1、 MILITARY SPECIFICATION PRINTED WIRING BOARD, FLEXIBLE OR RIGIDFLEX, GENERAL SPECIFICATION FOR Inactive for new design after 28 February 1999. For new design use MILPRF31032. AMSC N/A FSC 5998 The document and process conversion measures necessary to comply with this revision shall be completed by 0
2、1 September 2009. INCHPOUND MILP50884E 24 November 2008 SUPERSEDING MILP50884D w/AMENDMENT 2 29 May 2006 (See 6.6) Comments, suggestions or questions on this document should be addressed to: Defense Supply Center, Columbus, ATTN: DSCCVAC, P.O. Box 3990, Columbus, OH 432183990 or sent by electronic m
3、ail (e-mail) to 5998.Documentsdscc.dla.mil. Since contact information can change, you may want to verify the currency of address information using the ASSIST Online database at Universal Resource Locator (URL) http:/assist.daps.dla.mil. Provided by IHSNot for ResaleNo reproduction or networking perm
4、itted without license from IHS-,-,-ii This page intentionally left blank. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MILP50884E CONTENTS PARAGRAPH PAGE iii 1. SCOPE . 1 1.1 Scope 1 1.2 Classification . 1 1.2.1 Printed wiring board type 1 1.2.2 I
5、nstallation use 1 1.2.3 Rework capability 1 1.2.4 Flexible base material . 1 1.2.5 Rigid base material . 1 1.3 Description of this specification . 2 2. APPLICABLE DOCUMENTS 2 2.1 General 2 2.2 NonGovernment publications 2 2.3 Order of precedence 2 3. REQUIREMENTS . 2 3.1 General requirements 2 3.1.1
6、 Master drawing . 2 3.1.2 Conflicting requirements . 3 3.1.3 Terms and definitions 3 3.2 Qualification . 3 3.2.1 QPL . 3 3.2.2 QPL/QML 3 3.3 Product assurance requirements . 3 3.3.1 QPL product assurance 3 3.3.2 QPL/QML product assurance 3 3.4 Letters of interpretation and policy . 3 3.5 Recycled, r
7、ecovered, or environmentally preferable materials 4 3.6 Certification of conformance and acquisition traceability . 4 3.7 Qualifying activity onsite audit . 4 3.8 Workmanship . 4 4. VERIFICATION . 4 4.1 Classification of inspections . 4 4.2 Printed wiring board performance verification 5 4.2.1 QPL .
8、 5 4.2.2 QPL/QML 5 4.3 Qualification inspection 5 4.3.1 QPL . 5 4.3.2 QPL/QML 5 5. PACKAGING . 5 5.1 Packaging 5 6. NOTES 5 6.1 Intended use 5 6.2 Acquisition requirements . 5 6.3 Qualification . 6 6.3.1 Transference of qualification . 6 6.3.2 Retention of qualification . 6 6.3.2.1 Discussion 6 6.3.
9、3 Provisions Governing Qualification 6 6.3.4 QPL requalification 6 6.4 Terms and definitions 6 6.4.1 Acquiring activity . 6 6.4.2 Design standard 6 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MILP50884E CONTENTS PARAGRAPH PAGE iv 6.4.3 Printed wi
10、ring board type 7 6.4.3.1 Type 1 7 6.4.3.2 Type 2 7 6.4.3.3 Type 3 7 6.4.3.4 Type 4 7 6.4.3.5 Type 5 7 6.4.4 Product assurance 7 6.4.4.1 QML 7 6.4.4.2 QPL 7 6.4.4.3 QPL/QML . 7 6.4.5 Commercial and Government Entity (CAGE) code . 7 6.5 Compliant printed wiring boards 7 6.6 Supersession . 8 6.6.1 Sup
11、erseded types and classes . 8 6.6.2 Design, construction and verification. 8 6.6.3 Reference to superseded specifications . 8 6.7 Design standard 8 6.8 Environmentally preferable material 8 6.9 Subject term (key word) listing . 8 6.10 Changes from previous issue 8 APPENDIX A Product Assurance Requir
12、ements for Qualified Products List Programs 9 A.1. SCOPE 9 A.1.1 Scope . 9 A.2. APPLICABLE DOCUMENTS . 9 A.2.1 General 9 A.2.2 NonGovernment publications . 9 A.2.3 Order of precedence 9 A.3. REQUIREMENTS 10 A.3.1 General 10 A.3.1.1 Master drawing 10 A.3.2 Qualification . 10 A.3.2.1 QPL product assur
13、ance . 10 A.3.2.1.1 Product assurance procedures . 10 A.3.2.1.2 Facility changes 11 A.3.3 Design 11 A.3.3.1 Test coupons . 11 A.3.4 Materials . 11 A.3.4.1 Pure tin 11 A.3.4.2 Recycled, recovered, or environmentally preferable materials 11 A.3.5 External visual and dimensional requirements . 12 A.3.5
14、.1 Base material . 12 A.3.5.1.1 Edges of base materials 12 A.3.5.1.1.1 Edges of flexible sections . 12 A.3.5.1.1.2 Edges of rigid sections . 12 A.3.5.1.1.3 Edges between flexible and rigid sections 12 A.3.5.1.2 Surface imperfections . 12 A.3.5.1.3 Subsurface imperfections 13 A.3.5.1.3.1 Foreign incl
15、usions . 13 A.3.5.1.3.2 Subsurface spots 13 A.3.5.1.3.3 Adhesive voids . 13 A.3.5.1.3.4 Measling and crazing 13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MILP50884E CONTENTS PARAGRAPH PAGE v A.3.5.2 Conductor pattern 14 A.3.5.2.1 Annular ring,
16、external 14 A.3.5.2.2 Conductor spacing 14 A.3.5.2.3 Conductor width 14 A.3.5.2.4 Conductor pattern imperfections . 14 A.3.5.2.4.1 Cuts and scratches . 14 A.3.5.2.4.2 Dents 14 A.3.5.2.4.3 Pinholes 14 A.3.5.2.4.4 Pits . 14 A.3.5.2.4.5 Superfluous metal . 14 A.3.5.2.5 Conductor finish 15 A.3.5.2.5.1 C
17、overage 15 A.3.5.2.5.1.1 Conductor finish plating and coating voids in plated-through holes . 15 A.3.5.2.5.1.2 Edge board contacts 15 A.3.5.2.5.1.3 Plating junctions . 15 A.3.5.2.5.1.4 Solder mask . 15 A.3.5.2.5.2 Whiskers . 15 A.3.5.2.6 Component mounting 16 A.3.5.2.6.1 Rectangular surface mount la
18、nds . 16 A.3.5.2.6.2 Round surface mount lands (BGA pads) 16 A.3.5.2.6.3 Wire bond pads 16 A.3.5.3 Coverlayer . 16 A.3.5.3.1 Coverage 16 A.3.5.3.2 Delamination . 17 A.3.5.3.2.1 Wrinkles or creases 17 A.3.5.3.2.2 Continuous flex designs . 17 A.3.5.3.3 Cover coat cure . 17 A.3.5.3.4 Registration . 17
19、A.3.5.3.5 Thickness 18 A.3.5.3.6 Wicking of plated metals or solder 18 A.3.5.4 Dimensions of features 18 A.3.5.4.1 Hole pattern accuracy . 18 A.3.5.4.2 Ball grid array (BGA) lands . 18 A.3.5.5 Lifted lands and bonding of conductor to base material. 18 A.3.5.6 Registration, external (method I) . 18 A
20、.3.5.7 Solder mask . 19 A.3.5.7.1 Coverage 19 A.3.5.7.2 Discoloration . 19 A.3.5.7.3 Registration . 19 A.3.5.7.4 Solder mask cure 20 A.3.5.7.5 Thickness 20 A.3.5.8 Stiffeners . 20 A.3.5.8.1 Bonding . 20 A.3.5.8.2 Foreign material between the stiffener and printed wiring board surface 20 A.3.5.8.3 St
21、iffener access hole registration 20 A.3.5.9 Wicking of metallic conductor surface finish materials . 20 A.3.6 Plated hole structural requirements 20 A.3.6.1 Base material . 20 A.3.6.1.1 Adhesive voids 20 A.3.6.1.1.1 Non-stressed specimens 20 A.3.6.1.1.2 Stressed specimens . 21 A.3.6.1.2 Base materia
22、l cracks and voids. 21 A.3.6.1.2.1 Non-stressed specimens 21 A.3.6.1.2.2 Stressed specimens . 21 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MILP50884E CONTENTS PARAGRAPH PAGE vi A.3.6.1.3 Coverlayer thickness . 21 A.3.6.1.4 Delamination . 21 A.3
23、.6.1.5 Dielectric layer thickness . 21 A.3.6.1.6 Metal plane hole fill insulation material . 21 A.3.6.1.7 Hole wall to dielectric separation . 21 A.3.6.1.7.1 Non-stressed specimens 21 A.3.6.1.7.2 Stressed specimens . 21 A.3.6.1.8 Via fill of blind and buried vias . 21 A.3.6.2 Conductor finish . 22 A
24、.3.6.2.1 Dewetting 22 A.3.6.2.2 Nonwetting 22 A.3.6.2.3 Outgrowth and overhang . 22 A.3.6.2.4 Protective finishes for internal metal cores or metal backing 22 A.3.6.2.5 Thickness 22 A.3.6.3 Conductor thickness 22 A.3.6.3.1 Conductors with copper plating (after processing) 22 A.3.6.3.2 Conductors wit
25、hout copper plating (after processing) . 24 A.3.6.4 Conductor width . 24 A.3.6.4.1 Annular ring, internal . 24 A.3.6.4.2 Undercutting 24 A.3.6.5 Hole preparation prior to metallization . 24 A.3.6.5.1 Desmear (hole cleaning) . 24 A.3.6.5.2 Etchback . 25 A.3.6.6 Lifted lands 25 A.3.6.6.1 Non-stressed
26、specimens . 25 A.3.6.6.2 Stressed specimens 25 A.3.6.7 Plated-through hole plating 25 A.3.6.7.1 Copper plating thickness . 25 A.3.6.7.2 Copper plating defects 26 A.3.6.7.3 Copper plating voids . 26 A.3.6.7.4 Conductive interface separations 26 A.3.6.7.4.1 Copper to copper interfaces . 26 A.3.6.7.4.2
27、 Dissimilar metal interfaces 26 A.3.6.7.5 Wicking of copper plating 26 A.3.6.7.6 Via cap plating. 27 A.3.6.8 Hole wall deficiencies 27 A.3.6.9 Metallic cracks . 27 A.3.6.10 Nail-heading 27 A.3.7 Inspection requirements . 27 A.3.7.1 External visual and dimensional acceptability 27 A.3.7.2 Destructive
28、 physical analysis by metallographic evaluation of printed wiring board test specimens . 27 A.3.7.2.1 Non-stressed specimens . 27 A.3.7.2.2 Registration, internal . 27 A.3.7.2.2.1 By microsection (method II) 27 A.3.7.2.2.2 By registration test coupons (method III) 27 A.3.7.3 Chemical requirements 28
29、 A.3.7.3.1 Ionic contamination . 28 A.3.7.3.1.1 Prior to the application of solder mask 28 A.3.7.3.1.2 Completed inner layer prior to lamination . 28 A.3.7.3.1.3 Completed printed wiring boards 28 A.3.7.3.2 Resistance to solvents 28 Provided by IHSNot for ResaleNo reproduction or networking permitte
30、d without license from IHS-,-,-MILP50884E CONTENTS PARAGRAPH PAGE vii A.3.7.4 Physical requirements . 28 A.3.7.4.1 Adhesion, coverlayer . 28 A.3.7.4.2 Adhesion, legend and marking 28 A.3.7.4.3 Adhesion, plating . 28 A.3.7.4.4 Adhesion, solder mask 28 A.3.7.4.5 Bow and twist 29 A.3.7.4.6 Flexibility
31、endurance . 29 A.3.7.4.6.1 Qualification and periodic testing 29 A.3.7.4.6.2 User specified . 29 A.3.7.4.7 Folding flexibility 29 A.3.7.4.7.1 Qualification and periodic testing 29 A.3.7.4.7.2 User specified . 29 A.3.7.4.8 Rework simulation . 30 A.3.7.4.8.1 Grade R, types 1 and 5 with unsupported hol
32、es . 30 A.3.7.4.8.2 Grade R, types 2, 3 and 4 with plated-through holes 30 A.3.7.4.8.3 Grade U 30 A.3.7.4.9 Solderability 30 A.3.7.4.9.1 Hole (plated-through hole) solderability 30 A.3.7.4.9.2 Surface (or surface mount land) solderability . 30 A.3.7.4.10 Solder mask cure 30 A.3.7.4.11 Surface peel s
33、trength 30 A.3.7.5 Electrical requirements 31 A.3.7.5.1 Circuit continuity and shorts 31 A.3.7.5.1.1 Circuit continuity . 31 A.3.7.5.1.2 Circuit shorts . 31 A.3.7.5.2 Circuit or plated-through hole short to metal core substrate 31 A.3.7.5.3 Dielectric withstanding voltage 31 A.3.7.5.4 Impedance test
34、ing . 31 A.3.7.6 Environmental requirements 31 A.3.7.6.1 Moisture and insulation resistance 31 A.3.7.6.2 Resistance to soldering heat . 31 A.3.7.6.2.1 Solder float thermal stress 31 A.3.7.6.2.1.1 Types 1 and 5 31 A.3.7.6.2.1.2 Types 2, 3 and 4 31 A.3.7.6.3 Thermal shock . 32 A.3.8 Marking 32 A.3.8.1
35、 Product identification and test vehicle traceability codes . 32 A.3.8.2 Legend . 32 A.3.8.3 Methods of producing legend and marking 32 A.3.8.4 Marking legibility 32 A.3.8.5 Lot date code . 32 A.3.9 Traceability . 33 A.3.9.1 Qualityconformance test circuitry, test coupons, and microsection mounts .
36、33 A.3.9.2 Printed board materials 33 A.3.9.3 Serialization . 33 A.3.9.4 Quality records 33 A.3.10 Repair . 33 A.3.11 Recycled, recovered, or environmentally preferable materials . 33 A.3.12 Workmanship . 33 A.4. VERIFICATION 34 A.4.1 Classification of inspections . 34 A.4.2 Test and measuring equip
37、ment 34 A.4.3 Inspection conditions 34 A.4.4 Printed wiring board performance verification 34 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MILP50884E CONTENTS PARAGRAPH PAGE viii A.4.5 Qualification inspection 34 A.4.5.1 Qualification eligibility
38、34 A.4.5.2 Qualification test specimens 34 A.4.5.2.1 Printed wiring board type 35 A.4.5.2.2 Installation use 35 A.4.5.2.3 Conductor surface finish . 35 A.4.5.2.4 Foil lamination . 35 A.4.5.2.5 Solder mask 35 A.4.5.2.6 Rework capability 35 A.4.5.3 Qualification test specimen sample size 35 A.4.5.3.1
39、Printed wiring board type 36 A.4.5.3.1.1 Inplant etchback capability 36 A.4.5.3.1.2 Contract services etchback. 36 A.4.5.3.2 Installation use 36 A.4.5.3.3 Conductor surface finish . 36 A.4.5.3.4 Foil lamination . 36 A.4.5.3.5 Solder mask 36 A.4.5.4 Inspection routines. 36 A.4.5.4.1 Manufacturer test
40、 routine (MTR) . 37 A.4.5.4.1.1 Printed wiring board type 37 A.4.5.4.1.2 Installation use 37 A.4.5.4.1.3 Conductor surface finish . 37 A.4.5.4.1.4 Foil lamination 37 A.4.5.4.1.5 Solder mask 37 A.4.5.4.1.6 Disposition of sample units . 37 A.4.5.4.2 Certified suitable laboratory test routine (CTR) . 3
41、7 A.4.5.4.2.1 Printed wiring board type 37 A.4.5.4.2.2 Installation use 37 A.4.5.4.2.3 Conductor surface finish . 37 A.4.5.4.2.4 Foil lamination 37 A.4.5.4.2.5 Solder mask 37 A.4.5.4.3 Contract services 38 A.4.5.4.4 Qualification rejection 38 A.4.5.5 Extent of qualification . 38 A.4.5.5.1 Printed wi
42、ring board type 38 A.4.5.5.2 Installation use 38 A.4.5.5.3 Rework capability 38 A.4.5.5.4 Materials . 41 A.4.5.5.4.1 Base material types 41 A.4.5.5.4.1.1 Flexible base material 41 A.4.5.5.4.1.2 Rigid base material 41 A.4.5.5.4.2 Conductor surface finish . 41 A.4.5.5.4.3 Solder mask 41 A.4.5.5.4.4 St
43、iffeners 41 A.4.5.5.5 Processes . 41 A.4.5.5.5.1 Etchback . 41 A.4.5.5.5.2 Foil lamination 41 A.4.5.5.5.3 Mass lamination 41 A.4.5.5.6 Process changes . 41 A.4.5.6 Retention of qualification . 42 A.4.5.6.1 Failure to submit retention data . 42 A.4.5.6.2 Non-production during reporting period . 42 A.
44、4.5.6.3 Facility changes 42 A.4.5.7 Requalification . 42 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MILP50884E CONTENTS PARAGRAPH PAGE ix A.4.6 Inspection of product for delivery . 43 A.4.6.1 Inprocess inspection 43 A.4.6.1.1 Inspection lot . 43
45、 A.4.6.1.1.1 Subgroup 1 . 43 A.4.6.1.1.2 Subgroup 2 . 43 A.4.6.1.2 Sample size 43 A.4.6.1.3 Rejected lots . 43 A.4.6.2 Group A inspection 44 A.4.6.2.1 Inspection lot . 44 A.4.6.2.2 Sampling procedures 44 A.4.6.2.3 Rejected lots . 45 A.4.6.2.4 Disposition of sample units . 45 A.4.7 Periodic conforman
46、ce inspection . 47 A.4.7.1 Group B inspection 47 A.4.7.1.1 Inspection lot . 47 A.4.7.1.2 Sampling procedures 47 A.4.7.1.2.1 Sample unit selection . 47 A.4.7.1.3 Frequency . 48 A.4.7.1.4 Failures . 48 A.4.7.1.4.1 Corrective actions . 48 A.4.7.1.4.2 Noncompliance . 48 A.4.7.1.4.3 Reinstitution of grou
47、p A inspection . 48 A.4.7.1.5 Disposition of sample units . 48 A.4.7.2 Group C inspection 49 A.4.7.2.1 Inspection lot . 49 A.4.7.2.2 Sampling procedures 49 A.4.7.2.2.1 Sample unit selection . 49 A.4.7.2.3 Frequency . 49 A.4.7.2.4 Noncompliance . 50 A.4.7.2.5 Disposition of sample units . 50 A.4.8 Me
48、thods of inspection 50 A.4.8.1 Visual and dimensional inspection . 50 A.4.8.1.1 Annular ring, external 51 A.4.8.1.2 Overall printed wiring board thickness 51 A.4.8.1.2.1 With edge-board contacts . 51 A.4.8.1.2.2 Without edge board contacts 51 A.4.8.1.3 Registration, external (method I) . 51 A.4.8.1.
49、4 Solder mask thickness 51 A.4.8.1.5 Product identification (marking and traceability) 51 A.4.8.1.6 Alternate plating and coating measurement techniques 51 A.4.8.1.7 Wire bond pad surface roughness 51 A.4.8.1.8 Materials inspection 51 A.4.8.1.9 Workmanship 51 A.4.8.2 Microsection inspection . 52 A.4.8.2.1 Plated-through hole inspect
