1、INCH-POUND MIL-PRF-31033B 29 April 2011 SUPERSEDING MIL-PRF-31033A 3 November 2003 PERFORMANCE SPECIFICATION CAPACITORS, FIXED, CERAMIC DIELECTRIC, HIGH RELIABILITY, DISCOIDAL, GENERAL SPECIFICATION FOR This specification is approved for use by all Departments and Agencies of the Department of Defen
2、se. 1. SCOPE 1.1 Scope. This specification covers the requirements for high reliability, discoidal, ceramic dielectric, fixed capacitors. This specification provides for two levels of product requirements: Class B and class S. Capacitors furnished to the requirements of this specification are intend
3、ed for use in Radio Frequency/Electromagnetic Interference (RFI/EMI) suppression filters covered by MIL-PRF-28861. 1.2 Classification. Discoidal capacitors are classified into one of the following reliability levels as specified. 1.2.1 Product level. Two product levels of discoidal capacitors are pr
4、ovided for in this specification. The product level is identified by a single letter in accordance with table I: TABLE I. Product level. Symbol Level B S Class B Class S a. Class B - Class B is the base product level of this specification and is intended for all applications except for space applica
5、tions. Class B discoidal capacitors are those which have been subjected to and passed all applicable requirements, tests, and inspections detailed herein, including in-process inspection and conformance inspection requirements for Class B. b. Class S - Class S is the highest product level of this sp
6、ecification and is intended for space applications. Class S discoidal capacitors are those which have been subjected to and passed all applicable requirements, tests, and inspections detailed herein, including in-process inspection and conformance inspection requirements for Class S. AMSC N/A FSC 59
7、10 Comments, suggestions, or questions on this document should be addressed to: DLA Land and Maritime ATTN: VAT, Post Office Box 3990, Columbus, OH 43218-3990 or e-mailed to capacitorfilterdla.mil. Since contact information can change, you may want to verify the currency of this address information
8、using the ASSIST Online database at https:/assist.daps.dla.mil. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-31033B 2 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this speci
9、fication. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requireme
10、nts of the documents cited in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications. standards. and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless o
11、therwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-28861 - Filters and Capacitors, Radio Frequency/Electromagnetic Interference Suppression, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD
12、-202 - Test Method Standard Electronic and Electrical Component Parts. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Non-Government publicat
13、ions. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents are those cited in the solicitation or contract. ELECTRONIC COMPONENTS ASSOCIATION (ECA) EIA/ECA-469 - Standard Test Method for Destructive Physical Anal
14、ysis (DPA) of High Reliability Ceramic Monolithic Capacitors. (Copies of these documents are available from http:/ or Global Engineering Documents, Attn: Customer Service Department, 15 Inverness Way East, Englewood CO 80112-5776.) THE INSTITUTE FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
15、INC. (IPC) J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications. (Copies of these documents can be ordered online at www.ipc.org or from the Institute for Interconnecting and Packaging Electronic Circuits (IPC, INC.
16、), 2215 Sanders Road, Suite 200 South, Northbrook, IL 60062.) 2.4 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document,
17、 however, supersedes applicable laws and regulations unless a specific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-31033B 3 3. REQUIREMENTS 3.1 Product levels. Two product levels of capacitors are provided for
18、 in this specification, class S and class B. Class S is the highest product level of this specification and is intended for space applications. 3.2 Materials. The materials shall be as specified herein. However, when a definite material is not specified, a material shall be used which will enable th
19、e discoidal capacitors to meet the performance requirements of this specification. Acceptance or approval of any constituent material shall not be classified as a guaranty of the acceptance of the finished product. 3.3 Documentation of individual discoidal capacitors. Manufacturers of filters built
20、in accordance with MIL-PRF-28861 shall specify the requirements of individual discoidal capacitors that shall include, but is not limited to, the following types of performance requirements: a. Physical dimensions and terminations (see 3.6). b. Dielectric constant (see 3.4). c. Minimum dielectric th
21、ickness (see 3.4.1). d. Electrical characteristics: (1) Voltage rating (see 3.4.1). (2) Capacitance and tolerance (see 3.8). (3) Dissipation factor (see 3.9). (4) Insulation resistance (see 3.11). (5) Voltage-temperature limits (see 3.18). 3.4 Dielectric parameters. Capacitors supplied to this speci
22、fication shall meet voltage temperature requirements of 3.18. 3.4.1 Dielectric thickness. Capacitors supplied to this specification shall have a minimum dielectric thickness of 8 mil (0.020 mm) for capacitors with ratings of 50 volts and below or 1.0 mil (0.025 mm) for capacitors with ratings above
23、50 volts. Dielectric thickness is the actual measured thickness of the fired ceramic dielectric layer. Voids, or the cumulative effect of voids, shall not reduce the total dielectric thickness by more than 50 percent. 3.5 Electrode parameters. Nickel or copper electrodes shall not be used in capacit
24、ors supplied to this specification. 3.6 Physical dimensions and terminations. The discoidal capacitor dimensions and terminations shall meet the requirements specified by the acquiring activity (see 3.3). 3.7 Pure tin. The use of pure tin as a final finish or as an underplate is prohibited both inte
25、rnally and externally. Tin content of capacitor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.4). 3.8 Capacitance. The individual item requirements as measured by 4.7.4 shall be as specified by the acquiring activity
26、 (see 3.3). 3.9 Dissipation factor. When determined as specified in 4.7.5, the dissipation factor shall not exceed 2.5 percent for BX and BR, and 0.15 percent for BP. 3.10 Dielectric withstanding voltage. Capacitors shall withstand the direct current (dc) potential specified in 4.7.6 without damage
27、or breakdown. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-31033B 4 3.11 Insulation resistance. When measured as specified in 4.7.7, the insulation resistance shall not be less than the value specified: At 25C: 100,000 megohms or 1,000 meg
28、ohm-microfarads, whichever is less. At 125C: 10,000 megohms or 100 megohm-microfarads, whichever is less. 3.12 Destructive physical analysis. When examined as specified in 4.7.8, capacitors shall meet the requirements of EIA/ECA-469. 3.13 Nondestructive internal examination (Class S only). All capac
29、itors shall be subjected to ultrasonic examination or some other method of nondestructive internal examination as determined by the manufacturer and approved by the acquiring activity. When capacitors are examined as specified in 4.7.1, there shall be no devices delivered that show unacceptable resp
30、onses as defined in EIA/ECA-469. 3.14 Visual examination. When examined as specified in 4.7.2, capacitors shall meet the visual requirements specified in appendix A. 3.15 Thermal shock and voltage conditioning. When tested as specified in 4.7.3, capacitors shall withstand the extremes of high and lo
31、w temperature without visible damage and meet the following requirements within the percent defective allowed as specified in 4.6.3: a. Dielectric withstanding voltage (at 25C): As specified in 3.10. b. Insulation resistance (at 25C): Shall not be less than the initial requirement (see 3.3 and 3.11)
32、. c. Insulation resistance (at 125C): Shall not be less than the initial requirement (see 3.3 and 3.11). d. Dissipation factor: Shall not exceed the value specified (see 3.3 and 3.9). e. Capacitance (at 25C): Shall be within the tolerance specified (see 3.3 and 3.8). Capacitance values no more than
33、5 percent or .5 picofarad (pF), whichever is greater, beyond the specified tolerance limit shall be removed from the lot but shall not be considered defective for determination of the percent defective allowed. 3.16 Solderability. When capacitors are tested as specified in 4.7.9 the immersed metalli
34、zed surface shall be at least 90 percent covered with a new, smooth, solder coating. The remaining 10 percent may contain only small pinholes or rough spots; these shall not be concentrated in one area. Bare metal where the solder immersion failed to cover the original coating is an indication of po
35、or solderability and shall be cause for failure. In case of dispute, the percent of coverage with pinholes or rough spots shall be determined by actual measurement of these areas, as compared to the total area. 3.17 Resistance to soldering heat. When tested as specified in 4.7.10, capacitors shall m
36、eet the following: a. Insulation resistance at 25C: Not less than the initial 25C requirement (see 3.11). b. Capacitance: Shall not change more than -1.0 percent to +6.0 percent from the initial measured value. c. Dissipation factor: Shall not exceed the initial limits (see 3.9). 3.18 Voltage-temper
37、ature limits. When tested as specified in 4.7.11, the capacitance change over the specified temperature range shall not exceed the limits specified in table II. The capacitance value obtained in table VIII, step C shall be considered as the reference point. Provided by IHSNot for ResaleNo reproducti
38、on or networking permitted without license from IHS-,-,-MIL-PRF-31033B 5 TABLE II. Capacitance change with reference to +25C. Characteristic Steps A through D of table VIII Bias = 0 volts Steps E through G of table VIII Bias = rated voltage BP 0 30 ppm/C 0 30 ppm/C BR 15 percent +15, -40 percent BX
39、15 percent +15, -25 percent 3.19 Humidity, steady state, low voltage. When tested as specified in 4.7.12, capacitors shall meet the following requirements: a. Visual examination: No mechanical damage. b. Dielectric withstanding voltage: As specified in 3.10. c. Insulation resistance: Not less than 5
40、0 percent of the initial 25C requirement specified in 3.11. d. Capacitance: Shall not change more than 10 percent from the initial measured value. 3.20 Life (at elevated ambient temperature). When tested as specified in 4.7.13, capacitors shall meet the following requirements: 1,000 hour limits: a.
41、Insulation resistance: (at 125C): Shall be not less than the initial requirement (see 3.11). b. Visual examination: No mechanical damage. c. Insulation resistance (at 25C): Shall be not less than the initial requirement (see 3.11). d. Capacitance: Shall not change more than 20 percent from the initi
42、al measured value. e. Dissipation factor: Shall not exceed 2.5 percent for BR or BX characteristics, or 0.15 percent for BP characteristics. 3.21 Dielectric voltage breakdown. When tested as specified in 4.7.14, no failure shall occur. A failure is defined as a steady state current above 1 milliampe
43、re (mA). 3.22 Workmanship. Discoidal capacitors shall be processed in such a manner as to be uniform in quality and shall meet the requirements of 3.2, 3.3, 3.4, 3.5 and all performance requirements. The discoidal capacitors shall pass the visual inspection criteria as specified in 4.7.2 and shall b
44、e free of other defects that will affect life, serviceability, or appearance. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-31033B 6 4. VERIFICATION 4.1 Classification of inspection. The inspection requirements specified herein are classifi
45、ed as follows: a. In-process inspection (see 4.3). b. Group A conformance inspection (see 4.5). c. Group B inspection (see 4.6). 4.2 Inspection conditions and reference measurements. 4.2.1 Conditions. Unless otherwise specified herein, all inspections shall be performed in accordance with the test c
46、onditions specified in the “GENERAL REQUIREMENTS“ of MIL-STD-202 except relative humidity shall not exceed 75 percent. Accuracy of all test voltage measurements shall be within 2.0 percent of the specified voltage. 4.2.2 Reference measurements. When requirements are based on comparative measurements
47、 made before and after conditioning, the reference measurement shall be considered the last measurement made at 25C 3C prior to conditioning. Unless reference measurements have been made within 30 days prior to the beginning of conditioning, they shall be repeated. 4.2.3 Power supply. The power supp
48、ly used for life testing shall have a regulation of 2 percent or less of the specified test voltage. 4.3 In-process inspection. 4.3.1 In-process inspection. Each production lot of parts shall be inspected in accordance with table IV. The nondestructive internal examination shall be for Class S only.
49、 Other screening examinations may be applied at the option of the manufacturer as approved by the acquiring activity. 4.3.1.1 Failure of parts/lots. Parts that fail the 100 percent screens are considered rejects and shall not be considered as conforming products. Lots which fail the dielectric voltage breakdown test may be rescreened, defects removed, and the lot resubmitted to the dielectric voltage bre
