1、 MIL-PRF-19500/657B 26 January 2011 SUPERSEDING MIL-PRF-19500/657A 22 February 2000 * PERFORMANCE SPECIFICATION SHEET SEMICONDUCTOR DEVICE, FIELD EFFECT, RADIATION HARDENED, TRANSISTOR DIE, N AND P-CHANNEL, SILICON VARIOUS TYPES JANHC AND JANKC This specification is approved for use by all Departmen
2、ts and Agencies of the Department of Defense. * The requirements for acquiring the product described herein shall consist of this specification sheet and MIL-PRF-19500. 1. SCOPE 1.1 Scope. This specification covers the performance requirements for N and P-channel, enhancement-mode, MOSFET, radiation
3、 hardened, power transistor die. Two levels of product assurance are provided for each device type as specified in MIL-PRF-19500. * 1.2 Physical dimensions. See figures 1 through 8 herein. 1.3 Maximum ratings. See the applicable performance specification sheet from table I herein. 2. APPLICABLE DOCU
4、MENTS * 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to en
5、sure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed. 2.2 Government documents. * 2.2.1 Specifications, standards, and handbooks. The following s
6、pecifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. * DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-19500 - Semiconductor Devices, General Specif
7、ication for. * DEPARTMENT OF DEFENSE STANDARDS MIL-STD-750 - Test Methods for Semiconductor Devices. * (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or https:/assist.daps.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Buildi
8、ng 4D, Philadelphia, PA 19111-5094.) AMSC N/A FSC 5961 INCH-POUND The documentation and process conversion measures necessary to comply with this revision shall be completed by 26 April 2011. * Comments, suggestions, or questions on this document should be addressed to DLA Land and Maritime, ATTN: V
9、AC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to Semiconductordscc.dla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at https:/assist.daps.dla.mil/. Provided by IHSNot for ResaleNo reproduction or
10、networking permitted without license from IHS-,-,-MIL-PRF-19500/657B 2 * 2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in thi
11、s document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 General. The requirements for acquiring the product described herein shall consist of this document and MIL-PRF-19500. 3.2 Qualification. Devices furnished under this sp
12、ecification shall be products that are manufactured by a manufacturer authorized by the qualifying activity for listing on the applicable Qualified Manufacturers List (QML) before contract award (see 4.2 and 6.3). 3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions u
13、sed herein shall be as specified in MIL-PRF-19500. * 3.4 Interface and physical dimensions. The interface and physical dimensions shall be as specified in MIL-PRF-19500, and figures 1 through 8 herein. 3.4.1 Lead finish, material, and thickness. The metallization shall be aluminum for the top and ch
14、rome-nickel-silver for the bottom. The nominal thickness of top metallization shall be 3 m (4 m nominal for all 60V die). The nominal thickness of back metallization shall be 0.55 m. 3.5 Electrostatic discharge protection. The devices covered by this specification require electrostatic protection. *
15、 3.5.1 Handling. MOS devices must be handled with certain precautions to avoid damage due to the accumulation of static charge. However, the following handling practices are recommended (see 3.5). a. Devices should be handled on benches with conductive handling devices. b. Ground test equipment, too
16、ls, and personnel handling devices. c. Do not handle devices by the leads. d. Store devices in conductive foam or carriers. e. Avoid use of plastic, rubber, or silk in MOS areas. f. Maintain relative humidity above 50 percent if practical. g. Care should be exercised during test and troubleshooting
17、to apply not more than maximum rated voltage to any lead. h. Gate must be terminated to source, R 100 k, whenever bias voltage is to be applied drain to source. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/657B 3 2N7261, 2N7262, 2N73
18、80, 2N7381, 2N7382, 2N7383, 2N7389, 2N7390 NOTES: 1. Dimensions are in inches. * 2. Millimeters are given for general information only. * FIGURE 1. JANHCA and JANKCA (A-version) die dimensions for 2N7261, 2N7262, 2N7380, 2N7381, 2N7382, 2N7383, 2N7389, and 2N7390. Dimensions Ltr Inches Millimeters M
19、in Max Min Max BL .173 .189 4.39 4.80 BW .108 .124 2.74 3.15 OAH .0145 .0175 0.368 0.445 LL1 .042 .044 1.07 1.12 LL2 .029 .031 0.74 0.79 LL3 .0195 .0205 0.495 0.521 LL4 .026 .028 0.66 0.71 * * * * Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-P
20、RF-19500/657B 4 2N7261, 2N7262, 2N7380, 2N7381 Dimensions - 2N7261, 2N7380 Dimensions - 2N7262, 2N7381 Ltr Inches Millimeters Inches Millimeters Min Max Min Max Min Max Min Max A .181 .185 4.60 4.70 .179 .183 4.55 4.65 B .116 .120 2.95 3.05 .114 .118 2.90 3.00 C .032 .034 .81 .86 .028 .030 .71 .76 D
21、 .017 .019 .43 .48 .018 .020 .46 .51 E .024 .026 .61 .66 .024 .026 .61 .66 F .035 .037 .89 .94 .033 .036 .84 .91 NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Unless otherwise specified, tolerance is .005 inch (0.13 mm). 4. The physical characteristics
22、 of the die are: The back metals are chromium, nickel, and silver and the back contact is the drain. The top metal is aluminum. 5. Die thickness is .015 inch (0.38 mm) .001 inch (0.025 mm). * FIGURE 2. JANHCB and JANKCB (B-version) die dimensions for 2N7261, 2N7262, 2N7380 and 2N7381. Provided by IH
23、SNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/657B 5 2N7382, 2N7389 Dimensions - 2N7382, 2N7389 Ltr Inches Millimeters Min Max Min Max A .181 .185 4.60 4.70 B .116 .120 2.95 3.05 C .032 .034 .81 .86 D .017 .019 .43 .48 E .024 .026 .61 .66 F .035 .0
24、37 .89 .94 NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Unless otherwise specified, tolerance is .005 inch (0.13 mm). 4. The physical characteristics of the die are: The back metals are chromium, nickel, and silver and the back contact is the drain. T
25、he top metal is aluminum. 5. Die thickness is .015 inch (0.38 mm) .001 inch (0.025 mm). * FIGURE 3. JANHCB and JANKCB (B-version) die dimensions for 2N7382, 2N7389 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/657B 6 2N7268, 2N7269, 2
26、N7394, 2N7422, 2N7423 Dimensions Ltr Inches Millimeters Min Max Min Max BL .249 .265 6.33 6.74 BW .249 .265 6.33 6.74 OAH .0145 .0175 0.368 0.445 LL1 .069 .071 1.75 1.80 LL2 .047 .049 1.19 1.25 LL3 .0205 .0215 0.520 0.550 LL4 .03 .032 0.76 0.81 NOTES: 1. Dimensions are in inches. * 2. Millimeters ar
27、e given for general information only. * FIGURE 4. JANHC and JANKC A-version die dimensions for 2N7268, 2N7269, 2N7394, 2N7422, and 2N7423. * * * * Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/657B 7 2N7268 and 2N7269 Dimensions - 2N7
28、268 and 2N7269 Ltr Inches Millimeters Min Max Min Max A .254 .260 6.45 6.60 B .254 .260 6.45 6.60 C .028 .033 .71 .84 D .017 .022 .43 .56 E .047 .053 1.19 1.35 F .059 .065 1.50 1.65 NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Unless otherwise specifi
29、ed, tolerance is .005 inch (0.13 mm). 4. The physical characteristics of the die are: The back metals are chromium, nickel, and silver and the back contact is the drain. The top metal is aluminum. 5. Die thickness is .015 inch (0.38 mm) .001 inch (0.025 mm). * FIGURE 5. JANHCB and JANKCB (B-version)
30、 die dimensions for 2N7268 and 2N7269 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/657B 8 2N7270 Dimensions Ltr Inches Millimeters Min Max Min Max BL .249 .265 6.33 6.73 BW .249 .265 6.33 6.73 OAH .0155 .0185 0.394 0.470 LL1 .048 .05
31、0 1.22 1.27 LL2 .033 .035 0.84 0.89 LL3 .0205 .0215 0.520 0.550 LL4 .03 .032 0.76 0.81 NOTES: 1. Dimensions are in inches. * 2. Millimeters are given for general information only. * FIGURE 6. JANHC and JANKC A-version die dimensions for 2N7270. * * * * * * Provided by IHSNot for ResaleNo reproductio
32、n or networking permitted without license from IHS-,-,-MIL-PRF-19500/657B 9 2N7424, 2N7425, 2N7426, 2N7431, 2N7432, 2N7433, 2N7434, 2N7444 Dimensions Ltr Inches Millimeters Min Max Min Max BL .352 .368 8.94 9.35 BW .249 .265 6.33 6.73 OAH .0145 .0175 0.368 0.445 LL1 .079 .081 2.01 2.06 LL2 .079 .081
33、 2.01 2.06 LL3 .0195 .0205 0.495 0.521 LL4 .0231 .0241 0.587 0.612 NOTES: 1. Dimensions are in inches. * 2. Millimeters are given for general information only. * FIGURE 7. JANHC and JANKC A-version die dimensions for 2N7424, 2N7425, 2N7426, 2N7431, 2N7432, 2N7433, 2N7434, and 2N7444. * * * * Provide
34、d by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/657B 10 2N7391, 2N7392 Dimensions Ltr Inches Millimeters Min Max Min Max BL .352 .368 8.94 9.35 BW .249 .265 6.33 6.73 OAH .0145 .0175 0.368 0.445 LL1 .064 .066 1.63 1.68 LL2 .050 .052 1.27 1.32
35、LL3 .0205 .0215 0.52 0.55 LL4 .030 .032 0.76 0.81 NOTES: 1. Dimensions are in inches. * 2. Millimeters are given for general information only. * FIGURE 8. JANHC and JANKC A-version die dimensions for 2N7391 and 2N7392. * * * Provided by IHSNot for ResaleNo reproduction or networking permitted withou
36、t license from IHS-,-,-MIL-PRF-19500/657B 11 3.6 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in the applicable associated performance specification listed in table I herein. * TABLE I. Applicable performance s
37、pecification sheet. Type Performance Reference data Figure specification sheet Voltage (V dc) Channel Size 2N7261 or 2N7261U MIL-PRF-19500/601 100 N 3 1, 2 2N7262 or 2N7262U MIL-PRF-19500/601 200 N 3 1, 2 2N7394 or 2N7394U MIL-PRF-19500/603 60 N 5 4 2N7268 or 2N7268U MIL-PRF-19500/603 100 N 5 4, 5 2
38、N7269 or 2N7269U MIL-PRF-19500/603 200 N 5 4, 5 2N7270 or 2N7270U MIL-PRF-19500/603 500 N 5 6 2N7380 MIL-PRF-19500/614 100 N 3 1, 2 2N7381 MIL-PRF-19500/614 200 N 3 1, 2 2N7382 MIL-PRF-19500/615 100 P 3 1, 3 2N7383 MIL-PRF-19500/615 200 P 3 1 2N7389 or 2N7389U MIL-PRF-19500/630 100 P 3 1, 3 2N7390 o
39、r 2N7390U MIL-PRF-19500/630 200 P 3 1 2N7424U MIL-PRF-19500/655 60 P 6 7 2N7425U MIL-PRF-19500/655 100 P 6 7 2N7426U MIL-PRF-19500/655 200 P 6 7 2N7424 MIL-PRF-19500/660 60 P 6 7 2N7425 MIL-PRF-19500/660 100 P 6 7 2N7426 MIL-PRF-19500/660 200 P 6 7 2N7444 MIL-PRF-19500/661 200 N 6 7 2N7434 MIL-PRF-1
40、9500/661 250 N 6 7 2N7391 MIL-PRF-19500/661 400 N 6 8 2N7392 MIL-PRF-19500/661 500 N 6 8 2N7422 or 2N7422U MIL-PRF-19500/662 100 P 5 4 2N7423 or 2N7423U MIL-PRF-19500/662 200 P 5 4 2N7431 MIL-PRF-19500/663 60 N 6 7 2N7432 MIL-PRF-19500/663 100 N 6 7 2N7433 MIL-PRF-19500/663 200 N 6 7 2N7431U MIL-PRF
41、-19500/664 60 N 6 7 2N7432U MIL-PRF-19500/664 100 N 6 7 2N7433U MIL-PRF-19500/664 200 N 6 7 3.7 Marking. Marking shall be in accordance with MIL-PRF-19500. At the option of the manufacturer, marking may be omitted from the body, but shall be retained on the initial container. 3.8 Workmanship. Semico
42、nductor devices shall be processed in such a manner as to be uniform in quality and shall be free from other defects that will affect life, serviceability, or appearance. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/657B 12 4. VERIFI
43、CATION 4.1 Classification of inspections. The inspection requirements specified herein are classified as follows: a. Qualification inspection (element evaluation) (see 4.2). b. Conformance inspection (see 4.3) 4.2 Qualification inspection (element evaluation). Qualification inspection (element evalu
44、ation) shall be in accordance with MIL-PRF-19500, appendix G, and the applicable associated performance specification from table I herein. 4.3 Conformance inspection (group D). Conformance inspection (group D) shall be conducted in accordance with table E-VIII of MIL-PRF-19500 and the applicable ass
45、ociated performance specification from table I herein. 4.4 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows. 4.4.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750. 5. PACKAGING * 5.1 Pac
46、kaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requ
47、irements. Packaging requirements are maintained by the Inventory Control Points packaging activities within the Military Service or Defense Agency, or within the Military Services system commands. Packaging data retrieval is available from the managing Military Departments or Defense Agencys automat
48、ed packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES * (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory. The notes specified in MIL-PRF-19500 are applicable to this specification.) * 6.1 Intended use. Semiconductors conforming to this specification are intended for original equipment design applications and logistic support of existing equipment. * 6.2 Acquisition requirements. Acquisition documents should specify the following:
