1、METRIC The document and process conversion measures necessary to comply with this amendment shall be completed by 11 March 2013. MILPRF31032/6A 11 December 2012 SUPERSEDING MILPRF31032/6 11 March 2008 PERFORMANCE SPECIFICATION SHEET PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC
2、 RESIN BASE MATERIAL, WITH OR WITHOUT PLATEDTHROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS This specification is approved for use by all Departments and Agencies of the Department of Defense. The requirements for acquiring the product described herein shall consist of this specification sheet and MI
3、L-PRF-31032. 1. SCOPE 1.1 Scope. This specification covers the generic performance requirements for single and double sided (one or two conductor layers) printed wiring boards (hereafter designated printed board) with or without plated holes, constructed of thermoplastic base materials, that will us
4、e soldering for component/part mounting (see 6.1). The printed board may contain an external heat sink. 1.2 Classification. Printed boards covered by this specification sheet are classified by the following types and compositions, as specified (see 3.1). 1.2.1 Printed board type. Printed boards cove
5、red by this specification sheet are classified by the following types: Type 1 Rigid single sided. Type 2 Rigid double sided. 1.2.2 Composition. The composition designation is defined by the resin system of the dielectric base material (see 6.5) as follows: H Homogenous base material printed boards.
6、Printed board of this composition contain only thermoplastic resin base materials (see 6.5.1). B Metal backed printed boards. Printed boards of this composition contain a heavy layer of metal as specified (see 6.5.2). Comments, suggestions, or questions on this document should be addressed to: DLA L
7、and and Maritime, ATTN: VAC, P. O. Box 3990, Columbus, OH 432183990 or emailed to 5998.Documentsdla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at https:/assist.dla.mil. AMSC N/A FSC 5998Provided by IHSNo
8、t for ResaleNo reproduction or networking permitted without license from IHS-,-,-MILPRF31032/6A 2 1.2.3 Wrap plating (surface and knee continuous copper plating). The wrap plating grade designation is defined by the amount of plated-through hole surface and knee continuous copper plating thickness r
9、emaining after surface processing. The grades are as follows: A Printed boards of this grade have 80 percent or more of the specified wrap plating thickness after surface processing. B Printed boards of this grade have 50 percent or more of the specified wrap plating thickness after surface processi
10、ng. C Printed boards of this grade have 20 percent or more of the specified wrap plating thickness after surface processing. Unless otherwise specified, the default grade of wrap copper plating is grade A. 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sec
11、tions 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they mus
12、t meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the exte
13、nt specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MILPRF31032 Printed Circuit Board/Printed Wiring Board, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 Electron
14、ic and Electrical Component Parts. MIL-STD-883 Microcircuits. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch or https:/assist.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 191115094.) 2.2.2 Other Gover
15、nment documents, drawings, and publications. The following other Government documents, drawings, and publications form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. NATIONAL AERONAUTI
16、CS AND SPACE ADMINISTRATION (NASA) NASA 1124 Outgassing Data for Selecting Spacecraft Materials. (Hard copies of this document are no longer available from the NASA Goddard Materials Branch or the Document Automation and Production Service Detachment Office (DAPS). This information is only available
17、 at http:/outgassing.nasa.gov. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MILPRF31032/6A 3 2.3 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issu
18、es of the documents are those cited in the solicitation or contract. ASTM INTERNATIONAL (ASTM) ASTM B567 Standard Test Method for Measurement of Coating Thickness by the Beta Backscatter Method. ASTM B568 Standard Test Method for Measurement of Coating Thickness by XRay Spectrometry. ASTM D3165 Stan
19、dard Test Method for Strength Properties of Adhesives in Shear by Tension Loading of SingleLapJoint Laminated Assemblies. ASTM E53 Standard Test Method for Determination of Copper in Unalloyed Copper by Gravimetry. ASTM E345 Standard Test Methods of Tension Testing of Metallic Foil. ASTM E595 Standa
20、rd Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment. (Application for copies should be addressed to the ASTM International, 100 Barr Harbor Drive, P. O. Box C700, West Conshohocken, PA 194282959 or http:/www.astm.org.) JEDEC SOLID S
21、TATE TECHNOLOGY ASSOCIATION (JEDEC) JESD22A102 Accelerated Moisture Resistance Unbiased Autoclave. (Application for copies should be addressed to JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240S, Arlington, VA 22201 or http:/www.jedec.org.) IPC ASSOCIATION CONNECTING ELEC
22、TRONICS INDUSTRIES (IPC) IPCT50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits. IPCA600 Acceptability of Printed Boards. IPCOI645 Standard for Visual Optical Inspection Aids. IPCTM650 Test Methods Manual. IPCCC830 Qualification and Performance of Electrical Insulating Co
23、mpound for Printed Wiring Assemblies. IPC2141 Design Guide for HighSpeed Controlled Impedance Circuit Boards. IPC2221 Generic Standard on Printed Board Design. IPC2251 Design Guide for the Packaging of High Speed Electronic Circuits. IPC2252 Design and Manufacturing Guide for RF/Microwave Circuit Bo
24、ards. IPC9252 Requirements for Electrical Testing of Unpopulated Printed Boards. JSTD003 Solderability Tests for Printed Boards. (Application for copies should be addressed to the IPC Association Connecting Electronics Industry, 3000 Lakeside Drive, Suite 309 S, Bannockburn, IL 600151249 or http:/ww
25、w.ipc.org.) (Non-Government standards and other publications are normally available from the organizations that prepare or distribute the documents. These documents also may be available in or through libraries or other informational services.) 2.4 Order of precedence. Unless otherwise noted herein
26、or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. Provided by IHSNo
27、t for ResaleNo reproduction or networking permitted without license from IHS-,-,-MILPRF31032/6A 4 3. REQUIREMENTS 3.1 Printed board detail requirements. Printed boards delivered under this specification sheet shall be in accordance with the requirements as specified herein, and documented in the pri
28、nted board procurement documentation. Only printed wiring boards which are verified and meet all the applicable performance requirements contained herein and the design, construction, and material requirements of the printed board procurement documentation shall be certified as compliant and deliver
29、ed. 3.1.1 Conflicting requirements. The order of precedence of conflicting requirements shall be in accordance with MILPRF31032. 3.1.2 Reference to printed board procurement documentation. For the purposes of this specification sheet, when the term “specified“ is used without additional reference to
30、 a specific location or document, the intended reference shall be to the applicable printed board procurement documentation. 3.1.3 Terms and definitions. The definitions for all terms used herein shall be as specified in IPCT50 and those contained herein. 3.2 Qualification. Printed boards furnished
31、under this specification sheet shall be technologies that are manufactured by a manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract award (see 4.2 and 6.3). 3.3 Design (see 3.1 and 6.2). Printed boards shall be of the design s
32、pecified. Unless otherwise noted herein, if individual design parameters are not specified in the printed board procurement documentation, then the baseline design parameters shall be as specified in IPC2221, IPC2141, IPC2251, and IPC2252, performance class 3. Test coupons shall be as specified in t
33、he applicable design standard and shall reflect worstcase design conditions of the printed boards that they represent. 3.3.1 Conductors. This specification sheet differentiates between low frequency conductors, ground planes, and voltage planes and those conductors used for high frequency signals. T
34、he terms “signal conductor“, “signal line“, and “signal plane“ are used within this specification sheet to distinguish those conductive patterns from noncritical low frequency conductors, ground planes, and voltage planes. 3.3.2 Criticalcontrolled conductors and spacings. Unless otherwise specified,
35、 when necessary for proper verification of criticalcontrolled widths or criticalcontrolled spacings, signal conductors or the spacing between them deemed critical shall be identified as such. The terms “criticalcontrolled signal conductor“, “criticalcontrolled signal line“ and “criticalcontrolled sp
36、acing“ are used herein when addressing these type of conductive pattern features. 3.4 Printed board materials. All materials used in the construction of compliant printed boards shall comply with the applicable specifications referenced in the printed board procurement documentation. If materials us
37、ed in the production of printed boards are not specified, then it is the manufacturers responsibility to use materials which will meet the performance requirements of this specification sheet. Acceptance or approval of any printed board material shall not be construed as a guarantee of the acceptanc
38、e of the completed printed board. 3.4.1 Prohibited materials (see 6.6). Unless otherwise specified, electroplated or immersion tin and electroplated silver shall not be used as a finish either externally, internally, or as an undercoat. Electroplated or immersion tin is any tin or tin alloy containi
39、ng more than 97 percent tin. Tin shall be alloyed with a minimum of three percent lead. The use of tinlead (SnPb) finishes is acceptable provided that the minimum lead content is three percent. Acceptance or approval of any constituent material shall not be construed as a guaranty of the acceptance
40、of the finished product. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MILPRF31032/6A 5 3.5 External visual and dimensional requirements. Printed board test specimens (the finished printed boards or supporting test coupons, as applicable) shall con
41、form to the requirements specified in 3.5.1 through 3.5.5.2. After solder mask application, the printed board test specimens shall also conform to the requirements of 3.5.4. Scratches, dents, and tool marks shall not bridge or expose signal conductors, expose base metal, expose or disrupt reinforcem
42、ent fibers, reduce dielectric properties, and reduce spacing below the minimum requirements specified herein. The figures, illustrations, and photographs contained in IPCA600 can aid in the visualization of externally observable accept/reject conditions of test specimens. 3.5.1 Base material. 3.5.1.
43、1 Edges of base material. Base material edges include the external edge of the printed board, the edges of cutouts, and the edges of nonplatedthrough holes. Burrs, chips, delaminations, haloing, nicks, and other penetrations along the base material edges of completed printed boards shall be acceptab
44、le provided the imperfection does not reduce the edge spacing specified by more than 50 percent. If no edge spacing requirement is specified, the imperfection penetration shall not exceed 2.5 mm (.0984 inch). Loose metallic burrs shall not be acceptable. Base material edges include the external edge
45、 of the printed board, the edges of cutouts, and the edges of nonplatedthrough holes. 3.5.1.2 Surface imperfections. Imperfections in the surface of the base material such as blistering, burrs, cuts, dents, exposed reinforcement material fibers, foreign materials, gouges, nicks, pits, resin scorched
46、 areas, resin starved areas, scratches, tool marks, variations in color such as white spots or black spots, or other visual defects detrimental to the performance of the base material shall be acceptable in localized concentrations providing the following conditions are met: a. The imperfection does
47、 not bridge conductors. b. The dielectric spacing between the imperfection and a conductor is not reduced below the specified minimum conductor spacing requirements. c. Localized concentration of these imperfections are no closer than 6.5 mm (.26 inch) to any conductor. 3.5.1.2.1 Exposed or disrupte
48、d fibers. Exposed or disrupted reinforcement fibers shall not bridge conductors and shall not reduce the conductor spacing below the minimum conductor spacing requirements. Unless otherwise specified, weave texture (reinforcement texture) or weave exposure (exposed reinforcement material fibers) by
49、mechanical fabrication operations shall be acceptable provided that they do not violate the minimum conductor spacing requirements. 3.5.1.2.2 Surface pits and voids. Surface pits and voids in the base material shall be acceptable providing the following conditions are met: a. Surface voids are no bigger than 0.8 mm (.031 inch) in the longes
