the letters (R or K) of the group represent significant figures. The resistance value designations are shown in table I. Minimum and maximum resistance values
17、shall be as specified in 3.3.2. Inches mm .005 0.13 .025 0.64 .020 0.51 .062 1.57 .126 3.20 Uncoated ceramic Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 07025 REV
18、B PAGE 4 TABLE I. Designation of resistance values. Designation Resistance ohms 10R000 to 99R999 incl. 10 to 99.999 incl. 100R00 to 999R99 incl. 100 to 999.99 incl. 1K0000 to 9K9999 incl. 1000 to 9,999.9 incl. 10K000 to 20K000 incl. 10,000 to 20,000 incl. 3.3.2 Resistance range and resistance temper
19、ature characteristic. The resistance range shall be from 10 ohms to 30 kilohms. The corresponding resistance temperature characteristic is specified in table II. Table II. Resistance range and resistance temperature characteristic. Resistance Range (in Ohms) Resistance Temperature Characteristic (RT
20、C) in ppm/OC Power rating (see 3.3.3) 250 - 30K 4 A 1/ 50 - 250 5 25 - 50 6 10 - 25 8 100 - 30K 2 B 1/ 50 - 100 3 10 - 50 4 250 - 20K 4 C 50 - 250 5 25 - 50 6 10 - 25 8 100 - 20K 3 D 50 - 100 4 10 - 50 5 1/ Inactive for new design with corresponding resistance range and RTC. 3.3.3 Power rating and m
21、aximum continuous working voltage. The power rating is at 70OC derated to +150OC at zero power (see figure 2) and is specified in table III. Table III. Power rating and maximum continuous working voltage. Symbol Maximum power rating (mWatts) Voltage (in volts) A 1/ 150 E=PR E = Voltage P = Power R =
22、 Resistance B 1/ 300 C 150 D 300 1/ Inactive for new design Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 07025 REV B PAGE 5 3.3.4 Resistance tolerance. Resistors ar
23、e available in resistance tolerances as specified in table IV. TABLE IV. Resistance tolerance. Symbol Resistance tolerance percent Available resistance range (in Ohms) T 1/ 0.01 250 to 30K Q 0.02 A 0.05 100 to 20K B 0.1 50 to 20K C 0.25 25 to 20K D 0.5 10 to 20K F 1.0 1/ Inactive for new design FIGU
24、RE 2. Derating curve. 3.3.5 Termination. The termination material shall be in accordance with MIL-PRF-55342, code letter B. 3.3.5.1 Pure tin. The use of pure tin, as an underplate or final finish, is prohibited both internally and externally. Tin content of resistor components and solder shall not e
25、xceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.3). 3.4 Thermal shock. When resistors are tested as specified in MIL-PRF-55342 for thermal shock the change in resistance shall not exceed 0.03 percent +0.01 ohm. 3.5 Low temperature operation. When resi
26、stors are tested as specified in MIL-PRF-55342 for low temperature operation the change in resistance shall not exceed 0.03 percent +0.01 ohm. 3.6 Short time overload. When resistors are tested as specified in MIL-PRF-55342 for short time overload the change in resistance shall not exceed 0.02 perce
27、nt +0.01 ohm. -65 -50 -25 0 25 50 75 100 125 150 175 Temperature (OC) 100 80 60 40 20 0 Percentofrated power70OC -55OC Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO.
28、07025 REV B PAGE 6 3.7 High temperature exposure. When resistors are tested as specified in MIL-PRF-55342 for high temperature exposure the change in resistance shall not exceed 0.03 percent +0.01 ohm. 3.8 Resistance to soldering heat. When resistors are tested as specified in MIL-PRF-55342 for resi
29、stance to soldering heat the change in resistance shall not exceed 0.02 percent +0.01 ohm. 3.9 Moisture resistance. When resistors are tested as specified in MIL-PRF-55342 for moisture resistance the change in resistance shall not exceed 0.1 percent +0.01 ohm. 3.10 Life. When resistors are tested as
30、 specified in MIL-PRF-55342 for life the change in resistance shall not exceed 0.05 percent +0.01 ohm. 3.11 Resistance temperature characteristic. When resistors are tested as specified in MIL-PRF-55342 the RTC shall not exceed the values specified (see 3.3.2). 3.12 Marking. Marking is not required
31、on this resistor; however, each waffle pack and each unit package shall be marked with the PIN assigned herein (see 1.2), the manufacturers identification code, the date code, and the lot code. At the option of the manufacturer, the resistor may be marked (i.e., laser, color dot, etc.). The marking
32、shall remain legible after all tests. 3.13 Manufacturer eligibility. To be eligible for listing as an approved source of supply, a manufacturer shall be listed on the MIL-PRF-55342 Qualified Product List for at least one part, or perform the group A and group B inspections specified herein on a samp
33、le of parts agreed upon by the manufacturer and DLA Land and Maritime-VAT. 3.13.1 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be listed as approved sources of supply. 3.14 Recycled, recovered, or environmentally preferable materials. Recy
34、cled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements and promotes economically advantageous life cycle costs. 3.15 Workmanship. Resistors shall be processed in s
35、uch a manner as to be uniform in quality and be free from defects that will affect life, serviceability, or appearance. 4. VERIFICATION 4.1 Product assurance program. The product assurance program specified in MIL-PRF-55342 and maintained in accordance with MIL-STD-790 is not applicable to this docu
36、ment. 4.2 Qualification inspection. Qualification inspection is not applicable to this document. 4.3 Product level qualification. The product level qualification specified in MIL-PRF-55342and MIL-STD-690 is not applicable to this document. 4.4 Conformance inspection. 4.4.1 Inspection of product for
37、delivery. Inspection of product for delivery shall consist of group A inspection (ER level only. PPM reporting, subgroup 1, subgroup 3, are not applicable) and group B inspection of MIL-PRF-55342. 4.4.1.1 Certification. The procuring activity may accept a certificate of compliance in lieu of Group B
38、 inspection. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 07025 REV B PAGE 7 5. PACKAGING 5.1 Packaging. For acquisition purpose, the packaging requirements shall b
39、e as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Con
40、trol Points packaging activities within the Military Service or Defense Agency, or within the military services system commands. Packaging data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsibl
41、e packaging activity. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Intended use. Chip resistors are intended to be used in thick or thin film circuits where microcircuity is intended, also, for use in surface mounting
42、application. 6.2 Ordering data. The contract or purchase order should specify the following: a. Complete PIN (see 1.2). b. Requirements for delivery: One copy of the conformance inspection data or a certificate of compliance that parts have passed conformance inspection with each shipment of parts b
43、y the manufacturer. c. Packaging requirements (see 5.1). (i.e. Electrostatic discharge sensitive packaging). d. Whether the manufacturer performs the group B tests or provides certificate of compliance with group B (see 4.4.1.1). 6.3 Tin whisker growth. The use of alloys with tin content greater tha
44、n 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a whisker-prone surfa
45、ce will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin). 6.4 Tolerance caution. Soldering temper
46、ature used during installation may cause resistance to shift up to 0.05 %. 6.5 Recommended mounting. A low profile solder fillet is recommended (25 percent to 85 percent of chip “T“ dimension). IR, vapor phase, and convection reflow are recommended. The resistance element must be mounted in the up p
47、osition to prevent failure of the part. 6.6 Electrostatic charge. Under several combinations of conditions, these resistors can be electrically damaged, by electrostatic charges, and drift from specified value. Users should consider this phenomena when ordering or shipping resistors. Direct shipment
48、 to Government is controlled by MIL-DTL-39032 that specifies a preventative packaging procedure. 6.7 Pulse applications. Designers are CAUTIONED on using these resistors in pulse applications. Since they have not been qualified nor tested for such applications, damage and premature failure are possible. These resistors only see a one time pulse (Short-time overload) as part of the group B inspection. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG
