1、 Comments, suggestions or questions on this document should be addressed to DLA Land and Maritime, ATTN: VAT, Post Office Box 3990, Columbus, OH 43218-3990, or emailed to mailto:Relaydla.mil. Since contact information can change, you may want to verify the currency of this address information using
2、the ASSIST Online database at https:/assist.dla.mil. AMSC N/A FSC 5945 MIL-PRF-28776E 10 September 2012 SUPERSEDING MIL-PRF-28776D 1 November 2002 PERFORMANCE SPECIFICATION RELAYS, HYBRID, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR This specification is approved for use by all Departments an
3、d Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification establishes the general requirements for relays that use a combination of solid state circuit input elements functioning with an electro-mechanical relay that performs the switching functions associated with control syst
4、em applications (see 6.1). These relays are designed to operate in low and medium power switching circuits with contact ratings up to 1 ampere alternating current (ac) or direct current (dc). The failure rate level is established at a confidence level of 90 percent for qualification and 60 percent f
5、or maintenance of qualification based on 100,000 cycles at +125C under rated load conditions specified herein. Excludes time delay relays. CAUTION: The use of any coil voltage less than the rated coil voltage will compromise the operation of the relay. CAUTION: Pick-up, hold, and dropout voltages ar
6、e for test purposes only and are not to be used as design criteria. For additional application and caution information, see 6.1. 1.2 Part or Identifying Number (PIN). The PIN consists of the letter “M“, the basic number of the specification sheet, an assigned dash number (see 3.1), and a suffix lett
7、er designating failure rate level (see table I) as shown in the following example: M 28776 -001 L | | | |_ M prefix Specification Dash Failure designator sheet numb number rate level 1.3 Failure rate (FR) level designation. The failure rate level designation is shown in table I (see 4.6). TABLE I. F
8、ailure rate level designation. Failure rate level designation Failure rate level (percent per 10,000 cycles) L M P R 3.0 1.0 0.1 0.01 INCH-POUND Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-28776E 2 2. APPLICABLE DOCUMENTS 2.1 General. The
9、 documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of th
10、is list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and ha
11、ndbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS (See supplement 1 for list of associated specifications.) DEPARTMENT OF DEFENSE STANDAR
12、DS MIL-STD-202 - Electronic and Electrical Component Parts. MIL-STD-690 - Failure Rate Sampling Plans and Procedures. MIL-STD-750-1 - Environmental Test Methods for Semiconductor Devices Part 1: Test Methods 1000 through 1999. MIL-STD-790 - Established Reliability and High Reliability Qualified Prod
13、ucts List (QPL) Systems for Electrical, Electronic and Fiber Optic Parts Specifications. MIL-STD-883 - Microcircuits. MIL-STD-1276 - Leads for Electronic Component Parts. MIL-STD-1285 - Marking of Electrical and Electronic Parts. MIL-STD-1686 - Electrostatic Discharge Control Program for Protection
14、of Electrical and Electronic Parts. Assemblies and Equipment (Excluding Electrically Initiated Explosive Devices). DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-263 - Electrostatic Discharge Control Handbook for Protection of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrical
15、ly Initiated Explosive Devices) (Metric). MIL-HDBK-338 - Electronic Reliability Design. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Non-Govern
16、ment publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM) ASTM B488 - Electrodeposited Coatings o
17、f Gold for Engineering Uses. (Copies of this document are available from the American Society for Testing and Materials, 100 Barr Harbor Drive, West Conshohocken, PA 19482-2959 or http:/www.astm.org.) INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS IEEE 315 - Graphic Symbols for Electric and Elect
18、ronic Diagrams (Including Reference Designation Letters) Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-28776E 3 (Copies of this document are available from http:/www.ieee.org/ or Institute of Electrical and Electronics Engineers (IEEE) Serv
19、ice Center, 445 Hoes Lane, P. O. Box 1331, Piscataway, NJ 08855-1331. TECHAMERICA EIA-557 - Statistical Process Control Systems. (Copies of this document are available from http:/www.techamerica.org/ or TechAmerica, 601 Pennsylvania Ave., NW, North Building, Ste. 600, Washington DC, 20004-2650.) 2.4
20、 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein (except for related specification sheets), the text of this document takes precedence. Nothing in this document, however, supersedes ap
21、plicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Specification sheets. The individual item requirements shall be as specified herein and in accordance with the applicable specification sheet. In the event of any conflict between requirements of this sp
22、ecification and the specification sheet, the latter shall govern. 3.2 Qualification. Relays furnished under this specification shall be products which are authorized by the qualifying activity for listing on the applicable qualified products list (QPL) at the time of award of contract (see 4.4 and 6
23、.3). 3.3 Reliability and Statistical process control (SPC). 3.3.1 Reliability. Reliability of relays furnished under this specification shall be established and maintained in accordance with the requirements and procedures specified in MIL-STD-790 and MIL-STD-690 with details and exceptions specifie
24、d in 4.2, 4.4.4, and 4.5. 3.3.2 Statistical process control (SPC). The contractor shall implement and use SPC techniques in the manufacturing process for parts covered by this specification. The SPC program shall be developed and maintained in accordance with EIA-557. The SPC program shall be docume
25、nted and maintained as part of the overall reliability assurance program as specified in MIL-STD-790. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-28776E 4 3.4 Materials. Materials shall be as specified herein. However, when a definite mat
26、erial is not specified, a material shall be used which will enable the relays to meet the performance requirements of this specification. Materials used externally shall be fungus inert, self-extinguishing, and shall not support combustion, nor give off noxious gases in harmful quantities. Materials
27、 used internally shall not give off gases in quantities sufficient to cause explosion of sealed enclosures, cause contamination of the contacts or other parts of the relay that will adversely affect life or reliability, or form current-carrying tracks when subjected to any of the tests specified her
28、ein. Cotton-filled or wood-flour-filled materials shall not be used. Ceramic used for external surfaces shall be glazed. The use of silicone (see 6.10) or silicone compounds for any purpose is prohibited. The selection of materials shall be such as to provide maximum shelf life. Acceptance or approv
29、al of any constituent material shall not be construed as a guaranty of the acceptance of the finished product. 3.4.1 Metals and plating. Metals shall be of a corrosion-resistant type or shall be plated or treated to resist corrosion. a. Use of pure tin, plating or otherwise, is prohibited internally
30、 and externally (see 6.7.1). Use of tin-lead finishes are acceptable provided that the minimum lead content is 3 percent. b. Use of zinc plating is prohibited internally and externally. c. Use of cadmium plating is prohibited internally and externally. d. The use of mercury or mercury compounds is p
31、rohibited. e. The use of magnesium or magnesium alloys is prohibited (not applicable to contacts). 3.4.1.1 Dissimilar metals. When dissimilar metals are used in intimate contact with each other, protection against electrolysis and corrosion shall be provided. The use of dissimilar metals in contact,
32、 which tends toward active electrolytic corrosion (particularly brass, copper, or steel used in contact with aluminum or aluminum alloy), is not acceptable. However, metal spraying or metal plating of dissimilar base metals to provide similar or suitable abutting surfaces is permitted. Dissimilar me
33、tals should be as defined in 6.7. In hermetic seals, the 0.25 volt difference between the header material and the housing material is not applicable. 3.4.2 Magnet wire. Magnet wire used shall enable the relay to meet the performance requirements of this specification. 3.5 Interface and construction
34、requirements. Relays shall meet the interface and construction requirements as specified such as weight and physical dimensions (see 3.1). 3.5.1 Case. Unless otherwise specified (see 3.1), the case shall not be electrically connected to the contacts or coil; however, it may be used as part of the ma
35、gnetic circuit. 3.5.1.1 Case grounding. When specified (see 3.1), means for connecting the relay case to ground shall be provided. 3.5.2 Sealing process. Relays shall be dried, degassed, and backfilled with an atmosphere and sealed by welding such that the requirements of this specification are met.
36、 Adjunct sealant (see 6.10), if used, must comply with the following characteristics: a. Shall not extend above 20 percent of the length of the exposed terminals above the glass meniscus. b. Trace color is permitted if it is a natural result of the sealant process. c. Shall form, after curing, a per
37、manent nonconductive, noncracking seal under all relay environments. 3.5.3 Contacts. Contacts shall have load ratings and arrangements (see MIL-STD-1285) as specified (see 3.1) and unless otherwise specified (see 3.1), shall be capable of carrying the maximum rated current continuously as well as ma
38、king and breaking the specified current under all environmental conditions specified herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-28776E 5 3.5.4 Coils. Coils shall be adequately insulated electrically from the contacts and the case
39、. The resistance and rated voltage (or current) shall be as specified (see 3.1). Unless otherwise specified (see 3.1), coils shall be designed for continuous operation at maximum rated voltage and temperature. 3.5.4.1 Terminal identification. When specified (see 3.1), a bead of contrasting color sha
40、ll be used to designate the X1 (positive, if applicable) terminal (see figure 1 and MIL-STD-1285). FIGURE 1. Symbols and marking for terminals. 3.5.5 Circuit diagram. The circuit diagram, as specified (see 3.1), shall be a terminal view. Circuit symbols shall be in accordance with IEEE-315. For rela
41、ys without an orientation tab, the circuit diagram, as specified (see 3.1), shall be orientated so that when the relay is held with the circuit diagram right side up as shown (see 3.1), and rotated away from the viewer about a horizontal axis through the diagram until the header terminals face the v
42、iewer, then each terminal shall be in the location shown in the circuit diagram. 3.5.6 Mounting means (see 3.1). 3.5.6.1 Bracket. Mounting brackets shall be an integral part of the relay, securely attached thereto in a manner to prevent any movement between the relay and the mounting bracket. 3.5.7
43、Terminals (see 3.1). Terminals shall be as specified herein. Manufacturer may supply hot solder dipped terminals provided that the hot solder dipping process has been approved by the qualifying activity and when specified on the individual purchase order (see 6.2.1a). Solder dipped terminals may be
44、.002 inch (0.051 mm) larger than the maximum dimension specified (see 3.1). 3.5.7.1 Solder-lug terminals. Solder-lug terminals shall be designed to accommodate two conductors, each rated to carry the maximum rated current of the contact or coil terminated. 3.5.7.2 Wire leads. Wire leads shall be as
45、specified (see 3.1). Optional, shortened wire leads may be supplied when specified on the individual purchase order (see 3.1 and 6.2.1b). 3.5.7.2.1 Wire leads, solder pin (SP). Solder pin wire leads shall be as specified (see 3.1). 3.5.7.3 Plug-in termination. Plug-in terminations shall conform to t
46、he arrangements or dimensions as specified (see 3.1). The mounting arrangement of the relay shall be so designed that the entire weight of the relay will be suspended and the stability of its mounting will be provided by an auxiliary mounting means other than the electrical terminals of a socket (se
47、e 3.1). Plug-in pin terminals shall provide the operational, environmental, and interface characteristics to provide a reliable interconnect to gold-plated contacts. One system for gold plating that may be used is ASTM B488, type 3, class 1.25, knoop hardness 130 to 240, with nickel underplate 50 to
48、 150 microinches thick. The gold plating system shall enable the product to meet the performance requirements of this specification and shall be approved by the qualifying activity Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-28776E 6 3.5.
49、7.4 Solder dip (retinning) leads. The manufacturer may solder dip/retin the leads of product supplied to this specification provided the solder dip process has been approved by the qualifying activity. 3.5.7.4.1 Qualifying activity approval. Approval of the solder dip process will be based on one of the following options (Note: Solder dip of gold-plated plug-in leads is not allowed.) All vi
