1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Update the boilerplate paragraphs. - ro 09-02-19 R. HEBER Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV A A A A A A A A A A A A REV STATUS OF PAGES PAGE 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY RICK OFFICER DEFENSE
2、 SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing YY-MM-DD CHECKED BY TOM HESS APPROVED BY RAYMOND MONNIN TITLE MICROCIRCUIT, LINEAR, PRECISION LOW DROPOUT CONTROLLER, MONOLITHIC SILICON SIZE A CODE IDENT. NO. 16236 DWG NO. V62/03633 03-05-27 REV A PAGE 1 OF 12 AMSC N/A 5962
3、-V035-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03633 REV A PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performan
4、ce precision low dropout linear controller microcircuit, with an operating temperature range of -40C to +105C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identify
5、ing the item on the engineering documentation: V62/03633 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 UC2832-EP Precision low dropout linear controller 1.2.2 Case outline(s). The case ou
6、tline(s) are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 16 MS-013 Plastic surface mount 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture: Finish designator Material A Hot solder dip B Tin-l
7、ead plate C Gold plate D Palladium E Gold flash palladium Z Other 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage (VIN) . 40 V Driver output current (sink or source) (IO) 450 mA Driver sink to source voltage 40 V TRC pin voltage . -0.3 V to 3.2 V Other input voltages . -0.3 V to supply voltage Op
8、erating junction temperature range (TJ) . -55C to +150C Storage temperature range (TSTG) -65C to +150C Lead temperature soldering 1.6 mm (1/16 inch) from case for 10 seconds +300C 1/ Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stre
9、ss ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2/ Unless otherwise indicated, vo
10、ltages are reference to ground and currents are positive into and negative out of the specified terminals. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03633 RE
11、V A PAGE 3 1.4 Recommended operating conditions. 3/ Supply voltage (VIN) . 15 V Ambient operating temperature range (TA) -40C to +105C 2. APPLICABLE DOCUMENTS JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices (Applications for copies should be addressed to the Electronic Indust
12、ries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 ide
13、ntifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristic
14、s are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The
15、 terminal connections shall be as shown in figure 2. 3.5.3 Logic diagram. The logic diagram shall be as shown in figure 3. _ 3/ Use of this product beyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or
16、liability for product used beyond the stated limits. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03633 REV A PAGE 4 TABLE I. Electrical performance characteris
17、tics. Limits Test Symbol Conditions 1/Temperature, TADevice type Min Max Unit Input supply section Supply current IIN+VIN= 6 V -40C to +105C 01 10 mA +VIN= 36 V 15 Logic disable = 2 V 10 Reference section Output voltage VOUTIDRIVER= 10 mA TJ= +25C 01 1.98 2.02 V TJ= -40C to +105C 1.96 2.04 Load regu
18、lation voltage VLDIOUT= 0 mA to 10 mA -40C to +105C 01 -10 10 mV Line regulation voltage VLN+VIN= 4.5 V to 36 V, IDRIVER= 10 mA -40C to +105C 01 0.5 mV/V Under-voltage lockout threshold UVLO -40C to +105C 01 4.5 V Logic disable input section Threshold voltage VTH-40C to +105C 01 1.3 1.5 V Input bias
19、 current IIBLogic disable pin = 0 V -40C to +105C 01 -5.0 0.1 A Current sense section VOSTJ= +25C 01 95 105 mV Comparator offset voltage TJ= -40C to +105C 93 107 Amplifier offset voltage VOSVADJ= open -40C to +105C 01 110 170 mV VADJ= 1 V 180 290 VADJ= 0 V 250 360 See footnotes at end of table.Provi
20、ded by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03633 REV A PAGE 5 TABLE I. Electrical performance characteristics continued. Limits Test Symbol Conditions 1/Temperatur
21、e, TADevice type Min Max Unit Current sense section - continued Input bias current IIBVCM= +VIN-40C to +105C 01 65 135 A Input offset current IIOVCM= +VIN-40C to +105C 01 -10 10 A Amplifier CMRR VCM= 4.1 V to +VIN+ 0.3 V -40C to +105C 01 80 typical dB Transconductance ICOMP= 100 A -40C to +105C 01 6
22、5 typical ms VADJinput current VADJ= 0 V -40C to +105C 01 -10 A Timer section Inactive leakage current IILC/S(+) = C/S(-) = +VIN, TRC pin = 2 V -40C to +105C 01 1.0 A Active pullup current IAPC/S(+) = +VIN, C/S(-) = +VIN 0.4 V, TRC pin = 0 V -40C to +105C 01 -345 -175 A Duty ratio 2/ On time / perio
23、d, RT= 200 k, CT= 0.27 F -40C to +105C 01 4.8 typical % Period 2/ 3/ On time + off time, RT= 200 k, CT= 0.27 F -40C to +105C 01 36 typical ms Upper trip threshold VU-40C to +105C 01 1.8 typical V Lower trip threshold VL-40C to +105C 01 0.9 typical V Trip threshold ratio VU/ VL-40C to +105C 01 2.0 ty
24、pical V/V Error amplifier section Input offset voltage VIOVCM= VCOMP= 2 V -40C to +105C 01 -8.0 8.0 mV Input bias current IIBVCM= VCOMP= 2 V -40C to +105C 01 -4.5 A Input offset current IIOVCM= VCOMP= 2 V -40C to +105C 01 -1.5 1.5 A See footnotes at end of table. Provided by IHSNot for ResaleNo repr
25、oduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03633 REV A PAGE 6 TABLE I. Electrical performance characteristics continued. Limits Test Symbol Conditions 1/Temperature, TADevice type Min Max Unit E
26、rror amplifier section continued. Open loop voltage gain AVOLVCOMP= 1 V to 13 V -40C to +105C 01 50 dB Common mode rejection ratio CMRR VCM= 0 V to +VIN 3 V -40C to +105C 01 60 dB Power supply rejection ratio PSRR VCM= 2 V, +VIN= 4.5 V to 36 V -40C to +105C 01 90 typical dB Transconductance ICOMP= 1
27、0 A -40C to +105C 01 4.3 typical ms High level output voltage VOHICOMP= 0, volts below +VIN-40C to +105C 01 1.3 V Low level output voltage VOLICOMP= 0 -40C to +105C 01 0.7 V Output high current IOHVCOMP= 2 V -40C to +105C 01 -700 -100 A Output low current IOLVCOMP= 2 V, C/S(-) = +VIN-40C to +105C 01
28、 100 700 A VCOMP= 2 V, C/S(-) = +VIN 0.4 V 2 mA Driver section Maximum current IMAXTJ= +25C 01 200 400 mA Driver limit and source pins common TJ= -40C to +105C 100 450 Limiting voltage Driver limit to source 4/ voltage at current limit, ISOURCE= -10 mA TJ= +25C 01 0.72 typical V Internal current sen
29、se resistance 4/ TJ= +25C 01 2.4 typical See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03633 REV A PAGE 7 TABLE I. Electrical perf
30、ormance characteristics continued. Limits Test Symbol Conditions 1/Temperature, TADevice type Min Max Unit Driver section continued. Pull-up current at driver sink IPUCOMP/SHUTDOWN = 0.4 V, driver sink = +VIN 1 V -40C to +105C 01 -800 -100 A COMP/SHUTDOWN = 0.4 V, +VIN= 36 V, driver sink = 35 V -100
31、0 -75 Pull-down current at driver source IPDCOMP/SHUTDOWN = 0.4 V, driver source = 1 V -40C to +105C 01 150 700 A Saturation voltage sink to source Driver source = 0 V, driver current = 100 mA -40C to +105C 01 1.5 typical V Maximum source voltage Driver sink = +VIN, volts below +VIN, driver current
32、= 100 mA -40C to +105C 01 3 typical V Under voltage lock out sink leakage +VIN= C/S(+) = C/S(-) = 2.5 V, driver sink = 15 V, driver source = 0 V +25C 01 25 typical A Maximum reverse source voltage COMP/SHUTDOWN = 0 V, ISOURCE= 100 A, (+)VIN= 3 V -40C to +105C 01 1.6 typical V Thermal shutdown -40C t
33、o +105C 01 160 typical C 1/ Unless otherwise specified, +VIN= 15 V, driver sink = +VIN, C/S(+) voltage = +VIN, and TA= TJ. 2/ These parameters are first-order supply-independent, however, both may vary with supply for +VINless than about 4 V. This supply variation will cause a slight change in the t
34、imer period and duty cycle, although a high off-time/on-time ratio will be maintained. 3/ With recommended RTvalue of 200 k, TOFF= RTCT* In(VU/ VL) 10 %. 4/ The internal current limiting voltage has a temperature dependence of approximately 2.0 mV / C, or 2800 ppm / C. The internal 2.4 sense resisto
35、r has a temperature dependence of approximately +1500 ppm / C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03633 REV A PAGE 8 Case X FIGURE 1. Case outlines. P
36、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03633 REV A PAGE 9 Case X continued. Dimensions Inches Millimeters Symbol Min Max Min Max A - .104 - 2.65 A1 .004 .0
37、12 0.10 0.30 b .014 .020 0.35 0.51 c .010 nominal 0.25 nominal D .400 .410 10.16 10.41 E .291 .299 7.39 7.59 E1 .400 .419 10.15 10.65 e .050 BSC 1.27 BSC L .016 .050 0.40 1.27 NOTES: 1. Controlling dimensions are inch, millimeter dimensions are given for reference only. 2. Body dimensions do not inc
38、lude mold flash or protrusion, not to exceed .006 inches (0.15 mm). 3. Falls within JEDEC MS-013. FIGURE 1. Case outlines continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO.
39、16236 DWG NO. V62/03633 REV A PAGE 10 Device type 01 Case outline X Terminal number Terminal symbol 1 +VIN2 COMP / SHUTDOWN 3 E/A(+) 4 +2 V REF 5 GND 6 LOGIC DISABLE 7 LIMIT 8 SOURCE 9 E/A(-) 10 SINK 11 NC 12 VADJ13 NC 14 TIMER RC 15 CURRENT SENSE (-) C/S(-) 16 CURRENT SENSE (+) C/S(+) NC = No conne
40、ction FIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03633 REV A PAGE 11 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo
41、reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/03633 REV A PAGE 12 4. VERIFICATION 4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requ
42、irements as indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices, classification, packaging, and labeling of moisture sensitive devices, as applicable. 5. PREPARATION FOR DELIVERY 5.1 Packaging. Preservation, packaging, labeling
43、, and marking shall be in accordance with the manufacturers standard commercial practices for electrostatic discharge sensitive devices. 6. NOTES 6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum. 6.2 Configuration control. The data contained herein i
44、s based on the salient characteristics of the device manufacturers data book. The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided. 6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herei
45、n is not to be construed as a guarantee of present or continued availability as a source of supply for the item. Vendor item drawing administrative control number 1/ Device manufacturer CAGE code Package Top side marking Vendor part number 2/ V62/03633-01XE 01295 Tape and reel UC2832TEP UC2832TDWREP
46、 Tube UC2832TDWEP 1/ The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation. 2/ The “R” designates in the vendor part number the part is supplied as tape and reel. CAGE code Source of supply 01295 Texas Instruments, Inc. Semiconductor Group 8505 Forest Lane P.O. Box 660199 Dallas, TX 75243 Point of contact: U.S. Highway 75 South P.O. Box 84, M/S 853 Sherman, TX 75090-9493 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-
