1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV REV STATUS OF PAGES PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing YY-
2、MM-DD CHECKED BY RAJESH PITHADIA APPROVED BY ROBERT M. HEBER TITLE MICROCIRCUIT, LINEAR, LOW DROPOUT 0.5 A NEGATIVE REGULATOR, MONOLITHIC SILICON SIZE A CODE IDENT. NO. 16236 DWG NO. V62/09609 08-12-10 REV PAGE 1 OF 14 AMSC N/A 5962-V008-09 Provided by IHSNot for ResaleNo reproduction or networking
3、permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09609 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance low dropout 0.5 amp negative regulator microcircuit, with an operat
4、ing temperature range of -55C to +105C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/09609 - 01 X E Drawi
5、ng Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 UCC284-5EP Low dropout 0.5 amp negative regulator 02 UCC284-12EP Low dropout 0.5 amp negative regulator 03 UCC284-ADJEP Low dropout 0.5 amp negative regula
6、tor 1.2.2 Case outline(s). The case outline(s) are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 8 MS-012-AA Plastic surface mount 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture: Finish desi
7、gnator Material A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium Z Other 1.3 Absolute maximum ratings. 1/ 2/ Input voltage range (VIN). -16 V minimum Shutdown voltage range (SD/CT) -5 V to 6 V Power dissipation (PD) . 200 mW Operating virtual junction temperature ran
8、ge (TJ) -55C to +150C Storage temperature range (TSTG). -65C to +150C Lead temperature (soldering, 10 seconds) . +300C maximum Thermal resistance, junction to case (JC) . 38.3C/W Thermal resistance, junction to ambient (JA) 176C/W _ 1/ Stresses beyond those listed under “absolute maximum rating” may
9、 cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect
10、device reliability. 2/ All voltages are with respect to ground. Currents are positive into negative out of the specified terminals. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 1
11、6236 DWG NO. V62/09609 REV PAGE 3 1.4 Recommended operating conditions. 3/ Operating free-air temperature range (TA) -55C to +105C 2. APPLICABLE DOCUMENTS JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices (Applications for copies should be addressed to the Electronic Industries
12、 Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identif
13、ier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics ar
14、e as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The ter
15、minal connections shall be as shown in figure 2. 3.5.3 Logic diagram. The logic diagram shall be as shown in figure 3. 3/ Use of this product beyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or liabil
16、ity for product used beyond the stated limits. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09609 REV PAGE 4 TABLE I. Electrical performance characteristics. 1/
17、 Limits Test Symbol Conditions 2/Temperature, TADevice type Min Max Unit Regulation section Output voltage VOUT+25C 01 -5.075 -4.925 V -55C to +105C -5.150 -4.850 Line regulation VLN VIN= -5.2 V to -15 V +25C 01 10 mV -55C to +105C 12 Load regulation LDR IOUT= 0 mA to 0.5 A -55C to +105C 01 0.25 % O
18、utput noise voltage VONBW = 10 Hz to 10 kHz +25C 01 200 typical Vrms VDOIOUT= 0.5 V, VOUT= -4.8 V -55C to +105C 01 0.5 V Dropout voltage, VOUT- VINIOUT= 50 mA, VOUT= -4.8 V 50 mV Power supply section Input voltage range VIN-55C to +105C 01 -15 -5.2 V IQCPVIN= -4.85 V 3/ +25C 01 350 A Quiescent curre
19、nt charge pump on -55C to +105C 360 Quiescent current IQVIN= -15 V +25C 01 250 A -55C to +105C 260 IQSDVIN= -13 V, SD/CT = 0 V 4/ 0C to +105C 01 45 A Quiescent current in shutdown -55C to +0C 100 Shutdown threshold ISTHAt shutdown pin (SD/CT) +25C 01 -1.0 -0.4 V -55C to +105C -1.2 -0.2 Shutdown inpu
20、t current ISDSD/CT = 0 V -55C to +105C 01 5 25 A Output leakage in shutdown IOLVIN= -15 V, VOUT= 0 V 5/ -55C to +105C 01 50 A Over temperature shutdown TSD01 140 typical C Over temperature hysteresis THYS01 20 typical C See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or n
21、etworking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09609 REV PAGE 5 TABLE I. Electrical performance characteristics Continued. 1/ Limits Test Symbol Conditions 2/Temperature, TADevice type Min Max Unit Current limit
22、 section Peak current limit IPKVOUT= 0 V +25C 01 0.7 1.5 A -55C to +105C 0.5 1.6 Over current threshold ITH-55C to +105C 01 0.55 0.9 A Current limit duty cycle CLDC VOUT= 0 V -55C to +105C 01 4 % Over current time out tONVOUT= 0 V +25C 01 300 700 s -55C to +105C 300 720 See footnotes at end of table
23、 I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09609 REV PAGE 6 TABLE I. Electrical performance characteristics - Continued. 1/ Limits Test Symbol Conditions
24、2/Temperature, TADevice type Min Max Unit Regulation section Output voltage VOUT+25C 02 -12.18 -11.82 V -55C to +105C -12.24 -11.64 Line regulation VLN VIN= -12.5 V to -15 V -55C to +105C 02 15 mV Load regulation LDR IOUT= 0 mA to 0.5 A -55C to +105C 02 0.3 % Output noise voltage VONBW = 10 Hz to 10
25、 kHz +25C 02 200 typical Vrms VDOIOUT= 0.5 V, VOUT= -11.6 V -55C to +105C 02 0.5 V Dropout voltage, VOUT- VINIOUT= 50 mA, VOUT= -11.6 V 50 mV Power supply section Input voltage range VIN-55C to +105C 02 -15 -12.5 V Quiescent current IQVIN= -15 V -55C to +105C 02 350 A IQSDVIN= -13 V, SD/CT = 0 V 3/
26、0C to +105C 02 45 A Quiescent current in shutdown -55C to +0C 100 Shutdown threshold ISTHAt shutdown pin (SD/CT) -55C to +105C 02 -1.0 -0.4 V Shutdown input current ISDSD/CT = 0 V -55C to +105C 02 5 25 A Output leakage in shutdown IOLVIN= -15 V, VOUT= 0 V 5/ -55C to +105C 02 50 A Over temperature sh
27、utdown TSD02 140 typical C Over temperature hysteresis THYS02 20 typical C Current limit section Peak current limit IPKVOUT= 0 V -55C to +105C 02 0.7 1.5 A Over current threshold ITH-55C to +105C 02 0.55 0.9 A Current limit duty cycle CLDC VOUT= 0 V -55C to +105C 02 4 % Over current time out tONVOUT
28、= 0 V -55C to +105C 02 300 700 s See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09609 REV PAGE 7 TABLE I. Electrical performance ch
29、aracteristics - Continued. 1/ Limits Test Symbol Conditions 2/Temperature, TADevice type Min Max Unit Regulation section Reference voltage VREF+25C 03 -1.27 -1.23 V -55C to +105C -1.275 -1.215 Line regulation VLN VIN= -3.5 V to -15 V, VOUT= VOUTS-55C to +105C 03 3 mV Load regulation LDR IOUT= 0 mA t
30、o 0.5 A -55C to +105C 03 0.18 % Output noise voltage VONBW = 10 Hz to 10 kHz +25C 03 200 typical Vrms VDOIOUT= 0.5 V, VOUT= -3.15 V -55C to +105C 03 0.5 V Dropout voltage, VOUT- VINIOUT= 50 mA, VOUT= -3.15 V 50 mV Sense pin input current IIN-55C to +105C 03 250 nA Power supply section Input voltage
31、range VIN-55C to +105C 03 -15 -3.5 V Undervoltage lockout UVLO -55C to +105C 03 -3.2 -2.7 V Quiescent current charge pump on IQCPVIN= -3.15 V 3/ -55C to +105C 03 350 A Quiescent current IQVIN= -15 V -55C to +105C 03 250 A Quiescent current in VIN= -13 V, SD/CT = 0 V 4/ 0C to +105C 03 45 A shutdown -
32、55C to +0C 100 Shutdown threshold ISTHAt shutdown pin (SD/CT) -55C to +105C 03 -1.0 -0.4 V Shutdown input current ISDSD/CT = 0 V -55C to +105C 03 5 25 A Output leakage in shutdown IOLVIN= -15 V, VOUT= 0 V 5/ -55C to +105C 03 50 A Over temperature shutdown TSD03 140 typical C Over temperature hystere
33、sis THYS03 20 typical C See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09609 REV PAGE 8 TABLE I. Electrical performance characteris
34、tics Continued. 1/ Limits Test Symbol Conditions 2/Temperature, TADevice type Min Max Unit Current limit section Peak current limit IPKVOUT= 0 V -55C to +105C 03 0.7 1.5 A Over current threshold ITH-55C to +105C 03 0.55 0.9 A Current limit duty cycle CLDC VOUT= 0 V -55C to +105C 03 4 % Over current
35、time out tONVOUT= 0 V -55C to +105C 03 300 700 s 1/ Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters may
36、not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization and/or design. 2/ Unless otherwise specified, VIN= VOUT 1.5 V, IOUT= 0 mA, COUT= 4.7 F, and CT= 0.015 F. For device type 03 only, VOUTis set to -3.3 V. 3/ The internal charge
37、pump is enabled only for dropout condition with low VIN. Only in this condition is the pump required to provide additional output field effect transistor (FET) fate drive to maintain dropout specifications. For conditions where the charge pump is not required, it is disabled, which lowers overall de
38、vice power consumption. 4/ Ensured by design. Not production tested. 5/ In the application during shutdown mode, output leakage current adds to quiescent current. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBU
39、S, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09609 REV PAGE 9 Case X FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09609 REV PAGE 10 C
40、ase X Dimensions Inches Millimeters Symbol Min Max Min Max A - 0.069 - 1.75 A1 0.004 0.010 0.10 0.25 b 0.012 0.020 0.31 0.51 c 0.005 0.010 0.13 0.25 D 0.189 0.197 4.80 5.00 E 0.150 0.157 3.80 4.00 E1 0.228 0.244 5.80 6.20 e 0.050 BSC 1.27 BSC L 0.016 0.050 0.40 1.27 n 8 8 NOTES: 1. Controlling dimen
41、sions are inch, millimeter dimensions are given for reference only. 2. Body length does not include mold flash, protrusion, or gate burrs. Mold flash, protrusion, or gate burrs shall not exceed 0.006 inch (0.15 mm) per end. 3. Body width does not include interlead flash. Interlead flash shall not ex
42、ceed 0.017 inch (0.43 mm) per side. 4. Reference JEDEC MS-012 variation AA. FIGURE 1. Case outline Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09609
43、 REV PAGE 11 Device type 01 Case outline X Terminal number Terminal symbol 1 VOUTS 2 VIN 3 VIN 4 GND 5 VOUT 6 VIN 7 VIN 8 SD / CT FIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS
44、, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09609 REV PAGE 12 Terminal symbol Description GND This is the low noise ground reference input. All voltages are measured with respect to the GND pin. SD / CT This is the shutdown pin and also the short circuit timing pin. Pulling this pin more positive
45、 than -0.7 V puts the circuit in a lo current shutdown mode. Placing a timing capacitor between this pin and GND sets the short circuit charging time, tONduring an over current condition. During an over current condition, the output pulses at approximately a 2.5 % duty cycle. NOTE: The CT capacitor
46、must be connected between this pin and GND, not VIN, to assure that the SD/CT pin is not pulled significantly negative during power up. This pin should not be externally driven more negative that -5 V or the device will be damaged. VIN This is the negative input supply. Bypass this pin to GND with a
47、t least 1 F of low equivalent series resistance (ESR) or equivalent series inductance (ESL) capacitance. VOUT Regulated negative output voltage. A single 4.7 F capacitor should be connected between this pin and GND. Smaller value capacitors can be used for light loads, but this degrades the load step performance of the regulator. VOUTS This is the feedback pin for sensing the output of the regulator. For device types 01 and 02, VOUTS can be connected di
