1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Add footnote 1/ to section 1.2.2 and footnote 4/ to section 6.3. Update boilerplate paragraphs to current requirements. - PHN 11-12-21 Thomas M. Hess CURRENT DESIGN ACTIVITY CAGE CODE 16236 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-39
2、90 Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV PAGE 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing YY-MM-DD CHECKED BY RAJESH PITHADIA TITLE MICRO
3、CIRCUIT, LINEAR, 100 MHz LOW NOISE, HIGH SPEED, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON 09-01-27 APPROVED BY ROBERT M. HEBER SIZE A CODE IDENT. NO. 16236 DWG NO. V62/09612 REV A PAGE 1 OF 12 AMSC N/A 5962-V016-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license
4、from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09612 REV A PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance 100 MHz low noise, high speed, operational amplifier microcircuit, with an operating temper
5、ature range of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/09612 - 01 X E Drawing Device
6、type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 THS4032-EP Dual, 100 MHz low noise, high speed, operational amplifier 02 THS4031-EP Single, 100 MHz low noise, high speed, operational amplifier 1.2.2 Case outline(s
7、). The case outline(s) are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 1/ 8 MO-187 Plastic surface mount with thermal pad 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator
8、 Material A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium Z Other _ 1/ The manufacture has changed lead frames NiPdAu to NiPdAuAg and location of assembly from their Hana facility to their Shanghai facility. Product with a Lot Trace Code of 1CxxxxH and earlier is a
9、NiPdAu frame from the Hana facility. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09612 REV A PAGE 3 1.3 Absolute maximum ratings. 2/ Supply voltage (+VCCto VCC
10、) . 33 V Input voltage (VI) VCCOutput current (IO) . 150 mA Differential input voltage (VIO) 4 V Continuous total power dissipation . See 1.5, dissipation ratings table Maximum junction temperature, (any condition) . +150C Maximum junction temperature, continuous operation, long tern reliability +13
11、0C 3/ Storage temperature range (TSTG) . -65C to +150C 4/ Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds . +300C 1.4 Recommended operating conditions. 5/ Supply voltage range (+VCCto VCC) : Device type 01 . 4.5 V to 16 V Device type 02 . 9 V to 32 V Operating free-air temperature range
12、 (TA) . -55C to +125C 1.5. Dissipation ratings table. 6/ Case outline JAJCTA= +25C power rating X 58.4C/W 4.7C/W 1.8 W, TJ= 130C, continuous 2/ Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress ratings only, and functional operati
13、on of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 3/ The maximum junction temperature for continuous operation is limited
14、by package constraints. Operation above this temperature may result in reduced reliability and/or lifetime of this device. 4/ Long term high temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of overall device life. See http:/ for additional
15、 information on enhanced plastic packaging. 5/ Use of this product beyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. 6/ This data was taken using
16、 2 ounce trace and copper pad that is soldered directly to 3 inch x 3 inch printed circuit board (PCB). For further information, refer to application information section of the manufacturers data sheet. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,
17、-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09612 REV A PAGE 4 2. APPLICABLE DOCUMENTS JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices (Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson B
18、oulevard, Arlington, VA 22201-3834 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identificati
19、on (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1
20、.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall
21、be as shown in figure 2. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09612 REV A PAGE 5 TABLE I. Electrical performance characteristics. 1/ Test Symbol Conditi
22、ons 2/Temperature, TADevice type Limits Unit Min Max Dynamic performance section. Small signal bandwidth SSBW VCC= 15 V, Gain = -1 or 2 +25C 01, 02 100 typical MHz (-3dB) VCC= 5 V, Gain = -1 or 2 90 typical Bandwidth for 0.1 db flatness BW VCC= 15 V, Gain = -1 or 2 +25C 01, 02 50 typical MHz VCC= 5
23、V, Gain = -1 or 2 45 typical Full power 3/ bandwidth FPBW VCC= 15 V, VO(pp)= 20 V, RL= 1 k +25C 01, 02 2.3 typical MHz VCC= 5 V, VO(pp)= 5 V, RL= 1 k 7.1 typical Slew rate 4/ SR VCC= 15 V, RL= 1 k +25C 01, 02 100 typical V/s Settling time to 0.1% tSVCC= 15 V, 5 V step, Gain = -1 +25C 01, 02 60 typic
24、al ns VCC= 5 V, 2.5 V step, Gain = -1 45 typical Settling time to 0.01% tSVCC= 15 V, 5 V step, Gain = -1 +25C 01, 02 90 typical ns VCC= 5 V, 2.5 V step, Gain = -1 80 typical Noise / distortion performance section. Total harmonic distortion THD VCC= 5 V or 15 V, VO(pp)= 2 V, f = 1 MHz, Gain = 2, RL=
25、150 +25C 01, 02 -81 typical dBc VCC= 5 V or 15 V, VO(pp)= 2 V, f = 1 MHz, Gain = 2, RL= 1 k -96 typical Input voltage noise VnVCC= 5 V or 15 V, f 10 kHz, RL= 150 +25C 01, 02 1.6 typical nA / Hz Input current noise InVCC= 5 V or 15 V, f 10 kHz, RL= 150 +25C 01, 02 1.2 typical pA / Hz See footnotes at
26、 end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09612 REV A PAGE 6 TABLE I. Electrical performance characteristics Continued. 1/ Test Symbol Conditi
27、ons 2/Temperature, TADevice type Limits Unit Min Max Noise / distortion performance section continued. Differential gain error DGE VCC= 15 V, Gain = 2, RL= 150 , 40 IRE modulation, NTSC and PAL, 100 IRE ramp +25C 01, 02 0.015 typical % VCC= 5 V, Gain = 2, RL= 150 , 40 IRE modulation, NTSC and PAL, 1
28、00 IRE ramp 0.02 typical Differential phase error DPE VCC= 15 V, Gain = 2, RL= 150 , 40 IRE modulation, NTSC and PAL, 100 IRE ramp +25C 01, 02 0.025 typical VCC= 5 V, Gain = 2, RL= 150 , 40 IRE modulation, NTSC and PAL, 100 IRE ramp 0.03 typical DC performance section. Open loop gain VCC= 15 V, VO=
29、10 V, +25C 01, 02 93 dB RL= 1 k -55C to +125C 92 VCC= 5 V, VO= 2.5 V, +25C 92 RL= 1 k -55C to +125C 91 Input offset voltage VIOVCC= 5 V or 15 V +25C 01, 02 2 mV -55C to +125C 3 Input bias current IIBVCC= 5 V or 15 V +25C 01, 02 6 A -55C to +125C 8 Input offset current IIOVCC= 5 V or 15 V +25C 01, 02
30、 250 nA -55C to +125C 450 Offset voltage drift VIOVCC= 5 V or 15 V -55C to +125C 01, 02 2 typical V/C Input offset current drift IIOVCC= 5 V or 15 V -55C to +125C 01, 02 0.2 typical nA/C See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without licen
31、se from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09612 REV A PAGE 7 TABLE I. Electrical performance characteristics Continued. 1/ Test Symbol Conditions 2/Temperature, TADevice type Limits Unit Min Max Input characteristics section. Common mode i
32、nput voltage range VICRVCC= 15 V -55C to +125C 01, 02 13.5 V VCC= 5 V 3.6 Common mode rejection ratio CMRR VCC= 15 V, VICR= 12 V +25C 01, 02 85 dB -55C to +125C 80 VCC= 5 V, VICR= 12 V +25C 90 -55C to +125C 85 Input resistance ri+25C 01, 02 2 typical M Input capacitance ci+25C 01, 02 1.5 typical pF
33、Output characteristics section. Output voltage swing VOVCC= 15 V, RL= 1 k -55C to +125C 01, 02 13 V VCC= 5 V, RL= 1 k 3.4 VCC= 15 V, RL= 150 12 VCC= 5 V, RL= 250 3 Output current 5/ IOVCC= 15 V, RL= 20 -55C to +125C 01, 02 60 mA VCC= 5 V, RL= 20 50 Short circuit current 5/ ISCVCC= 15 V -55C to +125C
34、 01, 02 150 typical mA Output resistance ROOpen loop +25C 01, 02 13 typical See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09612 RE
35、V A PAGE 8 TABLE I. Electrical performance characteristics Continued. 1/ Test Symbol Conditions VCC= 15 V, RL= 1 k unless otherwise specifiedTemperature, TADevice type Limits Unit Min Max Power supply section. Supply voltage operating range VCCDual supply -55C to +125C 01 4.5 16.5 V Single supply 02
36、 9 33 Supply current VCC= 15 V +25C 01, 02 10 mA (each amplifier) -55C to +125C 11 VCC= 5 V +25C 9 -55C to +125C 10 Power supply rejection ratio PSRR VCC= 5 V or 15 V +25C 01, 02 85 dB -55C to +125C 80 1/ Testing and other quality control techniques are used to the extent deemed necessary to assure
37、product performance over the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization and/or design. 2/ Unle
38、ss otherwise specified, at TA= -55C to +125C, VCC= 15 V and RL= 1 k. 3/ Full power bandwidth = slew rate / 2 VOC(peak). 4/ Slew rate is measured from an output level range of 25% to 75%. 5/ Observe power dissipation ratings to keep the junction temperature below the absolute maximum rating when the
39、output is heavily loaded or shorted. See paragraph 1.3, absolute maximum rating, for more information. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09612 REV A
40、PAGE 9 Case X FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09612 REV A PAGE 10 Case X continued. Symbol Dimensions Inches Millimeters Mi
41、n Max Min Max A - 0.042 - 1.07 A1 0.001 0.006 0.05 0.15 b 0.010 0.014 0.25 0.38 c 0.005 NOM 0.15 NOM D 0.114 0.122 2.90 3.10 E 0.114 0.122 2.90 3.10 E1 0.187 0.199 4.78 4.98 e 0.026 BSC 0.65 BSC L 0.016 0.027 0.41 0.69 L1 0.010 BSC 0.25 BSC NOTES: 1. Controlling dimensions are millimeter, inch dimen
42、sions are given for reference only. 2. Body dimensions does not include mold flash, protrusion. 3. This package is designed to be soldered to a thermal pad on the board. Refer to technical brief, powerpad thermally enhanced package, manufacturers literature number SLMA002 for information regarding r
43、ecommended board layout. This document is available at . 4. Falls within reference to JEDEC MO-187. FIGURE 1. Case outline - continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT N
44、O. 16236 DWG NO. V62/09612 REV A PAGE 11 Device types 01 02 Case outline X Terminal number Terminal symbol 1 OUTPUT 1 NULL 2 -INPUT 1 -INPUT 3 +INPUT 1 +INPUT 4 -VCC-VCC5 +INPUT 2 NC 6 -INPUT 2 OUTPUT 7 OUTPUT 2 +VCC8 +VCCNULL FIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo reproduct
45、ion or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09612 REV A PAGE 12 4. VERIFICATION 4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements
46、as indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices, classification, packaging, and labeling of moisture sensitive devices, as applicable. 5. PREPARATION FOR DELIVERY 5.1 Packaging. Preservation, packaging, labeling, and mar
47、king shall be in accordance with the manufacturers standard commercial practices for electrostatic discharge sensitive devices. 6. NOTES 6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum. 6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturers data bo
