1、INCH-POUND MIL-DTL-27467B 9 September 2005 SUPERSEDING MIL-H-27467A (USAF) 1 March 1963 DETAIL SPECIFICATION HEADSET, ELECTRICAL H-154A/AIC Inactive for new design after 20 August 1996. This specification is approved for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1
2、Scope. This specification covers one type of headset, designated Headset, Electrical H-154A/AIC. 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of th
3、is specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or
4、 not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicit
5、ation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-25670/2 Earphone Element, High- and Low-Altitude, H-143/AIC, and Low-Altitude, Water-Immersible, H-143A/AIC MIL-DTL-22442 Cable Assemblies, Aircraft Audio, General Specification For MIL-DTL-22442/33 Cable Assemblies, Aircraft Audio, CX-
6、4707C/AIC MIL-DTL-22442/37 Cable Assembly, Aircraft Audio, CX-4708A/AIC MIL-DTL-9177/2 Connector, Audio, Airborne, Plug, Miniature, 4 Contact DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 Test Method Standard, Electronic and Electrical Component Parts MIL-STD-810 Environmental Engineering Consideratio
7、ns and Laboratory Tests MIL-STD-1285 Marking of Electrical and Electronic Parts (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19
8、111-5094.) Comments, suggestions, or questions on this document should be addressed to Defense Supply Center, Columbus, ATTN: DSCC-VAI, P.O. Box 3990, Columbus, OH 43218-3990, or email to Sounddscc.dla.mil. Since contact information can change, you may want to verify the currency of this address inf
9、ormation using the ASSIST Online database at http:/assist.daps.dla.mil. AMSC N/A FSC 5965 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-DTL-27467B 2DRAWINGS Air Force 7136032 Headset Kit, MK-634/AIC 7136036 Headset, Electrical H-154A/AIC Assemb
10、ly of 7136037 Shell, Earphone Headset 7136038 Cushion, Earphone Headset 7136039 Pad Earphone (Copies of these drawings required by contractors in connection with specific procurement functions are available from the Defense Supply Center Columbus, ATTN: DSCC-VTRD, P.O. Box 3990, Columbus, Ohio 43218
11、-3990.) 2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. FIGU
12、RE 1. H-154A/AIC. 3. REQUIREMENTS 3.1 First article. When specified (see 6.2), a sample shall be subjected to first article inspection in accordance with 4.2. 3.2 Materials. Materials shall be as specified herein. However, when a definite material is not specified, a material shall be used which wil
13、l enable the product to meet the performance requirements of this specification. Acceptance or approval of any constituent material shall not be construed as a guaranty of the acceptance of the finished product. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fro
14、m IHS-,-,-MIL-DTL-27467B 33.2.1 Pure tin. The use of pure tin, as an underplating or final finish, is prohibited both internally and externally. Tin content of headset components and solder shall not exceed 97 percent. Tin shall be alloyed with a minimum of 3 percent lead (see 6.3). 3.2.2 Recycled,
15、recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible, provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle
16、costs. 3.3 Construction. 3.3.1 General design. The headset shall be designed to be inherently stable in mechanical construction (see figure 1), electrical characteristics, and acoustical performance and shall be suitable for extended military aircraft use. The detailed mechanical and electrical desi
17、gn of this headset shall be accomplished by the contractor subject to the requirements of Drawing 7136036 and this specification; these requirements being detailed herein only to the extent deemed necessary to obtain the desired mechanical and electrical characteristics and performance. 3.3.2 Comple
18、te assembly. Headset, Electrical H-154A/AIC shall consist of the following components, assembled in accordance with Drawing 7136036: Quantity Item2 ea. Earphone, H-143/AIC in accordance with MIL-PRF-25670/22 ea. Shell, Earphone, in accordance with Drawing 7136037 1 ea. Cord Assembly, Electrical, Bra
19、nched CX-4707C/AIC in accordance with MIL-DTL-22442/33, P/N: M22442/33-4707. 1 ea. Cord Assembly, Electrical, Branched CX-4708A/AIC in accordance with MIL-DTL-22442/37, P/N: M22442/37-4708 1 ea. Installation Kit, Electronic Equipment MK-634/AIC in accordance with Drawing 7136032 2 ea. Cushion, Earph
20、one Shell, 7136038-10 in accordance with Drawing 7136038 2 ea. Pad, Earphone, in accordance with Drawing 7136039 3.4 Cord assemblies. Cord assemblies are In accordance with MIL-DTL-22442 specification sheets referenced. 3.5 Performance characteristics. 3.5.1 Electrical. 3.5.1.1 Circuitry. The two ea
21、rphones shall be connected in parallel, see figure 2 for schematic diagram. 3.5.1.2 DC resistance of the headset circuit. The dc resistance of the headset circuit shall be between 8.5 and 11.5 ohms inclusive (see 4.5.2). 3.5.1.3 DC resistance of microphone circuit. The dc resistance of the microphon
22、e circuit shall not exceed the total allowable resistance of the conductors in the circuit (microphone not included in assembly) (see 4.5.3). 3.5.2 Acoustical. 3.5.2.1 Acoustic distortion. There shall be no buzzes, rattles, or voice distortion when the headset is operated as specified herein (see 4.
23、5.4). 3.5.2.2 Functional operation. The headset shall perform satisfactorily when used with Intercommunication Sets AN/AIC-10( ) or AN/AIC-18 and when subjected to the functional operation test specified herein (see 4.5.5). Provided by IHSNot for ResaleNo reproduction or networking permitted without
24、 license from IHS-,-,-MIL-DTL-27467B 4FIGURE 2. H-154A/AIC wiring diagram. 3.6 Environmental tests. 3.6.1 Temperature. When tested there shall be no parts cracked or deformed due to extreme temperature and the DC resistance of the headset circuit requirements of 3.5.1.2 shall be met (see 4.6.1). 3.6
25、.2 Vibration. When tested, there shall be no loose parts or evidence of mechanical failure and the dc resistance of the headset circuit requirements of 3.5.1.2 shall be met (see 4.6.2). 3.6.3 Shock. When tested, there shall be no failure due to broken or deformed parts and the dc resistance of the h
26、eadset circuit requirements of 3.5.1.2 shall be met (see 4.6.3). 3.6.4 Humidity. When tested, there shall be no failure due to moisture or corrosion and the dc resistance of the headset circuit requirements of 3.5.1.2 shall be met (see 4.6.4). 3.6.5 Salt fog. When tested, there shall be no failure d
27、ue to corrosion, and the dc resistance of the headset circuit requirements of 3.5.1.2 shall be met (see 4.6.5). 3.7 Marking. Marking shall be in accordance with MIL-STD-1285. Location shall be as specified (see 3.1) and shall consist the following: a. NSN. b. PIN. c. Manufacturers CAGE and PIN. 3.8
28、Workmanship. The products shall be processed as to be uniform in quality and shall be free from loose or deposited foreign materials and other defects that will affect life, serviceability, or appearance. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,
29、-,-MIL-DTL-27467B 54. VERIFICATION 4.1 Classification of inspection. The inspection requirements specified herein are classified as follows: a. First article inspection (see 4.2). b. Conformance inspection (see 4.3). 4.2 First article inspection. First article inspection shall be performed on one co
30、mplete Headset, Electrical H-154A/AIC when first article sample is required (see 3.1). This inspection shall include the examination of 4.4 and the tests of 4.5.1 through 4.5.5. 4.3 Conformance inspection. Conformance inspection shall include the examination of 4.4 and the tests of 4.5.1 through 4.5
31、.4. 4.3.1 First article. A minimum of 10 headsets shall be subjected to the preproduction tests in the quantities indicated in 4.5. At least 3 headsets shall be subjected to each of the preproduction tests. More than one preproduction test may be performed on any one headset provided it has not been
32、 damaged by a previous test. 4.4 First article tests. Acceptance tests shall consist of: a. Individual tests (see 4.4.1). b. Sampling plan and tests (see 4.4.2). 4.4.1 Individual tests. Each headset shall be subjected to the individual tests listed in 4.5. 4.4.2 Sampling plan and tests. At least one
33、 headset shall be selected at random from every 100 headsets produced and be subjected to the environmental tests listed in 4.5. 4.4.2.1 Sampling plan. A sample of parts shall be randomly selected in accordance with table I, if one or more defects are found, the lot shall be re-screened and defects
34、removed. After screening and removal of defects, a new sample of parts shall be randomly selected in accordance with table I, if one or more defects are found in the second sample, the lot shall be rejected and shall not be supplied to this specification. TABLE I. Sampling plan. Lot size Sample size
35、 2 to 8 9 to 15 16 to 25 26 to 50 51 to 90 91 to 150 151 to 280 281 to 500 501 to 1200 1201 to 3200 1/ 13 1/ 13 13 13 13 20 29 34 42 1/ Indicates entire lot must be inspected or sample size not to exceed lot size. 4.4.2.2 Rejection and retest. When one item selected from a production run fails to me
36、et the specification, no item still on hand or later produced shall be accepted until the extent and cause of failure are determined. 4.4.2.3 Individual tests may continue. For operational reasons, individual tests may be continued pending the investigation of a sampling test failure. But final acce
37、ptance of items on hand or produced later shall not be made until it is determined that items meet all the requirements of the specification. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-DTL-27467B 64.4.2.4 Sampling plan. Accept on zero, for g
38、eneral inspection as specified in table II. 4.5 Test schedule. The headsets shall be subjected to the tests listed in table II in the quantities shown. The order of performing the first article or acceptance tests is immaterial except that the salt fog test shall be last. At the end of each test, th
39、e headset shall be thoroughly inspected and checked for any damage, defects, or deterioration resulting from the tests. TABLE II. First article and conformance. Inspection or test Requirement Test procedures Individual Sample Examination of product DC resistance of headset circuit DC resistance of m
40、icrophone circuit Acoustic distortion Functional operation Temperature-altitude Vibration Shock Humidity Salt fog 3.5.1.2 3.5.1.3 3.5.2.1 3.5.2.2 3.6.1 3.6.2 3.6.3 3.6.4 3.6.5 4.5.1 4.5.2 4.5.3 4.5.4 4.5.5 4.6.1 4.6.2 4.6.3 4.6.4 4.6.5 all all all all all all all all 1% 4.5.1 Examination of product.
41、 The headset shall be inspected thoroughly to determine conformance to the requirements of this specification with respect to materials, mechanical detail, workmanship, physical dimensions, and finishes, prior to and during assembly. Particular attention shall be paid to neatness and thoroughness of
42、 soldering, wiring, marking of parts and assemblies, painting, and screw assemblies. 4.5.2 DC resistance of the headset circuit. The DC resistance of the headset circuit shall be measured across the earphone contacts of Telephone Plug U-174/U (see 3.5.1.2). 4.5.3 DC resistance of microphone circuit.
43、 The DC resistance of the microphone circuit shall be measured with the microphone contacts of telephone Plug U-174/U short circuited (see 3.5.1.3). 4.5.4 Acoustic Distortion. Electrical voice signals shall be applied across the earphone contacts of Telephone Plug U-174/U. The input shall be such th
44、at the peak of the speech signal applied to the headset is at least 2.0 volts rms. During this test, the operator shall listen for buzzes, rattles, or voice distortion in the acoustic output of the headset (see 3.5.2.1). 4.5.5 Functional operation. A microphone, with impedance between 2.0 to 5.0 ohm
45、s, shall be connected to the microphone circuit of the headset, as shown on figure 2. Telephone Plug U-174/U on the headset shall be inserted in a Telephone Jack U-92A/U that has the earphone contacts connected to the output of an amplifier of suitable gain and the microphone contacts to the input o
46、f the same amplifier. During this test, the talker shall listen to his own voice while speaking into the microphone to insure that the headset is functioning satisfactorily. 4.6 Environmental testing. 4.6.1 Temperature. The headset or headset-microphone shall be tested in accordance with MIL-STD-810
47、, method 501, procedure 1 with a storage temperature of -55C and an operating temperature of -40C and MIL-STD-810, method 502, procedure 1 with a storage temperature of 70C and an operating temperature of 65C. Upon completion of the test in 4.5.2 shall be performed (see 3.6.1). 4.6.2 Vibration. The
48、headset or headset-microphone shall be tested in accordance with test method 201 of MIL-STD-202. Upon completion of the test in 4.5.2 shall be performed (see 3.6.2). 4.6.3 Shock. The headset or headset-microphone shall be tested in accordance with test method 213 of MIL-STD-202, test condition A. Up
49、on completion of the test in 4.5.2 shall be performed (see 3.6.3). 4.6.4 Humidity. The headset or headset-microphone shall be tested in accordance with method 103 of MIL-STD-202, test condition B. Upon completion of the test in 4.5.2 shall be performed (see 3.6.4). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,
