1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV REV STATUS OF PAGES PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing YY-
2、MM-DD CHECKED BY RAJESH PITHADIA APPROVED BY ROBERT M. HEBER TITLE MICROCIRCUIT, DIGITAL-LINEAR, 4:1 HIGH SPEED MULTIPLEXER, MONOLITHIC SILICON SIZE A CODE IDENT. NO. 16236 DWG NO. V62/09616 09-01-13 REV PAGE 1 OF 14 AMSC N/A 5962-V022-09 Provided by IHSNot for ResaleNo reproduction or networking pe
3、rmitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09616 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance 4:1 high speed multiplexer microcircuit, with an operating temperatur
4、e range of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/09616 - 01 X E Drawing Device type
5、 Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 OPA4872-EP 4:1 high speed multiplexer 1.2.2 Case outline(s). The case outline(s) are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 14 M
6、S-012-AB Plastic surface mount 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture: Finish designator Material A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium Z Other Provided by IHSNot for Resal
7、eNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09616 REV PAGE 3 1.3 Absolute maximum ratings. 1/ Power supply voltage . 6.5 V Input voltage range VSPower dissipation (PD) . 312.5 mW Storage
8、temperature range (TSTG). -65C to +125C Lead temperature (soldering, 10 seconds) . +260C Junction temperature (TJ) +150C Junction temperature: continuous operation, long term reliability . +140C Thermal resistance, junction to ambient (JA) 80C/W Electrostatic discharge (ESD) rating: Human body model
9、 (HBM) . 1500 V Charged device model (CDM) 1000 V Machine model (MM) . 200 V 1.4 Recommended operating conditions. 2/ Power supply voltage . 5 V Operating free-air temperature range (TA) -55C to +125C 1/ Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the d
10、evice. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2/ Use of th
11、is product beyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. Provided by IHSNot for ResaleNo reproduction or networking permitted without license
12、 from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09616 REV PAGE 4 2. APPLICABLE DOCUMENTS JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices (Applications for copies should be addressed to the Electronic Industries Alliance, 25
13、00 Wilson Boulevard, Arlington, VA 22201-3834 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS i
14、dentification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specifie
15、d in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connect
16、ions shall be as shown in figure 2. 3.5.3 Truth table. The truth table shall be as shown in figure 3. 3.5.4 Logic diagram. The logic diagram shall be as shown in figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBU
17、S COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09616 REV PAGE 5 TABLE I. Electrical performance characteristics. 1/ Limits Test Symbol Conditions 2/ 3/ 4/Temperature, TADevice type Min Max Unit AC performance section Small signal bandwidth SSBW VO= 500 mVPP, RL= 150 +25C 01 500 typical MHz
18、 Bandwidth for 0.1 db flatness BW VO= 500 mVPP, RL= 150 +25C 01 120 typical MHz Large signal bandwidth LSBW VO= 2 VPP, RL= 150 +25C 01 500 typical MHz Slew rate SR 4 V step +25C 01 2300 typical V/s Rise time and fall time tr, tf4 V step +25C 01 1.25 typical ns Settling time tSTo 0.05 %, 2 V step +25
19、C 01 15 typical ns To 0.1 %, 2 V step 14 typical Channel switching time tCS+25C 01 10 typical ns Second harmonic distortion HD2 G = +2 V/V, f = 10 MHz, VO= 2 VPP, RL= 150 +25C 01 -60 typical dBc Third harmonic distortion HD3 G = +2 V/V, f = 10 MHz, VO= 2 VPP, RL= 150 +25C 01 -78 typical dBc Input vo
20、ltage noise NIVf 100 kHz +25C 01 4.5 typical nV / Hz Noninverting input current noise NNINf 100 kHz +25C 01 4.0 typical pA / Hz Inverting input current noise NINf 100 kHz +25C 01 19 typical pA / Hz Differential gain GD G = +2 V/V, PAL, VO= 1.4 VP+25C 01 0.035 typical % Differential phase GP G = +2 V
21、/V, PAL, VO= 1.4 VP+25C 01 0.005 typical All hostile crosstalk, CT 3 channels driven at 5 MHz, 1 VPP+25C 01 -80 typical dB input referred 3 channels driven at 30 MHz, 1 VPP-66 typical See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license
22、from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09616 REV PAGE 6 TABLE I. Electrical performance characteristics Continued. 1/ Limits Test Symbol Conditions 2/ 3/ 4/Temperature, TADevice type Min Max Unit DC performance section ZOLVO= 0 V, RL= 100
23、+25C 01 92 k Open loop transimpedance -55C to +125C 60 Input offset voltage VIOVCM= 0 V +25C 01 5 mV -55C to +125C 10.5 Average input offset voltage drift VIO VCM= 0 V -55C to +125C 01 30 V/C VIOMVCM= 0 V +25C 01 5 mV Input offset voltage matching -55C to +125C 10.5 INIBVCM= 0 V +25C 01 14 A Noninve
24、rting input bias current -55C to +125C 20 Average noninverting input bias current INIBVCM= 0 V -55C to +125C 01 48 nA/C Inverting bias current IIBVCM= 0 V +25C 01 18 A -55C to +125C 35 Average inverting input bias current IIBVCM= 0 V -55C to +125C 01 125 nA/C Input section CMIR Each noninverting inp
25、ut +25C 01 2.55 V Common mode input range -55C to +125C 2.4 CMRR VCM= 0 V, input referred, +25C 01 50 dB Common mode rejection ratio noninverting input -55C to +125C 43 Input resistance RINNoninverting, channel enabled +25C 01 2.5 typical M Inverting, open loop 70 typical Input capacitance CINNoninv
26、erting, channel enabled +25C 01 0.9 typical pF Channel deselected 0.9 typical Chip disabled 0.9 typical See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO
27、. 16236 DWG NO. V62/09616 REV PAGE 7 TABLE I. Electrical performance characteristics Continued. 1/ Limits Test Symbol Conditions 2/ 3/ 4/Temperature, TADevice type Min Max Unit Output section Output voltage swing VOUTRL 1 k +25C 01 3.9 V -55C to +125C 3.55 RL= 150 +25C 3.55 -55C to +125C 3.35 Output
28、 current IOUTVO= 0 V +25C 01 48 mA -55C to +125C 38 Short circuit output current IOSOutput shorted to ground +25C 01 100 typical mA Closed loop output impedance ZCLOG = +2 V/V, f 100 kHz +25C 01 0.03 typical ENABLE ( EN ) section IPDV EN = 0 V +25C 01 3.6 mA Power down supply current -55C to +125C 4
29、.3 Disable time tDVIN= 0.25 VDC+25C 01 25 typical ns Enable time tEVIN= 0.25 VDC+25C 01 6 typical ns Off isolation OI G = +2 V/V, f = 10 MHz +25C 01 88 typical dB Output resistance in disable ROD+25C 01 14 typical M Output capacitance in disable COD+25C 01 2.5 typical pF See footnotes at end of tabl
30、e. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09616 REV PAGE 8 TABLE I. Electrical performance characteristics Continued. 1/ Limits Test Symbol Conditions 2/
31、3/ 4/Temperature, TA Device type Min Max Unit Digital inputs section Maximum logic 0 VL0A0, A1, EN , SD +25C 01 0.8 V -55C to +125C 0.8 Maximum logic 1 VL1A0, A1, EN , SD +25C 01 2.0 V -55C to +125C 2.0 Logic input current ILIA0, A1, EN , SD, input = 0 V each +25C 01 40 A line -55C to +125C 55 Outpu
32、t switching glitch VOSGChannel selection, at matched load +25C 01 20 typical mV Channel disable, at matched load 40 typical Shutdown, at matched load 40 typical Shutdown (SD) section ISDVSD= 0 V +25C 01 1.3 mA Shutdown supply current -55C to +125C 2.0 Shutdown time tSDVIN= 0.25 VDC+25C 01 75 typical
33、 ns Enable time t EN VIN = 0.25 VDC +25C 01 15 typical ns Off isolation OI G = +2 V/V, f = 10 MHz +25C 01 88 typical dB Output resistance in shutdown RSD+25C 01 14 typical M Output capacitance in shutdown CSD+25C 01 2.5 typical pF See footnotes at end of table. Provided by IHSNot for ResaleNo reprod
34、uction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09616 REV PAGE 9 TABLE I. Electrical performance characteristics Continued. 1/ Limits Test Symbol Conditions 2/ 3/ 4/Temperature, TADevice type Min Max U
35、nit Power supply section Specified operating voltage VS+25C 01 5 typical V VS(min)+25C 01 3.5 V Minimum operating voltage -55C to +125C 3.5 VS(max)+25C 01 6.0 V Maximum operating voltage -55C to +125C 6.0 IQ(max)VS= 5 V +25C 01 11 mA Maximum quiescent current -55C to +125C 12.5 IQ(min)VS= 5 V +25C 0
36、1 10 mA Minimum quiescent current -55C to +125C 8.25 +PSRR Input referred +25C 01 -50 dB Power supply rejection ratio -55C to +125C -42 -PSRR +25C -51 -55C to +125C -43 1/ Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over the spec
37、ified temperature range. Product may not necessarily be tested across the full temperature range and all parameters may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization and/or design. 2/ Unless otherwise specified, VS= 5 V,
38、gain (G) = +2 V/V, feedback resistance (RF) = 523 , and load resistance (RL) = 150 . 3/ Junction temperature = ambient for +25C tested specifications. 4/ Junction temperature = ambient at low temperature limit; junction temperature = ambient +9C at high temperature limit for over temperature specifi
39、cations. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09616 REV PAGE 10 Case X FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networkin
40、g permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09616 REV PAGE 11 Case X continued. Dimensions Inches Millimeters Symbol Min Max Min Max A - .069 - 1.75 A1 .004 .010 0.10 0.25 b .012 .020 0.31 0.51 c .005 .010 0.13 0.25
41、D .337 .344 8.55 8.75 e .050 BSC 1.27 BSC E .150 .157 3.80 4.00 E1 .228 .244 5.80 6.20 L .016 .050 0.40 1.27 n 14 leads 14 leads NOTES: 1. Controlling dimensions are inch, millimeter dimensions are given for reference only. 2. For dimension D, body length does not include mold flash, protrusion, or
42、gate burrs. Mold flash, protrusion, or gate burrs shall not exceed 0.006 inch (0.15 mm) per end. 3. For dimension E, body width does not include interlead flash. Interlead flash shall not exceed 0.017 inch (0.43 mm) per side. 4. Falls within JEDEC MS-012 variation AB. FIGURE 1. Case outline - Contin
43、ued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09616 REV PAGE 12 Device type 01 Case outline X Terminal number Terminal symbol Description 1 IN 0 Device inpu
44、t 0 2 GND Ground 3 IN 1 Device input 1 4 GND Ground 5 IN 2 Device input 2 6 -VSNegative supply voltage 7 IN 3 Device input 3 8 A0 Channel control pin 0 9 A1 Channel control pin 1 10 EN Chip enable 11 SD Shutdown 12 FB Feedback 13 OUT Device output 14 +VSPositive supply voltage FIGURE 2. Terminal con
45、nections. A0 A1 EN SD VOUT0 0 0 0 INPUT 0 1 0 0 0 INPUT 1 0 1 0 0 INPUT 2 1 1 0 0 INPUT 3 X X 1 0 High Z, IQ= 3.4 mA X X X 1 High Z, IQ= 1.1 mA FIGURE 3. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COL
46、UMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09616 REV PAGE 13 FIGURE 4. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09616 REV PAGE 14 4.
47、 VERIFICATION 4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices, classification, packaging, and labeling of moisture sensitive d
