DLA MIL-PRF-19500 474 G-2008 SEMICONDUCTOR DEVICE SILICON MULTIPLE DIODE ARRAYS TYPES 1N5768 1N5770 1N5772 1N5774 1N6100 1N6101 1N6496 1N6506 1N6507 1N6508 1N6509 1N6510 AND 1N6511.pdf

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DLA MIL-PRF-19500 474 G-2008 SEMICONDUCTOR DEVICE SILICON MULTIPLE DIODE ARRAYS TYPES 1N5768 1N5770 1N5772 1N5774 1N6100 1N6101 1N6496 1N6506 1N6507 1N6508 1N6509 1N6510 AND 1N6511.pdf_第1页
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1、INCH-POUNDMIL-PRF-19500/474G 22 August 2008 SUPERSEDING MIL-PRF-19500/474F 23 January 2007 PERFORMANCE SPECIFICATION SHEET SEMICONDUCTOR DEVICE, SILICON, MULTIPLE DIODE ARRAYS, TYPES 1N5768, 1N5770, 1N5772, 1N5774, 1N6100, 1N6101, 1N6496, 1N6506, 1N6507, 1N6508, 1N6509, 1N6510, AND 1N6511, JAN, JANT

2、X, JANTXV, AND JANS This specification is approved for use by all Departments and Agencies of the Department of Defense. The requirements for acquiring the product described herein shall consist of this specification sheet and MIL-PRF-19500. 1. SCOPE 1.1 Scope. This specification covers the performa

3、nce requirements for silicon, multiple diode arrays. Four levels of product assurance are provided for each device type as specified in MIL-PRF-19500. 1.2 Physical dimensions. See figures 1, 2, 3, 4, 5, 6, 7, and 8. 1.3 Maximum ratings. Unless otherwise specified TA= +25C. Type VBR(R)1/ 2/ IO1/ 3/ T

4、A= +25C IFSM1/ tp= 1/120 s PTTA= +25C TJTSTG1N5768 1N5770 1N5772 1N5774 1N6496 1N6506 1N6507 1N6508 1N6509 1N6100 1N6101 1N6510 1N6511 V dc 60 60 60 60 60 60 60 60 60 75 75 75 75 mA dc 300 300 300 300 300 300 300 300 300 300 300 300 300 mA dc 500 500 500 500 500 500 500 500 500 500 500 500 500 mW 4/

5、 500 4/ 500 4/ 500 4/ 500 4/ 500 5/ 600 5/ 600 5/ 600 5/ 600 4/ 500 5/ 600 4/ 500 5/ 600 C -65 to +175 C -65 to +200 1/ Each diode. 2/ Pulsed: PW = 100 ms maximum; duty cycle 20 percent. 3/ Derate at 2.0 mA/C above +25C. 4/ Derate at 3.33 mW/C above +25C. 5/ Derate at 4.0 mW/C above +25C. AMSC N/A F

6、SC 5961 Comments, suggestions, or questions on this document should be addressed to Defense Supply Center, Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to semiconductordscc.dla.mil . Since contact information can change, you may want to verify the currency of this add

7、ress information using the ASSIST Online database at http:/assist.daps.dla.mil . The documentation and process conversion measures necessary to comply with this revision shall be completed by 22 November 2008.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from I

8、HS-,-,-MIL-PRF-19500/474G 2 * 1.4 Primary electrical characteristics, each diode. VF1(1) IF= 100 mA dc VF2 1/ IF= 500 mA dc IR1VR= 40 V dc CttfrIF= 500 mA dc trrIF= IR= 200 mA dc RL= 100 Irr= 20 mA dc Type V dc V dc A dc pF ns ns 1N5768 1N5770 1N5772 1N5774 1N6496 1N6506 1N6507 1N6508 1N6509 Min Max

9、 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Min Max 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 Min Max 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 Min Max 4 8 8 8 8 4 8 8 8 Min Max 40 40 40 40 40 40 40 40 40 Min Max 20 20 20 20 20 20 20 20 20 VF1IF= 100 mA dc IR2 VR= 20 V dc Ct tfrIF= 100 mA dc trrIF= IR= 10 mA dc RL= 10

10、0 Irr= 1 mA dc Type V dc nA dc pF ns ns 1N6100 1N6101 1N6510 1N6511 Min Max 1.0 1.0 1.0 1.0 Min Max 25 25 25 25 Min Max 4 4 4 4 Min Max 15 15 15 15 Min Max 10 10 10 10 (1) Pulsed: PW = 300 s 50 s, duty cycle 2 percent, 90 s after leading edge of pulse. Provided by IHSNot for ResaleNo reproduction or

11、 networking permitted without license from IHS-,-,-MIL-PRF-19500/474G 3 Inches Millimeters Inches Millimeters Symbol Min Max Min Max Notes Symbol Min Max Min Max Notes BL .290 7.37 3 LO1.005 0.13 7, 8 BW .235 .260 5.97 6.60 LO2.005 .050 0.13 1.27 2 BW1.125 3.18 LS .050 BSC 1.27 BSC 4, 6 BW2.030 0.76

12、 LT .003 .006 0.08 0.15 5 CH .030 .095 0.76 2.41 LU .280 7.11 3 LL .240 .370 6.10 9.40 LW .010 .019 0.25 0.48 5 LO .045 1.14 7 TL .008 .015 0.20 0.38 1 NOTES: 1. Index area: A notch or a pin 1 identification mark shall be located adjacent to pin 1 and shall be within the shaded area shown. The manuf

13、acturers identification shall not be used as a pin 1 identification mark. Alternatively, a tab (dimension TL) may be used to identify pin 1. This tab may be located on either side as shown. If a pin 1 identification mark is used in addition to this tab, the minimum limit of dimension TL does not app

14、ly. 2. Dimension LO2shall be measured at the point of exit of the lead from the body. Dimension LO2shall be .0085 inch (0.216 mm) minimum when lead finish A is solder. 3. These dimensions allow for off-center lid, meniscus, and glass overrun. 4. The basic pin spacing is .050 inch (1.27 mm) between c

15、enterlines. Each pin centerline shall be located within .005 inch (0.13 mm) of its exact longitudinal position relative to pins 1 and 10. 5. All leads: Dimensions are pre-solder dip. 6. Eight spaces. 7. Applies to all four corners (lead numbers 1, 5, 6, and 10). 8. Dimension LO may be .000 inch (0.0

16、0 mm) if lead numbers 1, 5, 6, and 10 bend toward the cavity of the package within one lead width from the point of entry of the lead into the body. For all bottom-brazed or side-brazed configurations, dimension LO shall be measured from the edge of the furthest extension of the metal pad or lead. 9

17、. Optional configuration. If this configuration is used, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 10. Dimensions are in inches. Millimeters are given for general information only. FIGURE 1. Physical dimensions for types 1N5768, 1N5770, and 1N

18、5772. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/474G 4 NOTES: This package is inactive and shall be replaced with the package on figure 3. 1. Index area: A notch or a pin 1 identification mark shall be located adjacent to pin 1 an

19、d shall be within the shaded area shown. The manufacturers identification shall not be used as a pin 1 identification mark. Alternatively, a tab (dimensions TL) may be used to identify pin 1. This tab may be located on either side as shown. If a pin 1 identification mark is used in addition to this

20、tab, the minimum limit of dimension TL does not apply. 2. Dimension LO2shall be measured at the point of exit of the lead from the body. Dimension LO2shall be .0085 inch (0.216 mm) minimum when lead finish A is applied. 3. These dimensions allow for off-center lid, meniscus, and glass overrun. 4. Th

21、e basic pin spacing is .050 inch (1.27 mm) between centerlines. Each pin centerline shall be located within .005 inch (0.13 mm) of its exact longitudinal position relative to pins 1 and 14. 5. All leads: Increase maximum limit by .003 inch (0.08 mm) measured at the center of the flat, when lead fini

22、sh A is applied. Dimensions given are pre-solder dip. 6. Twelve places. 7. Applies to all four corners (lead numbers 2, 6, 9, and 13). 8. Dimensions LO may be .000 inch (0.00 mm) if lead numbers 2, 6, 9, and 13 bend toward the cavity of the package within one lead width from the point of entry of th

23、e lead into the body. 9. Applies to lead numbers 1, 7, 8, and 14. 10. Lead configuration is optional within dimension BW except dimensions LT and LW apply. 11. Dimensions are in inches. Millimeters are given for general information only. FIGURE 2. Physical dimensions for types 1N5774 and 1N6100. Inc

24、hes Millimeters Symbol Min Max Min Max Notes BL .280 7.11 4 BW .235 .260 5.97 6.60 CH .030 .095 0.76 2.41 LL .250 .370 6.35 9.40 LO2.010 .040 0.25 1.02 3 LO .005 0.13 8 LO3.004 0.10 9 LS .050 BSC 1.27 BSC 6 LT .003 .006 0.08 0.15 5 LU .280 7.11 4 LW .010 .019 0.25 0.48 5 TL .008 .015 0.20 0.38 1 Pro

25、vided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/474G 5 NOTES 1. Index area: A notch or a pin 1 identification mark shall be located adjacent to pin 1 and shall be within the shaded area shown. The manufacturers identification shall not be

26、used as a pin 1 identification mark. 2. Dimension LO2shall be measured at the point of exit of the lead from the body. Dimension LO2minimum shall be reduced by .0015 inch (0.038 mm) maximum when lead finish is solder. 3. These dimensions allow for off-center lid, meniscus, and glass overrun. 4. The

27、basic pin spacing is .050 inch (1.27 mm) between centerlines. Each pin centerline shall be located within .005 inch (0.13 mm) of its exact longitudinal position relative to pins 1 and 14. 5. All leads: Dimensions are pre-solder dip. 6. Twelve spaces. 7. Applies to all four corners. 8. Dimensions LO

28、may be .000 inch (0.00 mm) if lead numbers 1, 7, 8, and 14 bend toward the cavity of the package within one lead width from the point of entry of the lead into the body. 9. If this configuration is used, no organic or polymeric materials shall be molded to the bottom of the package to cover the lead

29、s. 10. Lead configuration is optional within dimension BW except dimensions LW and LT apply. 11. Dimensions are in inches. Millimeters are given for general information only. * FIGURE 3. Alternate physical dimensions for types 1N5774 and 1N6100. Inches Millimeters Symbol Min Max Min Max Notes BL .39

30、0 9.91 3 BW .235 .280 5.97 6.60 BW1.125 3.18 BW2.030 0.76 CH .045 .095 1.14 2.41 LL .250 .370 6.35 9.40 LO .005 0.13 7, 8 LO2.010 .045 0.66 1.14 2 LS .050 BSC 1.27 BSC 4, 6 LT .003 .006 0.08 0.15 5 LU .280 7.11 3 LW .010 .019 0.25 0.48 5 Provided by IHSNot for ResaleNo reproduction or networking per

31、mitted without license from IHS-,-,-MIL-PRF-19500/474G 6 NOTES: 1. Index area: A notch or a pin 1 identification mark shall be located adjacent to pin 1 and shall be within the shaded area shown. The manufacturers identification shall not be used as a pin 1 identification mark. 2. The minimum limit

32、for dimension LW1may be .023 inch (0.58 mm) for lead numbers 1, 7, 8, and 14 only. 3. Dimension LO2shall be measured from the seating plane to the base plane. 4. This dimension allows for off-center lid, meniscus, and glass overrun. 5. The basic pin spacing is .100 inch (2.54 mm) between centerlines

33、. Each pin centerline shall be located within .010 inch (0.25 mm) of its exact longitudinal position relative to pins 1 and 14. 6. Applies to all four corners (lead numbers 1, 7, 8, and 14). 7. Lead center when is 0 degrees. BW1shall be measured at the centerline of the leads. 8. All leads: Dimensio

34、ns are pre-solder dip. Pointed or round lead ends are allowed. 9. Twelve spaces. 10. Dimensions are in inches. Millimeters are given for general information only. FIGURE 4. Physical dimensions for types 1N6506, 1N6507, 1N6508, 1N6509, and 1N6511. Inches Millimeters Symbol Min Max Min Max Notes BH .2

35、00 5.08 BL .785 19.94 4 BW .220 .310 5.59 7.87 4 BW1.290 .320 7.37 8.13 7 LL .100 .200 2.54 5.08 LL1.150 3.81 LO .005 0.13 6 LO1.098 2.49 6 LO2.015 .060 0.38 1.52 3 LS .100 BSC 2.54 BSC 5, 9 LT .008 .015 0.20 0.38 8 LW .014 .023 0.36 0.58 8 LW1.020 .070 0.51 1.78 2, 8 0 15 0 15 Provided by IHSNot fo

36、r ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/474G 7 NOTES: 1. Index area: A notch or a pin 1 identification mark shall be located adjacent to pin 1 and shall be within the shaded area shown. The manufacturers identification shall not be used as a pin 1 i

37、dentification mark. 2. The minimum limit for dimension LW1may be .020 inch (0.51 mm) for lead numbers 1, 8, 9, and 16 only. 3. Dimension LO2shall be measured from the seating plane to the base plane. 4. This dimension allows for off-center lid, meniscus, and glass overrun. 5. The basic pin spacing i

38、s .100 inch (2.54 mm) between centerlines. Each pin centerline shall be located within .010 inch (0.25 mm) of its exact longitudinal position relative to pins 1 and 16. 6. Applies to all four corners (lead numbers 1, 8, 9, and 16). 7. Lead center when is 0 degrees. BW1shall be measured at the center

39、line of the leads. 8. All leads: Dimensions are pre-solder dip. Pointed or round lead ends are allowed. 9. Fourteen spaces. 10. Dimensions are in inches. Millimeters are given for general information only. FIGURE 5. Physical dimensions for type 1N6101. Inches Millimeters SymbolMin Max Min Max Notes

40、BH .200 5.08 BL .785 19.94 4 BW .220 .310 5.59 7.87 4 BW1.290 .320 7.37 8.13 7 LL .100 .200 2.54 5.08 LL1.150 3.81 LO .005 0.13 6 LO1.098 2.49 6 LO2.015 .060 0.38 1.52 3 LS .100 BSC 2.54 BSC 5, 9 LT .008 .015 0.20 0.38 8 LW .014 .023 0.36 0.58 8 LW1.030 .070 0.76 1.78 2, 8 0 15 0 15 Provided by IHSN

41、ot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/474G 8 NOTES: 1. Index area: A notch or a pin 1 identification mark shall be located adjacent to pin 1 and shall be within the shaded area limited by pin 3 and package centerline. The manufacturers identi

42、fication shall not be used as a pin 1 identification mark. 2. This dimension allows for off-center lid, meniscus, and glass overrun. 3. The true position pin spacing is located within .005 inch (0.13 mm) of its true longitudinal position relative to pins 1 and 20. 4. Dimension LO2shall be measured a

43、t the point of exit of the lead from the body. 5. Eighteen spaces. 6. All leads: Dimensions are pre-solder dip. 7. Dimensions are in inches. Millimeters are given for general information only. FIGURE 6. Physical dimensions for type 1N6496. Inches Millimeters SymbolMin Max Min Max NotesBL .255 .278 6

44、.48 7.06 BL1.288 7.32 2 BW .194 .200 4.93 5.08 CH .045 .095 1.14 2.41 LL .265 .290 6.73 7.37 LL1.724 .780 18.39 19.81 LO2.020 .025 0.51 0.64 4 LS .030 TP 0.76 TP 3, 5 LT .004 .006 0.10 0.15 6 LU .210 5.33 2 LW .010 .019 0.25 0.48 6 Provided by IHSNot for ResaleNo reproduction or networking permitted

45、 without license from IHS-,-,-MIL-PRF-19500/474G 9 NOTES: 1. This package is inactive and shall be replaced with the package on figure 8. 2. Index area: A notch or a pin 1 identification mark shall be located adjacent to pin 1 and shall be within the shaded area limited by pin 3 and package centerli

46、ne. The manufacturers identification shall not be used as a pin 1 identification mark. 3. This dimension allows for off-center lid, meniscus, and glass overrun. 4. The true position pin spacing is located within .005 inch (0.13 mm) of its true longitudinal position relative to pins 1 and 16. 5. Dime

47、nsion LO2shall be measured at the point of exit of the lead from the body. 6. Fourteen spaces. 7. All leads: Dimensions are pre-solder dip. 8. Dimensions are in inches. Millimeters are given for general information only. 9. If this configuration is used, no organic or polymeric materials shall be mo

48、lded to the bottom of the package to cover the leads. FIGURE 7. Physical dimensions for type 1N6510. Inches Millimeters SymbolMin Max Min Max Notes BL .370 .400 9.40 10.16 BL1.020 0.51 2 BW .245 .260 6.22 6.60 BW1.015 0.38 BW20.030 0.76 CH .045 .095 1.14 2.41 LL .250 .370 6.35 9.40 LL1.015 0.38 LO2.025 .040 0.64 1.02 4 LS .050 BSC 1.27 BSC 3, 5 LT .003 .008 0.08 0.20 7 LW .015 .019 0.38 0.48 7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/474G 10 NOTES: 1. Index area: A notch or a pin 1 identi

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