1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Changes in accordance with NOR 5905-R012-95. 21 Oct 1994 D. Moore B Changes in accordance with NOR 5905-R018-95 30 Oct 1995 D. Moore C 3.3.10, Overload: When resistors are tested as specified in 4.8, there shall be no evidence of mechanical damage. The maxi
2、mum change in resistance shall not exceed (.2 percent +.05 ohm). 9 Apr 1996 D. Moore D Changes to paragraphs 3.3.2, 3.3.3, 3.3.10, and 4.8. Deleted paragraph 3.3.6 Voltage rating. Editorial changes throughout. 8 Jul 1997 D. Moore E Changes in accordance with NOR 5905-R002-98. 3 Apr 1998 D. Moore F U
3、pdate and validation of drawing. Editorial changes throughout. 3 Dec 2003 K. Cottongim G Add thermoplastic encapsulation. Add pure tin prohibition paragraph. Editorial changes throughout. 30 Oct 2006 M. Radecki H Changes in accordance with NOR 5905-E639. 12 Dec 2006 M. Radecki J The epoxy encapsulat
4、ion is obsolete and is superseded by thermoplastic encapsulation with lead frame. Editorial changes throughout. 14 Apr 2010 M. Radecki Epoxy encapsulation is obsolete and is superseded by thermoplastic encapsulation with lead frame. CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 DEFENSE LOGISTICS AGENCY DE
5、FENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Prepared in accordance with AMSE Y14.100 Source control drawing REV STATUS REV J J J J J J OF PAGES PAGES 1 2 3 4 5 6 PMIC N/A PREPARED BY HERALDINE JOHNSON DEDIGN ACTIVITY: DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO 45444-5000 Original date
6、 of drawing 11 July 1994 CHECKED BY ANDREW ERNST TITLE RESISTOR, FIXED, WIREWOUND, SURFACE MOUNT, POWER TYPE (1 WATT) APPROVED BY DAVID E. MOORE SIZE A CODE IDENT. NO. 14933 DWG NO. 93076 REV J PAGE 1 OF 6 AMSC N/A 5905-E736 Provided by IHSNot for ResaleNo reproduction or networking permitted withou
7、t license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO: 93076 REV J PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a 1 watt, fixed, surface mounted, wirewound, power type resistor. 1.2 Part or Identifying Number (PIN). The comp
8、lete PIN is as follows: 93076 * * * I I I I I I I I Drawing Resistance value Tolerance Encapsulation number (see 3.3.1, 3.3.2) (see 3.3.3) style (see 3.3.4) 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and
9、handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-39007 - Resistors, Fixed, Wirewound (Power Type), Nonestablished Reliability,
10、 Established Reliability, and Space Level, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Test Methods for Electronic and Electrical Component Parts. MIL-STD-690 - Failure Rate Sampling Plans and Procedures. MIL-STD-790 - Established Reliability and High Reliability Qualifi
11、ed Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications. MIL-STD-1285 - Marking of Electrical and Electronic Parts. * (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 70
12、0 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) * 2.2 Order of precedence. Unless otherwise noted herein or in the event of a conflict between the text of this document and the references cited herein (except for related specification sheets), the text of this document takes precedence.
13、 Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-39007 and as specified herein. 3.2 Interface and physical dimensio
14、ns. Resistors shall meet the interface and physical dimensions as specified in MIL-PRF-39007 and herein (see figure 1). 3.3 Electrical characteristics. 3.3.1 Resistance value designation. Resistance value designations shall be in accordance with MIL-PRF-39007. 3.3.2 Resistance. The resistance range
15、shall be .1 ohm to 2.5 kilohms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO: 93076 REV J PAGE 3 Dimensions A B C D E F G (6.05 .127) .238 .005 (6.35 .508) .250 .020
16、(1.14 .254) .045 .010 (2.79 .381) .110 .015 (2.64 .127) .104 .005 (3.81 .127) .150 .005 (2.49 .127) .098 .005 NOTES: 1. Dimensions are in inches, millimeters are in parentheses. 2. Inch equivalents are given for general information only. FIGURE 1. Resistor, fixed, wirewound, surface mount. 3.3.3 Res
17、istance tolerance. Resistance tolerances are available in (D) 0.5 percent (for values above 1 ohm), (F) 1 percent, (H) 3 percent, and (J) 5 percent. * 3.3.4 Encapsulation. The encapsulation shall be in accordance with table I. TABLE I. Encapsulation. Style Encapsulation (blank) A Thermoplastic with
18、lead frame Thermoplastic with swaged lead 3.3.5 Power rating. The power rating shall be 1 watt at +70C. For operation at temperatures greater than +70C, derate in accordance with figure 2. * 3.3.6 Resistance temperature coefficient. The resistance temperature coefficient shall be as follows: Style (
19、blank) encapsulation Style A encapsulation 0.1 ohm to 0.99 ohm-90 ppm/C 0.1 ohm to 0.3 ohm-150 ppm/C 1.0 ohm to 9.9 ohm-50 ppm/C 0.31 ohm to 0.99 ohm-90 ppm/C 10 ohms and over -20 ppm/C 1.0 ohm to 9.9 ohm-50 ppm/C 10 ohms and over -20 ppm/C 3.3.7 Thermal shock. When resistors are tested as specified
20、 in 4.6, there shall be no evidence of mechanical damage. The maximum change in resistance shall not exceed (0.2 percent +0.05 ohm). 3.3.8 Load life. When resistors are tested as specified in 4.7, there shall be no evidence of mechanical damage. The maximum change in resistance shall not exceed (0.5
21、 percent +0.05 ohm). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO: 93076 REV J PAGE 4 * FIGURE 2. Derating curves for high ambient temperatures. 3.3.9 Overload. When
22、resistors are tested as specified in 4.8, there shall be no evidence of electrical or mechanical damage. The maximum change in resistance shall not exceed (0.2 percent + 0.005 ohm). 3.3.10 Solderability. The total surface area of the dipped part of the termination is at least 95 percent covered by a
23、 continuous new solder coating. Pin holes, voids, porosity, nonwetting, or dewetting shall not be concentrated in one area and shall not exceed 5 percent of the total termination area. The area of the surface to be tested shall include the total metalized areas of both terminations within .3125 inch
24、 (7.938 mm) of the bottom contact point of the “J“ bend. In case of a dispute, the percentage of coverage with pinholes or voids shall be determined by actual measurement of these areas, as compared to the total area. 3.3.11 High temperature exposure. When resistors are tested as specified in 4.10,
25、there shall be no evidence of mechanical damage. The maximum change in resistance shall not exceed (0.5 percent +0.05 ohm). 3.4 Marking. Marking shall be as shown: 93076 (DSCC drawing number) 1R00FA (resistance value, tolerance and encapsulation) XXXXX (CAGE code) 3.5 Pure tin. The use of pure tin,
26、as an underplate or final finish is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.3). 3.6 Recycled, recovered, or environmentally preferable material
27、s. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. * 3.7 Manufacturer eligibility. To be eligi
28、ble for listing as an approved source of supply, a manufacturer shall be listed on the MIL-PRF-39007 Qualified Products List for at least one part, or perform the group A and group B inspections specified herein on a sample agreed upon by the manufacturer and DSCC-VA. * 3.7.1 Certificate of complian
29、ce. A certificate of compliance shall be required from manufacturers requesting to be listed as an approved source of supply (see 6.2d). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT N
30、O. 14933 DWG NO: 93076 REV J PAGE 5 3.8 Workmanship. The resistor shall be uniform in quality and free from any defects that will affect life, serviceability, or appearance. 4. VERIFICATION 4.1 Qualification inspection. Qualification inspection is not applicable to this document. 4.2 Reliability ass
31、urance program. The reliability assurance program specified in MIL-PRF-39007 and maintained in accordance with MIL-STD-790 is not applicable to this document. 4.3 Failure rate qualification. Failure rate qualification specified in MIL-PRF-39007 and MIL-STD-690 is not applicable to this document. 4.4
32、 Conformance inspection. Conformance inspection shall consist of group A (ER level) and group B inspections of MIL-PRF-39007. Group A, subgroup 1 conditioning will not be performed. 4.4.1 Certification. The activity, at its discretion, may accept a certificate of compliance with group B requirements
33、 in lieu of performing group B tests (see 6.2d). 4.5 Inspection of packaging. Inspection of packaging shall be in accordance with MIL-PRF-39007. 4.6 Thermal shock. Resistors shall be tested in accordance with MIL-PRF-39007 and the following exception shall apply: Mounting of test samples shall be on
34、 surface mount test cards, and Method 107 of MIL-STD-202, test condition B-3. 4.7 Load life. Resistors shall be tested in accordance with MIL-PRF-39007 and the following exception shall apply: Mounting of test samples shall be on surface mount test cards, and 1,000 hours at maximum load at +25C. 4.8
35、 Overload. Resistors shall be tested in accordance with MIL-PRF-39007 and the following exception shall apply: Mounting of test samples shall be on surface mount test cards, and Overload testing will be performed at 5 times rated power for 5 seconds. 4.9 Solderability. Solderability shall be in acco
36、rdance with method 208 of MIL-STD-202 and the following details shall apply: a. Application of flux: Type R shall be used. Terminations shall be immersed in the flux, which is at room temperature, to the minimum depth necessary to cover the surface to be tested. The terminations shall be completely
37、immersed by individually dipping each termination. The terminations to be tested shall be immersed in the flux for a period of 5 seconds to 10 seconds. b. Solder dip: The dross and burned flux shall be skimmed from the surface of the molten solder (may not require separate operation in wave or flow
38、pot). The molten solder shall be maintained at a uniform temperature of +245C 5C. The surface of the molten solder shall be skimmed again prior to immersing the terminations in the solder. The part shall be attached to a dipping device and the flux-covered terminations immersed in molten solder to t
39、he depth, and in the same manner specified in 4.9a. After the dipping process, the part shall be allowed to cool in air. Residue flux shall be removed from the terminations by rinsing in a suitable solvent. If necessary, a soft cloth or cotton swab moistened with clean 91 percent isopropyl alcohol s
40、hall remove all remaining flux. c. Examination of terminations: After each dip-coated termination has been thoroughly cleaned of flux, the terminations shall be examined under a magnification between 10X and 20X. 4.10 High temperature exposure. Resistors shall be tested in accordance with MIL-PRF-39
41、007 and the following exception shall apply: Mounting of test samples shall be on surface mount test cards, and 250 hours at +125C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14
42、933 DWG NO: 93076 REV J PAGE 6 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the respons
43、ible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activity within the Military Department or Defense Agency, or within the military services system commands. Packaging data retrieval is available from the mana
44、ging Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Intended use. Surface mount res
45、istors are used in electronic circuits where space is a major concern. 6.2 Ordering data. The contract or purchase order should specify the following: a. Complete PIN (see 1.2). b. Requirements for delivery: One copy of the conformance inspection data or certification of compliance that parts have p
46、assed conformance inspection with each shipment of parts by the manufacturer. c. Requirements for packaging and packing. d. Whether the manufacturer performs the group B tests or provides certification of compliance with group B requirements (see 4.4.1). 6.3 Tin whisker growth. The use of alloys wit
47、h tin content greater than 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top
48、 of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin). * 6.4 User of record. Coordination of this document for future revisions is coordinated only with the approved source of supply and the users of record of this document. Requests to be added as a recorded user of this drawing may be achieved online at re
