1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Change minimum resistance. Change dimension. Change vendors part number 23 FEB 93 D Moore B Dimension changes to figure 1. Editorial changes throughout 11 DEC 97 D. Moore C Inspection change. Editorial comments throughout 19 JUN 03 K. Cottongim D Pure tin P
2、rohibition. Update to present DoD policy requirements. Editorial changes throughout 8 MAY 09 M. Radecki CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 DEFENSE LOGISTICS AGENCY DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.100 Source control drawing REV STATU
3、S OF PAGES REV D D D D D D D D PAGES 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY Allan R. Knox DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OH 45444-5000 Original date of drawing 10 January 1990 CHECKED BY David E. Moore TITLE RESISTOR, FIXED, WIREWOUND, SURFACE MOUNT, POWER TYPE (2.5 WATTS) APPROVED BY David
4、 E. Moore SIZE A CODE IDENT. NO. 14933 DWG NO. 89040 REV D PAGE 1 OF 8 AMSC N/A 5905-E635Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 89040 REV D PAGE 2 1. SCOPE 1.
5、1 Scope. This drawing describes the requirements for a surface mounted, fixed power type, wirewound and low value shunt wire resistor. Resistance values above 0.1 ohm consist of a wire wound type construction using a supportive ceramic core that requires a metal cap for the core ends. For 0.1 ohm an
6、d lower the resistance material supports itself and a capped core is not used. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 89040 - * Drawing number Resistance value (see 3.3.1) 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications and
7、 standards. The following specifications, standards and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the cited in the solicitation or contract (see 6.2). DEPARTMENT OF DEFENSE SPECIFICATION MIL-PR
8、F-39007 - Resistors, Fixed, Wire Wound, (Power Type), Nonestablished Reliability, Established Reliability, And Space Level, General Specification For. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Test Methods for Standard Electronic and Electrical Component Parts. MIL-STD-690 - Failure Rate Samplin
9、g Plans and Procedures. MIL-STD-790 - Standard Practice for Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications. MIL-STD-1285 - Marking of Electrical and Electronic Parts. * (Copies of these documents are
10、 available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-government publications. The following documents form a part of this document to the extent specified herein. Unless oth
11、erwise specified the issues of the documents cited in the solicitation or contract. UNDERWRITERS LABORATORIES (UL) UL94-O - Tests for Flammability of Plastic Materials for parts in Devices and Appliances. * (Copies of this document are available online at http:/ or from the Underwriters Laboratories
12、, Inc., 333 Pfingsten Road, Northbrook, IL 60062-2096.) Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 89040 REV D PAGE 3 (Non-Government standards and other publicat
13、ions are normally available from the organization that prepares or distributes the documents. These documents also may be available in or through libraries or other informational services.) * 2.3 Order of precedence. Unless otherwise noted herein or in the event of a conflict between the text of thi
14、s document and the references cited herein (except for related specification sheets), the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The in
15、dividual item requirements shall be as specified herein. 3.2 Interface and physical dimensions. The interface and physical dimensions shall be as specified in MIL-PRF-39007 and herein (see figure 1). 3.3 Electrical characteristics. 3.3.1 Resistance value designation. Resistance value designation sha
16、ll be in accordance with MIL-PRF-39007. 3.3.2 Resistance. The resistance range shall be from 0.01 ohms to 7,320 ohms. 3.3.3 Resistance tolerance. Resistors are available in (F) 1 percent. 3.3.4 Power rating. The power rating shall be 2.5 watts at +25OC. For operation at temperatures greater than +25
17、OC derated in accordance with figure 2. The upper temperature used will be +125OC. 3.3.5 Voltage rating. The maximum continuous working voltage shall not exceed 350 volts. Resistors shall have a rated direct current (dc) continuous working voltage, or an approximate sine wave root mean square (rms)
18、continuous working voltage at commercial line frequency and waveform corresponding to the power rating, determined from the following formula: )PR(E = Where: E = Continuous rated dc or rms ac working voltage in volts. P = Power rating (see 3.1). R = Nominal resistance (see 3.1). Provided by IHSNot f
19、or ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 89040 REV D PAGE 4 Inches mm Inches mm Inches mm Inches mm Inches mm Inches mm 0.001 0.03 0.010 0.25 0.030 0.76 0.120 3.05 0.273 6.93 0.811
20、 20.60 0.005 0.13 0.012 0.30 0.062 1.57 0.143 3.63 0.276 7.01 0.846 21.49 0.006 0.15 0.015 0.38 0.093 2.36 0.268 6.81 0.572 14.53 NOTES: 1. Dimensions are in inches, metric equivalents are given for general information only. 2. Plastic dimensions only. See view B for terminal spring out dimension. F
21、IGURE 1. Resistor, fixed, wire wound, surface mount. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 89040 REV D PAGE 5 FIGURE 2. Derating cures for high ambient tempe
22、ratures. 3.3.6 Resistance temperature coefficient. The resistance temperature coefficient shall be as follows: Resistance range in ohms ppm/OC 0.01 to 0.05 300 0.05 to 0.10 180 0.10 to 1.00 90 1.00 to 10.00 50 10.00 and over 20 The upper temperature for the resistance temperature coefficient (TCR) s
23、hall be 125OC. 3.3.7 Flammability rating. The flammability rating for resistors shall be Underwriters Laboratories UL94-O. 3.3.8 Thermal cycling. When resistors are tested as specified in 4.6, there shall be no evidence of mechanical damage. The maximum change in resistance shall not exceed 0.2 perc
24、ent +0.005 ohm. 3.3.9 Conditioning. When resistors are tested as specified in 4.9, there shall be no mechanical damage. The maximum change in resistance shall not exceed 0.2 percent +0.005 ohm. 3.3.10 Load life. When resistors are tested as specified in 4.7, there shall be no mechanical damage. The
25、maximum change in resistance shall not exceed 0.5 percent +0.05 ohm. 3.3.11 Overload. When resistors are tested as specified in 4.8, there shall be no mechanical damage. The maximum change in resistance shall not exceed 0.2 percent +0.05 ohm. 3.3.12 Solderability. When resistors are tested as specif
26、ied in 4.10, there shall be no mechanical damage. The total surface area of the dipped part of the termination is at least 95 percent covered by a continuous new solder coating. Pin holes, voids, porosity, nonwetting, or dewetting shall not be concentrated in one area and shall not exceed 5 percent
27、of the total termination area. The area of the surface to be tested shall include the total metallized areas of both terminations except the upper 1/3 of the lead between the J bend at the circuit board contact point and the lead egress from the molded body. In case of a dispute, the percentage of c
28、overage with pinholes or voids shall be determined by actual measurement of these areas, as compared to the total area. * 3.3.12.1 Pure tin. The use of pure tin, as an underplate or final finish, is prohibited both internally and externally. Tin content of resistor components and solder shall not ex
29、ceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.3). -65 -50 -25 0 25 50 75 100 125 150 175 Temperature (OC) 100 80 60 40 20 0 Percentofrated powerProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE
30、ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 89040 REV D PAGE 6 3.3.13 High temperature exposure. When resistors are tested as specified in 4.11, there shall be no mechanical damage. The maximum change in resistance shall not exceed 0.5 percent +0.005 ohm. 3.4 Marking.
31、Marking shall be in accordance with MIL-STD-1285, except the PIN shall be as specified in 1.2 with manufacturers CAGE code and date and lot codes. * 3.5 Manufacturer eligibility. To be eligible for listing as a approved source of supply, a manufacturer shall be listed on the MIL-PRF-39007 Qualified
32、Products List for at least one part, or perform the group A and group B inspections specified herein on a sample agreed upon by the manufacturer and DSCC-VA. * 3.5.1 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be an approved source of sup
33、ply. 3.6 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferred materials should be used to the maximum extent possible provided that the materials meets or exceeds the operational and maintenance requirements, and promotes economically advant
34、ageous life cycle costs. 3.7 Workmanship. Resistors shall be processed in such a manner as to be uniform in quality and be free from defects that will affect life, serviceability, or appearance. 4. VERIFICATION 4.1 Product assurance program. The product assurance program specified in MIL-PRF-39007 a
35、nd maintained in accordance with MIL-STD-790 is not applicable to this document. 4.2 Qualification inspection. Qualification inspection is not applicable to this document. 4.3 Product level qualification. The product level qualification specified in MIL-PRF-39007 and MIL-STD-690 is not applicable to
36、 this document. 4.4 Conformance inspection. 4.4.1 Inspection of product for delivery. Inspection of product for delivery shall consist of group A inspection (ER level) and group B inspection of MIL-PRF-39007. The solderability group A test may be performed immediately after the final plating operati
37、on instead of as the final group A inspection. 4.4.2 Certification. The procuring activity may accept a certificate of compliance in lieu of group B inspection. 4.5 Inspection of packaging. Inspection of packaging shall be in accordance with MIL-PRF-39007. 4.6 Thermal cycling. Resistors shall be tes
38、ted in accordance with MIL-PRF-39007 and the following exceptions shall apply: Test condition B-3 of method 107 of MIL-STD-202. 4.7 Load life. Resistors shall be tested in accordance with MIL-PRF-39007 and the following exceptions shall apply: 1,000 hours at maximum load at +25OC. 4.8 Overload Resis
39、tors shall be tested in accordance with MIL-PRF-39007 and the following exceptions shall apply: 5.00 x 2.5 watts for 5 seconds. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933
40、 DWG NO. 89040 REV D PAGE 7 4.9 Conditioning. Resistors shall be conditioned per MIL-PRF-39007 and the following exceptions shall apply: 100 hours cycled at 100 percent rated power. 4.10 Solderability. Solderability shall be in accordance with method 208 of MIL-STD-202 and the following details shal
41、l apply: a. Application of flux: Flux, type R, shall be used. Terminations shall be immersed in the flux, which is at room temperature, to the minimum depth necessary to cover the surface to be tested. The terminations shall be completely immersed by individually dipping each termination. The termin
42、ations to be tested shall be immersed in the flux for a period of 5 to 10 seconds. b. Solder dip: The dross and burned flux shall be skimmed from the surface of the molten solder (may not require separate operation in wave or flow pot). The molten solder shall be maintained at a uniform temperature
43、of +245OC 5OC. The surface of the molten solder shall be skimmed again prior to immersing the terminations in solder. The part shall be attached to a dipping device and the flux-covered terminations immersed in molten solder to depth, and in the same manner specified in 4.10a. After the dipping proc
44、ess, the part shall be allowed to cool in air. Residual flux shall be removed from the terminations by rinsing in a suitable solvent. If necessary, a soft cloth or cotton swab moistened with clean 91 percent isopropyl alcohol shall remove all remaining flux. c. Examination of termination: After each
45、 dip-coat termination has been thoroughly cleaned of flux, the terminations shall be examined using a magnification between 10X and 20X. In cases of dispute the magnification defined by the Method 208 of MIL-STD-202 shall be used. 4.11 High temperature exposure. Resistors shall be tested in accordan
46、ce with MIL-PRF-39007 and following exception shall apply: 10 days at +125OC 5. PACKAGING 5.1 Packaging. For acquisition purpose, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel
47、, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activities within the Military Service or Defense Agency, or within the military services system commands. Packagi
48、ng data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not man
49、datory.) 6.1 Intended use. Chip resistors are intended to be used in thick or thin film circuits where microcircuity is intended, also, for use in surface mounting application. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDE
