DLA DSCC-DWG-09025-2011 CAPACITORS FIXED CERAMIC CHIP TIGHT TOLERANCE THIN FILM 0603.pdf
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1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.100 Source control drawing REV STATUS OF PAGES REV PAGES 1 2 3 4 5 6 7 9 10 11 12 PMIC N/A PREPARED BY John Bonitatibus DESIGN ACTIVITY DLA LAND AND MARITIME COLUMBUS, OH Original date of drawing 30 August 2011 CHECKED BY
2、Mark Rush TITLE CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0603 APPROVED BY Michael A. Radecki SIZE A CODE IDENT. NO. 037Z3 DWG NO. 09025 SCALE N/A REV PAGE 1 OF 12 AMSC N/A 5910-E444Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-
3、DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 09025 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing and MIL-PRF-55681 describe the requirements for capacitors, ceramic, chip. These capacitors are composed of a single or double layer dielectric thin film and are of smaller size
4、 with lower voltages and tighter tolerances than those currently offered in MIL-PRF-55681. 1.2 Part or Identifying Number (PIN) The complete PIN is as follows: 09025- BP 100 B J U - Drawing number Dielectric (see 1.2.1) Capacitance value (see 1.2.2) Voltage (see 1.2.3) Capacitance tolerance (see 1.2
5、.4) Termination finish (see 1.2.5) Group C testing option (see 1.2.6) 1.2.1 Dielectric rated temperature and voltage-temperature limits. The rated temperature and voltage-temperature limits are identified by a two-letter symbol. The first letter “B“ indicates the rated temperature of -55C to +125C;
6、the second letter indicates the voltage-temperature limits across the rated temperature as shown in table I. TABLE I. Voltagetemperature limit. Symbol Capacitance change with reference to +25C Step A through step D of MIL-PRF-55681 table XIII Percent rated voltage Step E through step G of MIL-PRF-55
7、681 table XIII P 30 ppm/ degree C 100 30 ppm/ degree C H 60 ppm/ degree C 100 60 ppm/ degree C 1.2.2 Capacitance value. The nominal capacitance value, expressed in picofarads (pF) is identified by a three-digit number; the first two digits represent significant figures and the last digit specifies t
8、he number of zeros to follow. When the nominal value is less than 10 pF, the letter “R” is used to indicate the decimal point and the succeeding digit(s) of the group represent significant figure(s). 1R0 indicates 1.0 pF; R75 indicates 0.75 pF; and 0R5 indicates 0.5 pF. 1.2.3 Voltage. The rated volt
9、age for continuous operation at +125C is identified by a single letter as shown in table II. TABLE II. Rated voltage. Symbol Rated voltage (volts, dc) X 10 Y 16 Z 25 A 50 B 100 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COL
10、UMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 09025 REV PAGE 3 1.2.4 Capacitance tolerance. The capacitance tolerance is identified by a single letter in accordance with table III. TABLE III. Capacitance tolerance. Symbol Capacitance tolerance () A 0.05 pF B 0.1 pF C 0.25 pF D 0.5 pF F 1 percent G
11、 2 percent J 5 percent P 0.02 pF Q 0.03 pF X 0.015 pF Z 0.01 pF 1.2.5 Termination finish. Termination finish is identified by a single letter as shown in table IV. TABLE IV. Termination finish. Symbol Termination finish U Base metallization-barrier metal-solder coated (tin/lead alloy with a minimum
12、of 4 percent lead) 1.2.6 Group C testing option. To require MIL-PRF-55681 group C testing, use the appropriate letter from table V. If group C testing is not desired, leave this location blank. When optional group C testing is requested, terminal strength, series resonance, and moisture resistance a
13、re not applicable. NOTE: Ordering group C options that contain a 2,000-hour life test may extend the processing time by 90 days or more. TABLE V. Group C testing options. Letter Group C testing option C Full group C L 2,000 hour life test only M 1,000 hour life test only H Low voltage humidity only
14、N/A No group C testing 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. Wh
15、ile every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and h
16、andbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. Provided by IHSNot for ResaleNo reproduction or networking permitte
17、d without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 09025 REV PAGE 4 DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-55681 - Capacitor, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, General S
18、pecification For. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Electronic and Electrical Component Parts, Test Methods for. MIL-STD-883 - Microcircuits, Test Methods for. MIL-STD-1285 - Marking of Electrical and Electronic Parts. (Copies of these documents are available online at https:/assist.daps
19、.dla.mil/quicksearch or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094) 2.3 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these do
20、cuments are those cited in the solicitation or contract. AGILENT TECHNOLOGIES Application Note 1369-6 - How To Accurately Evaluate Low ESR, High Q RF Chip Devices. (Copies of these documents are available online at http:/ or from Agilent Technologies, Inc., 5301 Stevens Creek Blvd., Santa Clara CA 9
21、5051) INTERNATIONAL ELECTROTECHNICAL COMMISION (IEC) IEC 60068-2-58 - Test Methods for Solderability, Resistance to Dissolution of Metallization and to Soldering Heat of Surface Mounting Devices (SMD). (Copies of these documents are available online at http:/ or from Global Engineering Documents, At
22、tn: Customer Service Department, 15 Inverness Way East, Englewood CO 80112-5776) 2.4 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothin
23、g in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-55681, and as specified herein. Unless otherwise stated, these capacitors
24、 shall be capable of meeting all electrical, environmental, and mechanical requirements of MIL-PRF-55681. 3.2 Pure tin. The use of pure tin, as an underplate or final finish, is prohibited both internally and externally. Tin content of capacitor components and solder shall not exceed 96 percent, by
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