1、AMSC N/A FSC 5996 MIL-DTL-28875C 5 March 2012 SUPERSEDING MIL-DTL-28875B 30 March 2006 DETAIL SPECIFICATION AMPLIFIERS, RADIO-FREQUENCY AND MICROWAVE, SOLID-STATE, GENERAL SPECIFICATION FOR This specification is approved for use by all Departments and Agencies of the Department of Defense. 1. SCOPE
2、1.1 Scope. This specification establishes the general requirements for solid-state RF and microwave amplifiers and the verification requirements which must be met in the acquisition of amplifiers. Detail requirements, specific characteristics of amplifiers and other provisions are specified in the a
3、pplicable specification sheet. 1.2 Part or Identifying Number (PIN). PINs to be used for amplifiers acquired to this specification are created as follows. This PIN consists of the letter “M” followed by the basic number of the specification sheet, an assigned dash (see 3.1), and the letter N or S, w
4、here N indicates a non-screened item and S1 or S2 indicates a screened item. The S2 items require more testing than the S1 items (see table III). M28875/1 -01 N or S1 or S2 | | | | Military designator and Dash number designated Non-screened Screened specification sheet no. on specification sheet 1.2
5、.1 Military designation. The M28875 military designator for amplifiers means a “MIL” specification item produced in full compliance with the specification and the referenced specification sheet. Any item which does not meet all the applicable requirements of this specification and the applicable spe
6、cification sheet should not make any representation of being fully compliant with MIL-DTL-28875. Comments, suggestions or questions on this document should be addressed to DLA Land and Maritime, ATTN: VAT, Post Office Box 3990, Columbus, OH 43218-3990), or emailed to TubesAmpsdla.mil. Since contact
7、information can change, you may want to verify the currency of this address information using the ASSIST Online database at https:/assist.daps.dla.mil. INCH-POUND Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-DTL-28875C 2 2. APPLICABLE DOCUMENT
8、S 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the
9、completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications,
10、 standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract (see 6.2). FEDERAL STANDARDS FED-STD-H28 - Screw-Thread Standards for Federal Services. COMMERCIAL ITEM DES
11、CRIPTIONS A-A-59126 - Terminals, Feedthru (Insulated) and Terminals, Stud (Insulated and Noninsulated). DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-DTL-3643 - Connectors, Coaxial, Radio Frequency, Series HN and Associated Fittings, General Specification for. (Inactive for new design.) MIL-DTL-3650 - Co
12、nnectors, Coaxial, Radio Frequency, Series LC. MIL-DTL-3922 - Flanges, Waveguide, General Purpose, General Specification for. MIL-DTL-5541 - Chemical Conversion Coatings on Aluminum and Aluminum Alloys. MIL-DTL-14072 - Finishes for Ground Based Electronic Equipment. MIL-DTL-16878 - Wire, Electrical,
13、 Insulated, General Specification for. MIL-PRF-19500 - Semiconductor Devices, General Specification for. MIL-DTL-24308 - Connectors, Electric, Rectangular, Non-environmental Miniature Polarized Shell, Rack and Panel, General Specification for. MIL-P-24691/3 - Pipe and Tube, Corrosion-Resistant, Stai
14、nless Steel, Seamless or Welded. MIL-H-28719 - Headers, Hermetically Sealed. MIL-PRF-31032 - Printed Circuit Board/Printed Wiring Board, General Specification for. MIL-PRF-39012 - Connectors, Coaxial, Radio Frequency; General Specification for. MIL-DTL-55302 - Connectors, Printed Circuit Subassembly
15、 and Accessories. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Electronic and Electrical Component Parts. MIL-STD-461 - Requirements for the Control of Electromagnetic Interference Characteristics of Subsystems and Equipment. MIL-STD-464 - Electromagnetic Environmental Effects Requirements for Syst
16、ems. MIL-STD-883 - Microcircuits. MIL-STD-889 - Dissimilar Metals. MIL-STD-1276 - Leads for Electronic Component Parts. MIL-STD-1285 - Marking of Electrical and Electronic Parts. MIL-STD-2073-1 - DoD Standard Practice for Military Packaging. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-454 - General Gui
17、delines for Electronic Equipment. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-DTL-28875C 3 (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or https:/assist.daps.dla.mil/ or from the Standardization D
18、ocument Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) See supplement 1 for list of associated specification sheets. 2.3 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issue
19、s of the documents are those cited in the solicitation or contract. ASTM INTERNATIONAL ASTM-A582/A582M - Bars, Free-Machining, Stainless Steel. ASTM-B26/B26M - Aluminum-Alloy Sand Castings. ASTM-B108/B108M - Aluminum-Alloy Permanent Mold Castings. ASTM-B209 - Aluminum and Aluminum-Alloy Sheet and Pl
20、ate. ASTM-B211 - Aluminum and Aluminum-Alloy Bar, Rod, and Wire. ASTM-B339 - Pig Tin. ASTM-B488 - Gold for Engineering Uses, Electrodeposited Coatings of. ASTM-B545 - Tin, Electrodeposited Coatings of. ASTM-B700 - Standard Specification for Electrodeposited Coatings of Silver for Engineering Use AST
21、M-D1710 - Tubing, Extruded and Compression Molded Polytetrafluoroethylene (PTFE) Rod and Heavy Walled. ASTM-D4894 - Polytetrafluoroethylene (PTFE) Granular Molding General Specification for. SAE-AMS-QQ-A-250 - Aluminum and Aluminum Alloy, Plate and Sheet. SAE-AMA-QQ-S-763 - Steel Bars, Wire, Shapes,
22、 and Forgings; Corrosion Resistant. SAE-AMS-2422 - Plating, Gold, Electronic and Electrical Applications. SAE-AMS-2404 - Plating, Electroless Nickel. (Application for copies can be obtained online at http:/www.sae.org or can be requested from the SAE World Headquarters, 400 Commonwealth Drive, Warre
23、ndale, PA 15096-0001) (Industry association specifications and standards are generally available for reference from libraries. They are also distributed among technical groups and using Federal agencies.) 2.4 Order of preference. Unless otherwise noted herein or in the contract, in the event of a co
24、nflict between the text of this document and the references cited herein (except for related specification sheets), the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. Provided by IHS
25、Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-DTL-28875C 4 3. REQUIREMENTS 3.1 Specification sheets. The individual amplifier requirements shall be as specified herein and in accordance with the applicable specification sheets. In the event of any conflict be
26、tween requirements of the specification and the specification sheet, the latter shall govern. 3.2 Reference to specification sheet. For the purpose of this specification, when the terms, “as specified”, “when specified” or “when applicable” are used without additional reference to a specific locatio
27、n or document, the intended reference shall be to the specification sheet. When the specification sheet does not contain the information, then the requirement is not applicable to that specific PIN or specification sheet. 3.3 First article. Amplifiers furnished under this specification shall be prod
28、ucts that have been tested and passed first article inspection (see 4.5 and 6.4). 3.4 Material. The material shall be as specified herein and in the applicable specification sheets. When a definite material is not specified, a material shall be used which will enable the amplifier to meet the perfor
29、mance requirements of this specification. Acceptance or approval of any constituent material shall not be construed as a guaranty of the acceptance of the finished product. 3.4.1 Aluminum alloys. Aluminum-alloy plates and sheets shall conform to SAE-AMS-QQ-A-200, ASTM-B211, AMS-QQ-A-250, or ASTM-B20
30、9. Aluminum-alloy casting shall conform to ASTM-B108/B108M or ASTM-B26/B26M. 3.4.2 Corrosion resisting steel. Corrosion resisting steel pipes shall conform to MIL-P-24691/3. Corrosion resisting forging shall conform to SAE-AMS-QQ-S-763. 3.4.3 Bonding. Bonding shall conform to MIL-STD-464. 3.4.4 Diss
31、imilar metals. Unless suitably protected against electrolytic corrosion, dissimilar metals, as defined in MIL-STD-889, shall not be in intimate contact or otherwise electrically connected to each other through an electrically conductive solution. 3.4.5 Fungus inert material. Material used in the con
32、struction of amplifiers must be fungus inert in accordance with guideline 4 of MIL-HDBK-454. 3.4.6 Insulating compounds. Insulating compounds shall conform to best manufacturing practice. 3.4.7 Plastics. Plastics shall conform to ASTM-D4894, ASTM-D4895, or PTFE of ASTM-D1710. 3.4.8 Headers. Headers
33、shall conform to MIL-H-28719. 3.4.9 Microcircuits. Unless otherwise specified, microcircuits utilized within amplifiers shall be in accordance with best manufacturing practice (see 3.4.21, 6.9). 3.4.10 Semiconductors. When the frequency permits, semiconductors shall be in accordance with MIL-PRF-195
34、00, JAN TX or JAN TXV level. 3.4.11 Printed circuit boards. Printed circuit boards shall be in accordance with MIL-PRF-31032. 3.4.12 External leads. Lead connections for a specific amplifier shall be a chemical composition conforming to MIL-STD-1276 or MIL-STD-202, method 208 and unless otherwise sp
35、ecified, shall be solderable. 3.4.13 Socket pins. Socket pins for a specific amplifier shall be in accordance with MIL-H-28719. 3.4.14 Terminals. Terminals for a specific amplifier shall be in accordance with A-A-59126. Provided by IHSNot for ResaleNo reproduction or networking permitted without lic
36、ense from IHS-,-,-MIL-DTL-28875C 5 3.4.15 Connectors. 3.4.15.1 Radio-frequency (RF) connectors. RF connectors for a specific amplifier shall be in accordance with MIL-PRF-39012, MIL-DTL-3643 or MIL-DTL-3650 as applicable. The gauging for the connection shall conform to the requirements of the applic
37、able specification. Connector type SMA center contacts shall be captivated. 3.4.15.1.1 Connector metal parts. Unless otherwise specified, the connector and the male center contact pins shall be made of corrosion-resisting steel, type 302 or 304 in accordance with SAE-AMS-QQ-S-763 or type 302 in acco
38、rdance with ASTM-A582/A582M. 3.4.15.2 Power connectors. Power connectors for specific amplifiers shall be in accordance with MIL-DTL-24308. 3.4.15.3 Printed circuit connectors. Printed circuit connectors for a specific amplifier shall be in accordance with MIL-DTL-55302. 3.4.16 Flanges. Flanges for
39、a specific amplifier shall be in accordance with MIL-DTL-3922. 3.4.17 Connection caps. All connections that are not normally sealed shall be capped with push-on plastic caps to prevent both damage and the entrance of moisture and foreign material during shipment and storage. 3.4.18 Fastening devices
40、. Fasteners and fastening devices must be in accordance with MIL-HDBK-454, guideline 12. 3.4.19 Wiring. Unless otherwise specified, all conventional hookup wiring used in a specific amplifier shall be in accordance with MIL-DTL-16878. 3.4.20 Threaded parts. All screw threads used in the construction
41、 of amplifiers shall be in accordance with FED-STD-H28. 3.4.21 Pure tin. The use of pure tin as an underplate or final finish is prohibited both internally and externally. Tin content of the amplifier components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of
42、3 percent lead, by mass (see 6.9). 3.4.22 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible, provided that the material meets or exceeds the operational and maintenance requirements
43、, and promotes economically advantageous life cycle costs. 3.5 Design and construction. Amplifiers shall be of the design, construction, and physical dimensions specified. 3.5.1 Frequency range. Amplifiers shall be designed to meet the electrical requirements throughout the specified frequency range
44、. 3.5.2 Bandwidth (when specified). Amplifiers shall be designed to meet the electrical requirements within the specified bandwidth. 3.5.3 Pulse mode (when specified). Amplifiers shall be designed to meet the electrical requirements with the specified pulse width, pulse repetition frequency (PRF), a
45、nd pulse power. 3.5.4 DC input power. Amplifiers shall be designed to operate within the specified limits of dc voltage and current. 3.5.5 RF input power (CW). Amplifiers shall not be damaged by RF input power equaling the specified maximum rating. 3.5.6 Impedance. 3.5.6.1 RF input and output impeda
46、nce. Unless otherwise specified, the impedance looking into the input and output connections shall be 50 ohms nominal. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-DTL-28875C 6 3.5.6.2 Video or monitor output impedance (when specified). The vi
47、deo or monitor output impedance shall be as specified. 3.5.7 Mounting. Amplifiers shall meet their specified requirements mounted in any position. 3.5.8 Housing. All metal housing shall be sealed to prevent entry of moisture and leakage of radiated electromagnetic interference (EMI). 3.5.9 Finish. U
48、nless otherwise specified, the finish shall be as specified in 3.5.9.1 through 3.5.9.3. 3.5.9.1 RF and power-mating surface. Mating surfaces shall be finished in gold, nickel, silver, or tin (see 3.4.21, 6.9) conforming to SAE-AMS-2422, ASTM-B488, SAE-AMS-2404, ASTM-B700, ASTM-B545, ASTM-B339 or pas
49、sivated stainless steel. The minimum thickness for gold and nickel plating shall be 10 microinches and 300 microinches, respectively. Nickel plating should be used only when other plating will not meet performance requirements. 3.5.9.2 External surfaces. All external surfaces except RF and power mating surfaces shall be finished in accordance with MIL-DTL-14072. 3.5.9.3 Aluminum alloys. Aluminum-alloy surfaces shall be nickel plated, gold pla
