DLA DSCC-DWG-11008-2011 RESISTORS CHIP FIXED CURRENT SENSE ULTRA PRECISION STYLE 2010.pdf

上传人:syndromehi216 文档编号:688715 上传时间:2018-12-30 格式:PDF 页数:7 大小:81.59KB
下载 相关 举报
DLA DSCC-DWG-11008-2011 RESISTORS CHIP FIXED CURRENT SENSE ULTRA PRECISION STYLE 2010.pdf_第1页
第1页 / 共7页
DLA DSCC-DWG-11008-2011 RESISTORS CHIP FIXED CURRENT SENSE ULTRA PRECISION STYLE 2010.pdf_第2页
第2页 / 共7页
DLA DSCC-DWG-11008-2011 RESISTORS CHIP FIXED CURRENT SENSE ULTRA PRECISION STYLE 2010.pdf_第3页
第3页 / 共7页
DLA DSCC-DWG-11008-2011 RESISTORS CHIP FIXED CURRENT SENSE ULTRA PRECISION STYLE 2010.pdf_第4页
第4页 / 共7页
DLA DSCC-DWG-11008-2011 RESISTORS CHIP FIXED CURRENT SENSE ULTRA PRECISION STYLE 2010.pdf_第5页
第5页 / 共7页
点击查看更多>>
资源描述

1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.100 Source control drawing REV STATUS OF PAGES REV PAGES 1 2 3 4 5 6 7 PMIC N/A PREPARED BY Andrew R. Ernst DESIGN ACTIVITY DLA LAND AND MARITIME COLUMBUS, OH 43218-3990 Original date of drawing 11 August 2011 CHECKED BY A

2、ndrew R. Ernst TITLE RESISTORS, CHIP, FIXED, CURRENT SENSE, ULTRA PRECISION, STYLE 2010 APPROVED BY Michael A. Radecki SIZE A CODE IDENT. NO. 037Z3 DWG NO. 11008 REV PAGE 1 OF 7 AMSC N/A 5905-2011-E02 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-D

3、LA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 11008 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for an ultra precision, current sense, chip resistor, style 2010. 1.2 Part or Identifying Number (PIN). The complete PIN is as follows: 11008 - * * Dra

4、wing number Resistance value (see 3.3.1) Tolerance (see 3.3.2) 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for a

5、dditional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Government documents

6、. 2.2.1 Specifications and standards. The following specifications, standards and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the cited in the solicitation or contract (see 6.2). DEPARTMENT OF DE

7、FENSE SPECIFICATION MIL-PRF-55342 - Resistors, Chip, Fixed, Film, Nonestablished Reliability, Established Reliability, Space Level, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-690 - Failure Rate Sampling Plans and Procedures. MIL-STD-790 - Standard Practice for Established Rel

8、iability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Buildi

9、ng 4D, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence. Nothing in this document, however, shall supers

10、ede applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be as specified herein. 3.2 Interface and physical dimensions. The interface and physical dimensions shall be as specified herein (see figu

11、re 1). Passivation is not applicable, however, a protective coating over the element shall be provided. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 11008 REV PAGE 3 L H W D

12、E A B C .206 .015 .029 .004 .104 .010 .019 .010 .019 .010 .120 .255 .060 Inches mm Inches mm Inches mm Inches mm Inches mm .004 0.102 .015 0.38 .029 0.74 .104 2.64 .206 5.23 .010 0.25 .019 0.48 .060 1.50 .120 3.05 .255 6.50 NOTES: 1. Dimensions are in Inches. Metric equivalents are given for general

13、 information only. 2. The pictorial view of the styles above is given as representative of the envelope of the item. Slight deviations from the outline shown, which are contained within the envelope and do not alter the functional aspects of the device, are acceptable. 3. The chip resistors are norm

14、ally mounted with the resistance element face down toward the board. FIGURE 1. Chip resistor. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 11008 REV PAGE 4 3.3 Electrical cha

15、racteristics 3.3.1 Resistance. The nominal resistance expressed in ohms is identified by five digits; an “R” shall be used to represent the decimal point. The succeeding digits of the group represent significant figures. The resistance value designations are shown in table I. TABLE I. Designation of

16、 resistance values. Designation Resistance ohms 0R010 to 1R000 incl. 0.010 to 1.0 incl. 3.3.2 Resistance tolerance. Resistors are available in (F) 1.0 percent, (G) 2.0 percent, (J) 5.0 percent, and (K) 10.0 percent tolerances. 3.3.3 Resistance temperature characteristic. The resistance temperature c

17、haracteristic is in accordance with table II. TABLE II. Resistance temperature characteristic. Resistance range (ohms) Resistance temperature characteristic (ppm/C ) .010 to .025 1000 .026 to .050 500 .050 to .100 300 .100 to 1.00 100 3.3.4 Power rating. The power rating is 1 watt at 70C derated to

18、+150C at zero power (see figure 2). For the maximum power rating the pad and trace area as a minimum shall be 0.155 inch2(100 mm2). FIGURE 2. Derating curve. 3.3.5 Dielectric withstanding voltage. The dielectric withstanding voltage shall not exceed 200 volts. 3.3.6 Termination. The termination mate

19、rial shall be in accordance with MIL-PRF-55342, code letter B. -65 -50 -25 0 25 50 75 100 125 150 175 Temperature (OC) 100 80 60 40 20 0 Percentofrated power70OC -55OC Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OH

20、IO SIZE A CODE IDENT NO. 037Z3 DWG NO. 11008 REV PAGE 5 3.3.7 Operating temperature. Resistors shall have an operating temperature of -55C to +150C. 3.3.8 Pure tin. The use of pure tin, as an underplate or final finish, is prohibited both internally and externally. Tin content of resistor components

21、 and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.3). 3.4 Thermal shock. When resistors are tested as specified in MIL-PRF-55342 for thermal shock the change in resistance shall not exceed 0.5 percent +0.001 ohm. 3.5 DC resistance

22、. When resistors are tested as specified in MIL-PRF-55342 for dc resistance shall be within the specified tolerance of the nominal resistance (see 3.3.1). 3.6 Visual inspection. Resistors are tested as specified in MIL-PRF-55342. 3.7 Solderability. When resistors are tested as specified in MIL-PRF-5

23、5342 for solderability they shall have 95 percent coverage minimum. 3.8 Resistance to solvents. When resistors are tested as specified in MIL-PRF-55342 for resistance to solvents, there shall be no evidence of mechanical damage and the marking shall remain legible. 3.9 Resistance temperature charact

24、eristic. When resistors are tested as specified in MIL-PRF-55342 the RTC shall not exceed the values specified (see 3.3.3). 3.10 Short time overload. When resistors are tested as specified in MIL-PRF-55342 for short time overload the change in resistance shall not exceed 0.5 percent +0.0005 ohm. 3.1

25、1 Solder mounting integrity. When resistors are tested as specified in MIL-PRF-55342 for solder mounting integrity, there shall be no evidence of mechanical damage. 3.12 Marking. Marking is not required on this resistor; however, each waffle pack and each unit package shall be marked with the PIN as

26、signed herein (see 1.2), the manufacturers identification, the date code, and the lot code. At the option of the manufacturer, the resistor may be marked (laser or color dot). The marking shall remain legible after all tests. 3.13 Manufacturer eligibility. To be eligible for listing as a approved so

27、urce of supply, a manufacturer shall be listed on the MIL-PRF-55342 Qualified Products List for at least one part, or perform the group A and group B inspections specified herein on a sample of parts agreed upon by the manufacturer and DLA Land and Maritime-VAT. 3.13.1 Certificate of compliance. A c

28、ertificate of compliance shall be required from manufacturers requesting to be listed as approved sources of supply. 3.14 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided

29、that the material meets or exceeds the operational and maintenance requirements and promotes economically advantageous life cycle costs. 3.15 Workmanship. Resistors shall be processed in such a manner as to be uniform in quality and be free from defects that will affect life, serviceability, or appe

30、arance. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 11008 REV PAGE 6 4. VERIFICATION 4.1 Product assurance program. The product assurance program specified in MIL-PRF-55342

31、and maintained in accordance with MIL-STD-790 is not applicable to this document. 4.2 Qualification inspection. Qualification inspection is not applicable to this document. 4.3 Product level qualification. The product level qualification specified in MIL-PRF-55342 and MIL-STD-690 is not applicable t

32、o this document. 4.4 Conformance inspection. 4.4.1 Inspection of product for delivery. Inspection of product for delivery shall consist of group A inspection (ER level only. PPM reporting, and subgroup 1 are not applicable) and group B inspection of MIL-PRF-55342. 4.4.1.1 Certification. The procurin

33、g activity may accept a certificate of compliance in lieu of Group B inspection. 5. PACKAGING 5.1 Packaging. For acquisition purpose, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor perso

34、nnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activities within the Military Service or Defense Agency, or within the military services system commands. Pac

35、kaging data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not

36、 mandatory.) 6.1 Intended use. Chip resistors are intended to be used in thick or thin film circuits where microcircuitry is intended, also, for use in surface mounting application. 6.2 Ordering data. The contract or purchase order should specify the following: a. Complete PIN (see 1.2). b. Requirem

37、ents for delivery: One copy of the conformance inspection data or a certificate of compliance that parts have passed conformance inspection with each shipment of parts by the manufacturer. c. Requirements for packaging and packing (see 5.1). d. Whether the manufacturer performs the group B tests or

38、provides certification of compliance with group B requirements (see 4.4.1.1). 6.3 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture a

39、nd can develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For additional i

40、nformation on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 11008 REV PAGE 7 6.4

41、 Tolerance caution. Soldering temperature used during installation may cause resistance to shift up to 0.5 milliohm. 6.5 Mounting. Resistors are mounted film side down to minimize termination resistance. 6.6 Electrostatic charge. Under several combinations of conditions, these resistors can be elect

42、rically damaged, by electrostatic charges, and drift from specified value. Users should consider this phenomena when ordering or shipping resistors. Direct shipment to the Government is controlled by MIL-DTL-39032 that specifies a preventive packaging procedure. 6.7 Pulse applications. Designers are

43、 CAUTIONED on using the above resistors in high power pulse applications. Since they have not been qualified nor tested for such applications, damage and premature failure are possible. These resistors only see a onetime pulse (Short-time overload) as part of the group B inspection of MIL-PRF-55342.

44、 6.8 User of record. Coordination of this document for future revisions is coordinated only with the approved source of supply and the users of record of this document. Requests to be added as a recorded user of this drawing may be achieved online at resistordla.mil or in writing to: DLA Land and Ma

45、ritime-VAT, Post Office Box 3990, Columbus, OH 43218-3990 or by telephone (614) 692-0552 or DSN 850-0552. 6.9 Approved source of supply. Approved source of supply is listed herein. Additional sources will be added as they become available. Assistance in the use of this drawing may be obtained online

46、 at resistordla.mil or contact DLA Land and Maritime-VAT, Post Office Box 3990, Columbus, OH 43218-3990 or by telephone (614) 692-0552 or DSN 850-0552. DLA Land and Maritime drawing PIN Vendor similar designation or type number 1/ Vendor CAGE Vendor name and address 11008-* TFS-2010-NNNN-T-VS4611 57

47、027 IRC Advanced Film Division 4222 South Staples Street Corpus Christi, TX 78411 1/ Parts must be purchased to the DLA Land and Maritime PIN to assure that all performance requirements and tests are met. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-

展开阅读全文
相关资源
猜你喜欢
  • ASTM D1200-2010(2014) Standard Test Method for Viscosity by Ford Viscosity Cup《采用福特粘度杯的粘度标准试验方法》.pdf ASTM D1200-2010(2014) Standard Test Method for Viscosity by Ford Viscosity Cup《采用福特粘度杯的粘度标准试验方法》.pdf
  • ASTM D1201-1999(2004) Standard Specification for Thermosetting Polyester Molding Compounds《热固聚酯模制化合物的标准规范》.pdf ASTM D1201-1999(2004) Standard Specification for Thermosetting Polyester Molding Compounds《热固聚酯模制化合物的标准规范》.pdf
  • ASTM D1201-1999(2012) Standard Specification for Thermosetting Polyester Molding Compounds《热固聚酯模制化合物的标准规格》.pdf ASTM D1201-1999(2012) Standard Specification for Thermosetting Polyester Molding Compounds《热固聚酯模制化合物的标准规格》.pdf
  • ASTM D1201-2013 Standard Specification for Thermosetting Polyester Molding Compounds《热固聚酯模制化合物的标准规格》.pdf ASTM D1201-2013 Standard Specification for Thermosetting Polyester Molding Compounds《热固聚酯模制化合物的标准规格》.pdf
  • ASTM D1203-1994(2003) Standard Test Methods for Volatile Loss From Plastics Using Activated Carbon Methods《用活性碳法测定塑料的挥发损失的标准试验方法》.pdf ASTM D1203-1994(2003) Standard Test Methods for Volatile Loss From Plastics Using Activated Carbon Methods《用活性碳法测定塑料的挥发损失的标准试验方法》.pdf
  • ASTM D1203-2010 Standard Test Methods for Volatile Loss From Plastics Using Activated Carbon Methods《用活性碳法测定塑料的挥发损失的标准试验方法》.pdf ASTM D1203-2010 Standard Test Methods for Volatile Loss From Plastics Using Activated Carbon Methods《用活性碳法测定塑料的挥发损失的标准试验方法》.pdf
  • ASTM D1203-2016 Standard Test Methods for Volatile Loss From Plastics Using Activated Carbon Methods《采用活性炭法测定塑料挥发性损失的标准试验方法》.pdf ASTM D1203-2016 Standard Test Methods for Volatile Loss From Plastics Using Activated Carbon Methods《采用活性炭法测定塑料挥发性损失的标准试验方法》.pdf
  • ASTM D1204-2007 Standard Test Method for Linear Dimensional Changes of Nonrigid Thermoplastic Sheeting or Film at Elevated Temperature《升温非硬性热塑塑料薄板或薄膜线性尺寸变化的标准试验方法》.pdf ASTM D1204-2007 Standard Test Method for Linear Dimensional Changes of Nonrigid Thermoplastic Sheeting or Film at Elevated Temperature《升温非硬性热塑塑料薄板或薄膜线性尺寸变化的标准试验方法》.pdf
  • ASTM D1204-2008 Standard Test Method for Linear Dimensional Changes of Nonrigid Thermoplastic Sheeting or Film at Elevated Temperature《高温点非刚硬性热塑料板或薄膜线性尺寸变化的标准试验方法》.pdf ASTM D1204-2008 Standard Test Method for Linear Dimensional Changes of Nonrigid Thermoplastic Sheeting or Film at Elevated Temperature《高温点非刚硬性热塑料板或薄膜线性尺寸变化的标准试验方法》.pdf
  • 相关搜索

    当前位置:首页 > 标准规范 > 国际标准 > 其他

    copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
    备案/许可证编号:苏ICP备17064731号-1