1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.100 REV PAGE REV STATUS OF PAGES REV PAGE 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY DLA LAND AND MARITIME COLUMBUS, OHIO 432183990 David J. Corbett Original date of drawing 29 February 2012 CHECKED BY TITLE Joshua Civiello PR
2、INTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING APPROVED BY Thomas M. Hess SIZE CAGE CODE DWG. NO. 10012 A 16236 REV PAGE 1 OF 9 AMSC N/A 5998E062 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OH 43218-3990
3、SIZE CAGE CODE DWG NO. A 16236 10012 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a family of rigid multilayered printed wiring boards that contain plated through holes. Some design may also have blind vias, buried vias, or a combination of both. Printed wiring boards c
4、onforming to this drawing can be used for qualification to Department of Defense performance specifications. 1.2 Part or Identifying Number (PIN). The complete PIN for the printed wring board shall be in accordance with the detail drawing. A portion of the characters used in the PIN are detailed in
5、section 6.3. 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited
6、 in the solicitation or contract. SPECIFICATIONS DEPARTMENT OF DEFENSE MILD3464 Desiccants, Activated, Bagged, Packaging Use And Static Dehumidification. MILDTL45204 Gold Plating, Electrodeposited. MILPRF22191 Barrier Materials, Transparent, Flexible, Heat-Sealable. MILPRF55110 Printed Wiring Board,
7、 Rigid, General Specification for. MILPRF81705 Barrier Materials, Flexible, Electrostatic Discharge Protective, Heat-Sealable. STANDARDS DEPARTMENT OF DEFENSE MILSTD130 Identification Marking of U.S. Military Property. (Copies of these documents are available online at https:/assist.daps.dla.mil/qui
8、cksearch/ or https:/assist.daps.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 191115094.) 2.1.2 Other Government documents, drawings, and publications. The following other Government documents, drawings, and publications form a part of th
9、is document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DLA Land and Maritime Form 19W PWBQPL Application/Authorization to Test (Copies of Form 19W is available online at http:/www.landandmaritime.dla.mil/
10、Offices/Sourcing_and_Qualification or can be obtained from DLA Land and Maritime, ATTN: VQE, P.O. Box 3990, Columbus, OH 432183990.) 2.2 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these d
11、ocuments are those cited in the solicitation or contract. ASTM INTERNATIONAL (ASTM) ASTM B488 Standard Specification for Electrodeposited Coatings of Gold for Engineering Uses. ASTM B545 Standard Specification for Electrodeposited Coatings of Tin. ASTM B579 Standard Specification for Electrodeposite
12、d Coatings of Tin-Lead Alloy. ASTM D1867 Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring. (Copies of these documents are available online at http:/www.astm.org or should be addressed to ASTM International, P.O. Box C700, 100 Barr Harbor Drive, West Coshohocken, PA 1
13、94282959.) Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OH 43218-3990 SIZE CAGE CODE DWG NO. A 16236 10012 REV PAGE 3 SOCIETY OF AUTOMOTIVE ENGINEERS, INC (SAE) SAEAMSQQN290 Nickel Plating (Electrodeposited). SAEAMS
14、P81728 Plating, TinLead (Electrodeposited). SAEAMS 2418 Copper, Plating. SAEAMS 2403 Nickel Plating (Electrodeposited). SAEAMS 2422 Plating, Gold. (Copies of these documents are available online at http:/www.sae.org or should be addressed to Society of Automotive Engineers, 400 Commonwealth Drive, W
15、arrandale, PA 150960001.) IPC ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES (IPC) IPC2220 Design Standards Series. IPC2221 Printed Board Design, Generic Standard on. IPC4101 Specification for Base Materials for Rigid and Multilayer Printed Boards. IPC4103 Specification for Base Materials for High Sp
16、eed/High Frequency Applications. IPC4552 Electroless Nickel/Immersion Gold Plating for Electronic Interconnections. IPC4553 Specification for Immersion Silver Plating for Printed Circuit Boards. IPC4562 Metal Foil for Printed Board Applications. IPC4563 Resin Coated Copper Foil for Printed Boards Gu
17、ideline. IPC4781 Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Inks. IPCT50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits. IPCD325 Documentation Requirements for Printed Boards, Assemblies, and Support Drawi
18、ngs. IPCD350 Printed Board Description in Digital Form. IPCOI645 Standard for Visual Optical Inspection Aids. IPCSM840 Qualification and Performance Specification of Permanent Solder Mask. IPC9252 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards. JSTD003 Solderability
19、 Tests for Printed Boards. JSTD006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications. JSTD609 Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Pb-Free and Other Attributes. (Copies of these documents
20、 are available online at http:/www.ipc.org or should be addressed to IPC Association Connecting Electronics Industries, 3000 Lakeside Drive, Suite 309 S, Bannockburn, IL 600151249.) (Non-Government standards and other publications are normally available from the organizations which prepare or which
21、distribute the documents. These documents also may be available in or through libraries or other informational services.) 2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text
22、of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 DLA Land and Maritime printed board requirements detail drawing. The individual requirements for the qualification print
23、ed board shall be in accordance with the applicable printed board requirements detail drawing. 3.2 Definitions and terms. The definitions for all terms used herein shall be as specified in IPCT50 and those contained herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without
24、 license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OH 43218-3990 SIZE CAGE CODE DWG NO. A 16236 10012 REV PAGE 4 3.3 Configuration control. The printed wiring board manufacturer shall use only configuration controlled engineering detail drawings, photo tools, or electronic design databases. When
25、applicable, the printed wiring board manufacturer shall be responsible for insuring that the working film used to fabricate the printed wiring board matches the electronic design database provided by DLA Land and Maritime. 3.4 Material. The material for each qualification printed board shall be as s
26、pecified on the applicable printed board requirements detail drawing, or on DLA Land and Maritime Form 19W. Substitute material shall meet the performance requirements of this drawing and the printed board requirements detail drawing. 3.4.1 Reference materials, platings, and processes. The manufactu
27、rers of printed wiring boards supplied to this drawing are allowed to use alternate recognized industry standard materials, coatings, platings, and processes from those specified in this drawing. Alternate materials, platings, and processes used must be coordinated with the qualifying activity as pa
28、rt of the qualification process. Use of alternates to those referenced herein or on the applicable detail drawing by the printed board manufacturer shall not result in inferior short or long term performance or reliability of supplied printed boards as compared with printed boards manufactured using
29、 the referenced materials, coatings, platings, or processes. Short or long term failures or reliability problems due to use of these alternates shall be the responsibility of the printed board manufacturer. 3.4.2 Base materials. Metal clad laminates, unclad laminates, and bonding materials (prepreg)
30、 shall be selected by the printed board manufacturer. The base materials and bonding materials used shall be identified on DLA Land and Maritime Form 19W. 3.4.2.1 Base material PIN designator. The base material designator shall be constructed using the format specified herein. The specifics of the b
31、ase material used shall be listed in the PIN (see 1.2 and 6.3). 3.4.2.2 Certificates of conformance for base materials. The printed wiring board fabricator shall include the base material manufacturers certificates of conformance and lot test results with the deliverable printed wiring boards. 3.4.2
32、.3 Manufacturing lots. All printed boards shall be manufactured using homogeneous manufacturing lots of base materials and bonding materials. If manufacturing lots of metal clad laminate or prepreg materials change within a manufacturing lot of printed boards, the lot of printed wiring boards shall
33、be split and identified with a different lot number in order to maintain traceability of the base materials. 3.4.3 Metal foils. If used, copper foil shall be in accordance with IPC4562. If used, resin coated copper foil shall be in accordance with IPC4563. For either material, the foil type, foil gr
34、ade, foil thickness, bond enhancement treatment, and foil profile shall be selected by the printed board manufacturer in order to meet the performance characteristic being qualified. 3.4.4 Conductor finish. The conductor finish shall be as specified on the applicable printed board requirements detai
35、l drawing and herein. 3.4.4.1 Electroless nickel immersion gold. Electroless nickel immersion gold coating shall be in accordance with IPC4552, or equivalent. Printed boards using electroless nickel immersion gold coating as a conductor finish shall include a suffix “EnG“ in the PIN. 3.4.4.2 Gold (e
36、lectrodeposited). Electrodeposited gold plating shall be in accordance with ASTM B488, MILDTL45204, SAEAMS 2422, or equivalent. The purity and thickness shall be as specified on the applicable printed board requirements detail drawing. Printed boards using electrodeposited gold plating as a conducto
37、r finish shall include a suffix “SAu“ in the PIN. 3.4.4.3 Immersion silver. Immersion silver deposits shall be in accordance with IPC4553 or equivalent. Printed boards using immersion silver deposits as a conductor finish shall include a suffix “IAg“ in the PIN. 3.4.4.4 Tin-lead (electrodeposited).
38、Tin-lead plating conductor finish shall be in accordance with ASTM B579, SAEAMSP81728, or equivalent. The tin-lead plating composition shall be as specified on the applicable printed board requirements detail drawing. The thickness of unfused tin-lead plating shall be as specified in table I. Fused
39、tin-lead plating does not require a thickness measurement. Printed boards using fused tin-lead as a conductor finish shall include a suffix “FPb“ in the PIN. Printed boards using unfused tin-lead as a conductor finish shall include a suffix “UPb“ in the PIN. Provided by IHSNot for ResaleNo reproduct
40、ion or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OH 43218-3990 SIZE CAGE CODE DWG NO. A 16236 10012 REV PAGE 5 3.4.4.5 Solder coating. 3.4.4.5.1 Hot air solder level. The solder used for solder coating shall be in accordance with JSTD006, or equivalent. The ra
41、tio of tin-lead composition of the solder shall be as specified on the applicable printed board requirements detail drawing. Printed boards using solder coating as a conductor finish shall include a suffix “CPb“ in the PIN. 3.4.4.5.2 Fused electrodeposited tin-lead. Fused electrodeposited tin-lead p
42、lating before fusing shall be in compliance with Printed boards using fused solder coating as a conductor finish shall include a suffix “FPb“ in the PIN. 3.4.4.6 Nickel (electrodeposited). Electrodeposited nickel plating shall be in accordance with SAEAMSQQN290, class II, SAEAMS 2403, or equivalent.
43、 Printed boards using electrodeposited nickel plating as a conductor finish shall include a suffix “BNi“ in the PIN. 3.4.4.7 Organic solderability protective (OSP) coatings. OSP coatings shall be in accordance with their vendor. Two types of OPS coatings shall be identified. Printed boards using hig
44、h-temperature OSP coatings as a conductor finish shall include a suffix “HOS“ in the PIN. Printed boards using low-temperature OSP coatings as a conductor finish shall include a suffix “LOS“ in the PIN. TABLE I. Conductor surface finish. PIN designator Description Specification Thickness 1/ e Code 2
45、/ CPb Tin-Lead solder coating JSTD006 Coverage b0 FPb Fused electrodeposited tin-lead ASTM B579 Coverage b3 UPb Unfused electrodeposited tin-lead ASTM B579 or SAEAMSP81728 .003 (.0.08) b3 CAu Electroplated gold for edge board connectors SAEAMS 2422 or MILDTL45204 Coverage b4 SAu Electroplated gold f
46、or areas to be soldered ASTM B488, MILDTL45204, or SAEAMS 2422 Coverage b4 CNi Nickel for edge board connectors SAEAMS 2403 Coverage N/A BNi Nickel as a barrier to copper-tin diffusion SAEAMS 2403 Coverage N/A LOS Low temperature Organic Solderability Preservative N/A Coverage b6 HOS High temperatur
47、e OSP N/A Coverage b6 EnG Electroless nickel / immersion gold IPC4552 Coverage b4 IAg Immersion silver IPC4553 Coverage b2 Dig Direct immersion gold N/A Solderable b4 1/ Dimensions are in inches. Millimeters, in parenthesis, are given for general information only. 2/ These markings and labeling code
48、s represent the codes for surface finish categories established in JSTD609. 3.4.5 Copper plating. Holes with interfacial connections shall be copper plated in accordance with SAEAMS 2418 or equivalent. Thickness requirements shall be in accordance with the detail drawing. 3.4.6 Pure tin. The use of pure tin, as an underplate or final finish, is prohibited both internally and externally. If tin is present, the tin content used as a conductor surface finished or in solder shall not exceed 97 percent by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.4).
